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"tsao l c"的相关文件
显示项目 61-70 / 81 (共9页)
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| 國立臺灣大學 |
2003 |
Morphology and kinetics of discontinuous precipitation and dissolution in an Fe-8.5Al-27Mn-1.0Si-0.92C alloy
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Chang, S. Y.; Wang, S. S.; Tsao, L. C.; Chuang, T. H. |
| 國立臺灣大學 |
2003 |
Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages
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Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M. |
| 國立臺灣大學 |
2003 |
Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler
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Chang, S. Y.; Tsao, L. C.; Chiang, M. J.; Chuang, T. H.; Tung, C. N.; Pan, G. H. |
| 臺大學術典藏 |
2003 |
Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler
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Tung, C.N.; Pan, G.H.; Chuang, T.H.; TUNG-HAN CHUANG; Chiang, M.J.; Tsao, L.C.; Chang, S.Y. |
| 國立臺灣大學 |
2002 |
Effects of zinc additions on the microstructure and melting temperatures of Al–Si–Cu filler metals
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Tsao, L. C.; Chiang, M. J.; Lin, W. H.; Cheng, M. D.; Chuang, T. H. |
| 國立臺灣大學 |
2002 |
Evaluation of the Formability of Plastic/Zn22AI/Plastic Sandwiched Structures by Gas Blowing
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Tsao, L. C.; Su, T. L.; Chuang, T. H. |
| 國立臺灣大學 |
2002 |
Corrosion behaviors of Al-Si-Cu-based filler metals and 6061-T6 brazements
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Su, T. L.; Wang, S. S.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H.; Yeh, M. S. |
| 國立臺灣大學 |
2002 |
Brazeability of a 3003 Aluminum alloy with Al-Si-Cu-based filler metals
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Tsao, L. C.; Weng, W. P.; Cheng, M. D.; Tsao, C. W.; Chuang, T. H. |
| 國立臺灣大學 |
2002 |
Morphology and growth kinetics of Ag3Sn during soldering reaction between liquid Sn and an Ag substrate
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Su, T. L.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H. |
| 國立臺灣大學 |
2002 |
Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films
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Su, T. L.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H. |
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