| 臺大學術典藏 |
2022-03-22T08:30:54Z |
Effects of adding active elements to aluminum-based filler alloys on the bonding of 6061 aluminum alloy and alumina
|
Sun Y.-K;Chang S.-Y;Tsao L.-C;Chuang T.-H;Zhang G.-Z;Yeh C.-Y.; Sun Y.-K; Chang S.-Y; Tsao L.-C; Chuang T.-H; Zhang G.-Z; Yeh C.-Y.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:30:52Z |
Effects of adding active elements to aluminum-based filler alloys on the bonding of 6061 aluminum alloy and alumina
|
Sun Y.-K;Chang S.-Y;Tsao L.-C;Chuang T.-H;Zhang G.-Z;Yeh C.-Y.; Sun Y.-K; Chang S.-Y; Tsao L.-C; Chuang T.-H; Zhang G.-Z; Yeh C.-Y.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:30:52Z |
Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper
|
Tsao L.-C;Li C.-K;Sun Y.-K;Chang S.-Y;Chuang T.-H.; Tsao L.-C; Li C.-K; Sun Y.-K; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:30:51Z |
Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper
|
Tsao L.-C;Li C.-K;Sun Y.-K;Chang S.-Y;Chuang T.-H.; Tsao L.-C; Li C.-K; Sun Y.-K; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:27:52Z |
Effects of adding active elements to aluminum-based filler alloys on the bonding of 6061 aluminum alloy and alumina
|
Sun Y.-K;Chang S.-Y;Tsao L.-C;Chuang T.-H;Zhang G.-Z;Yeh C.-Y.; Sun Y.-K; Chang S.-Y; Tsao L.-C; Chuang T.-H; Zhang G.-Z; Yeh C.-Y.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:27:50Z |
Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper
|
Tsao L.-C;Li C.-K;Sun Y.-K;Chang S.-Y;Chuang T.-H.; Tsao L.-C; Li C.-K; Sun Y.-K; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-11-08T01:52:17Z |
Composite diagnostic criteria are problematic for linking potentially distinct populations: the case of frailty
|
Chao Y.-S.; Wu C.-J.; HSING-CHIEN WU; Hsu H.-T.; Tsao L.-C.; Cheng Y.-P.; Lai Y.-C.; Chen W.-C. |
| 臺大學術典藏 |
2021-11-08T01:52:17Z |
Opportunities and Challenges From Leading Trends in a Biomonitoring Project: Canadian Health Measures Survey 2007�V2017
|
Chao Y.-S.; Wu C.-J.; HSING-CHIEN WU; Hsu H.-T.; Tsao L.-C.; Cheng Y.-P.; Lai Y.-C.; Chen W.-C. |
| 臺大學術典藏 |
2021-11-08T01:52:17Z |
Simulation study to demonstrate biases created by diagnostic criteria of mental illnesses: Major depressive episodes, dysthymia, and manic episodes
|
Chao Y.-S.; Lin K.-F.; Wu C.-J.; HSING-CHIEN WU; Hsu H.-T.; Tsao L.-C.; Cheng Y.-P.; Lai Y.-C.; Chen W.-C. |
| 臺大學術典藏 |
2021-11-08T01:52:16Z |
Using syndrome mining with the Health and Retirement Study to identify the deadliest and least deadly frailty syndromes
|
Chao Y.-S.; Wu C.-J.; HSING-CHIEN WU; Hsu H.-T.; Tsao L.-C.; Cheng Y.-P.; Lai Y.-C.; Chen W.-C. |
| 臺大學術典藏 |
2020-05-12T02:53:21Z |
Effects of microstructures on corrosion and stress corrosion behaviors of an Al-12.1 at.% Zn alloy
|
Yeh, M.S.; Tsao, L.C.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:19Z |
Corrosion behaviors of Al-Si-Cu-based filler metals and 6061-T6 brazements
|
Su, T.L.; Wang, S.S.; Tsao, L.C.; Chang, S.Y.; Chuang, T.H.; Yeh, M.S.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:19Z |
Corrosion behavior of Al-Si-Cu-(Sn, Zn) brazing filler metals
|
Wang, S.S.; Cheng, M.D.; Tsao, L.C.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:19Z |
AgIn2/Ag2In transformations in an In-49Sn/Ag soldered joint under thermal aging
|
TUNG-HAN CHUANG; Tsao, L.C.; Huang, Y.T.; Chuang, T.H. |
| 臺大學術典藏 |
2020-05-12T02:53:19Z |
Brazeability of the 6061-T6 aluminum alloy with Al-Si-20Cu-based filler metals
|
Tsao, L.C.; Tsai, T.C.; Wu, C.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:17Z |
Intermetallic compounds formed during the reflow of In-49Sn solder ball-grid array packages
|
Chuang, T.H.; Chang, S.Y.; Tsao, L.C.; Weng, W.P.; Wu, H.M.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:17Z |
Evaluation of the formability of plastic/Zn22Al/plastic sandwiched structures by gas blowing
|
Tsao, L.C.; Su, T.L.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:17Z |
Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films
|
Su, T.L.; Tsao, L.C.; Chang, S.Y.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:17Z |
Morphology and growth kinetics of Ag3Sn during soldering reaction between liquid Sn and an Ag substrate
|
Su, T.L.; Tsao, L.C.; Chang, S.Y.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:17Z |
Brazeability of a 3003 aluminum alloy with Al-Si-Cu-based filler metals
|
TUNG-HAN CHUANG; Chuang, T.H.; Tsao, C.W.; Cheng, M.D.; Weng, W.P.; Tsao, L.C. |
| 臺大學術典藏 |
2020-05-12T02:53:17Z |
Effects of zinc additions on the microstructure and melting temperatures of Al-Si-Cu filler metals
|
Tsao, L.C.; Chiang, M.J.; Lin, W.H.; Cheng, M.D.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:16Z |
Morphology and kinetics of discontinuous precipitation and dissolution in an Fe-8.5Al-27Mn-1.0Si-0.92C alloy
|
Chang, S.-Y.; Wang, S.-S.; Tsao, L.-C.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:12Z |
Active soldering of ZnS-SiO2 sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce, Ga) filler metal
|
Chang, S.Y.; Chuang, T.H.; Tsao, L.C.; Yang, C.L.; Yang, Z.S.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:12Z |
Intermetallic reactions in reflowed and aged Sn-58Bi BGA packages with Au/Ni/Cu pads
|
Chi, C.C.; Tsao, L.C.; Tsao, C.W.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:10Z |
Joining 6061 aluminum alloy with Al-Si-Cu filler metals
|
Chang, S.Y.; Tsao, L.C.; Li, T.Y.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:09Z |
Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder
|
Chang, S.Y.; Jain, C.C.; Chuang, T.H.; Feng, L.P.; Tsao, L.C.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-02-26T01:36:50Z |
Self-aligned stylus with high sphericity for micro coordinate measurement
|
Tsai, Y.-C.;Chang, D.-R.;Tsao, L.-C.;Wu, M.-D.;Shih, P.-J.;Shih, W.-P.;Po-Jen Shih; Tsai, Y.-C.; Chang, D.-R.; Tsao, L.-C.; Wu, M.-D.; Shih, P.-J.; Shih, W.-P.; PO-JEN SHIH |
| 臺大學術典藏 |
2020-01-13T08:25:10Z |
An integrated flexible temperature and tactile sensing array using PI-copper films
|
YAO-JOE YANG; Fan, K.-C.; Chang, S.-H.; Chang, F.-Y.; Shih, W.-P.; Yang, S.-A.; Tsao, L.-C.; Chang, W.-Y.; Yang, Y.-J.; Cheng, M.-Y. |
| 臺大學術典藏 |
2020-01-13T08:25:06Z |
Flexible temperature sensor array based on a Graphite-Polydimethylsiloxane composite
|
Shih, W.-P.; Tsao, L.-C.; Lee, C.-W.; Cheng, M.-Y.; Chang, C.; Yang, Y.-J.; Fan, K.-C.; YAO-JOE YANG |
| 臺大學術典藏 |
2018-09-10T06:58:58Z |
Porous nylon with electro-active dopants as flexible sensors and actuators
|
Yu, S.L.;Chang, Duo-Ru;Tsao, L.C.;Shih, Wen-Pin;Chang, Pei-Zen; Yu, S.-L. and Chang, D.-R. and Tsao, L.-C. and Shih, W.-P. and Chang, P.-Z.; WEN-PIN SHIH; Yu, S.L.; Chang, Duo-Ru; Tsao, L.C.; Shih, Wen-Pin; Chang, Pei-Zen |
| 臺大學術典藏 |
2018-06-28T22:23:24Z |
Evolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging
|
ChuangTH; Chang, S.Y.; Chung, Chien-Han; Tsao, L.C.; Chuang, T.H.; Chuang, T.H.; Tsao, L.C.; Chung, Chien-Han; Chang, S.Y. |
| 臺大學術典藏 |
2018-06-28T22:11:27Z |
Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages
|
Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; ChuangTH |
| 國立成功大學 |
2013-12 |
Formation of ultrafine structure in as cast Ti7CuXSn alloys
|
Tsao, L. C.; Wu, R. W.; Wu, M. W.; Huang, C. H.; Chen, R. S. |
| 國立成功大學 |
2013-09 |
Effects of nano-Al2O3 particles on microstructure and mechanical properties of Sn3.5Ag0.5Cu composite solder ball grid array joints on Sn/Cu pads
|
Tsao, L. C.; Wu, R. W.; Cheng, Te-Hsien; Fan, Kuo-Huan; Chen, R. S. |
| 國立成功大學 |
2012-05-30 |
Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder
|
Tsao, L. C.; Huang, C. H.; Chung, C. H.; Chen, R. S. |
| 國立臺灣大學 |
2012 |
Evolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging
|
Chuang, T.H.; Tsao, L.C.; Chung, Chien-Han; Chang, S.Y. |
| 國立成功大學 |
2011-08 |
Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates
|
Wu, R. W.; Tsao, L. C.; Chang, S. Y.; Jain, C. C.; Chen, R. S. |
| 國立臺灣大學 |
2011 |
Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder
|
Chang, S.Y.; Jain, C.C.; Chuang, T.H.; Feng, L.P.; Tsao, L.C. |
| 國立臺灣大學 |
2011 |
Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder
|
Chuang, T.H.; Wu, M.W.; Chang, S.Y.; Ping, S.F.; Tsao, L.C. |
| 國立臺灣大學 |
2011 |
Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates
|
Wu, R.W.; Tsao, L.C.; Chang, S.Y.; Jain, C.C.; Chen, R.S. |
| 臺大學術典藏 |
2011 |
Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder
|
Wu, M.W.; Chang, S.Y.; Ping, S.F.; Tsao, L.C.; ChuangTH; Chuang, T.H.; Chuang, T.H.; Wu, M.W.; Chang, S.Y.; Ping, S.F.; Tsao, L.C. |
| 國立臺灣大學 |
2008-08 |
A comparison of polymer composites for development of flexible sensor array
|
Shih, W.-P.; Lee, C.-L.; Lee, C.-W.; Tsao, L.-C.; Yang, Y.-J.; Fan, K.-C. |
| 國立臺灣大學 |
2008-07 |
Fabrication and characterization od electro-active polymer for flexible tactile sensing array
|
Tsao, L.C.; Chang, D.R.; Shih, W.P.; Fan, K.C. |
| 國立臺灣科技大學 |
2008 |
An Integrated Flexible Temperature and Tactile Sensing Array using PI-copper films
|
Yang, Y.J. ; Cheng, M.Y. ; Chang, W.Y. ; Tsao, L.C. ; Yang, S.A. ; Shih, W.P. ; Chang, F.Y. ; Chang, S. H. ; Fan, K.C. |
| 國立臺灣科技大學 |
2008 |
On applying fair queuing discipline to schedule requests at access gateway for downlink differential QoS
|
Tsao, S.-C.;Lai, Y.-C.;Tsao, L.-C.;Lin, Y.-D. |
| 國立臺灣大學 |
2008 |
Active soldering of ZnS–SiO2 sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce, Ga) filler metal
|
Chang, S.Y.; Chuang, T.H.; Tsao, L.C.; Yang, C.L.; Yang, Z.S. |
| 國立臺灣大學 |
2008 |
Intermetallic Reactions in Reflowed and Aged Sn-58Bi BGA Packages with Au/Ni/Cu Pads
|
Chi, C.C.; Tsao, L.C.; Tsao, C.W.; Chuang, T.H. |
| 國立臺灣大學 |
2008 |
A comparison of polymer composites for development of flexible sensor array
|
Shih, W.-P.; Lee, C.-L.; Lee, C.-W.; Tsao, L.-C.; Yang, Y.-J.; Fan, K.-C. |
| 國立臺灣大學 |
2008 |
A comparison of polymer composites for development of flexible sensor array
|
Lee, C.-W.; Lee, C.-L.; Tsao, L.-C.; Shih, W.-P.; Fan, K.-C. |
| 國立臺灣大學 |
2008 |
Porous nylon with electro-active dopants as flexible sensors and actuators
|
Yu, S.L.; Chang, Duo-Ru; Tsao, L.C.; Shih, Wen-Pin; Chang, Pei-Zen |
