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"tsao l c"的相关文件
显示项目 56-65 / 81 (共9页)
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| 國立臺灣大學 |
2007 |
Design and fabrication of an artificial skin using PI-copper films
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Cheng, Ming-Yuan; Chang, Wan-Yi; Tsao, L.-C.; Yang, S.-A.; Yang, Yao-Joe Joseph; Shih, Wen-Pin; Chang, Fu-Yu; Chang, Shuo-Hung; Fan, Kuang-Chao |
| 臺大學術典藏 |
2007 |
Flexible temperature sensor array using electro-resistive pouymer for humanoid artificial skin
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YAO-JOE YANG; Chang, S.-H.; Fan, K.-C.; Chang, F.-Y.; Yang, Y.-J.; Shih, W.-P.; Chen, L-L.; Tsao, L.-C.; Cheng, M.-Y. |
| 國立臺灣大學 |
2006 |
Active Soldering of ITO to Copper
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Chang, S. Y.; Lu, M. H.; Tsao, L. C.; Chuang, T. H. |
| 國立臺灣大學 |
2006 |
Characterization of pressure sensitive rubber for artificial skin of robotics
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Cheng, C.-H.; Chang, F.-Y.; Tsao, L.-C.; Shih, W.-P.; Chang, S.-H.; Fan, K.-C. |
| 國立臺灣大學 |
2006 |
Integrated temperature and tactile sensing arrays on a flexible substrate
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Cheng, M.-Y.; Chang, W.-Y.; Tsao, L.-C.; Yang, S.-A.; Yang, Y.-J.; Shih, W.-P.; Chang, F.-Y.; Fan, K.-C. |
| 國立臺灣大學 |
2003 |
Morphology and kinetics of discontinuous precipitation and dissolution in an Fe-8.5Al-27Mn-1.0Si-0.92C alloy
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Chang, S. Y.; Wang, S. S.; Tsao, L. C.; Chuang, T. H. |
| 國立臺灣大學 |
2003 |
Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages
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Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M. |
| 國立臺灣大學 |
2003 |
Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler
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Chang, S. Y.; Tsao, L. C.; Chiang, M. J.; Chuang, T. H.; Tung, C. N.; Pan, G. H. |
| 臺大學術典藏 |
2003 |
Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler
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Tung, C.N.; Pan, G.H.; Chuang, T.H.; TUNG-HAN CHUANG; Chiang, M.J.; Tsao, L.C.; Chang, S.Y. |
| 國立臺灣大學 |
2002 |
Effects of zinc additions on the microstructure and melting temperatures of Al–Si–Cu filler metals
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Tsao, L. C.; Chiang, M. J.; Lin, W. H.; Cheng, M. D.; Chuang, T. H. |
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