臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	2019臺灣學術機構典藏研討會
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Institution	Date	Title	Author
國立臺灣大學	2007-01	A Large Area Temperature and Tactile Sensing Array	Yang, Y.-J.; Cheng, M.-Y.; Chang, W.-Y.; Tsao, L.-C.; Yang, S.-A.; Shih, W.-P.; Chang, F.-Y.; Chang, S.-H.; Fan, K.-C.
國立臺灣大學	2007	A large area temperature and tactile sensing array	Cheng, M.-Y.; Chang, W.-Y.; Tsao, L.-C.; Yang, S.-A.; Yang, Y.-J.; Shih, W.-P.; Chang, F.-Y.; Chang, S.-H.; Fan, K.-C.
國立臺灣大學	2007	Fabrication and characterization of electro-active polymer for flexible tactile sensing array	Tsao, L.-C.; Chang, D.-R.; Shih, W.-P.; Fan, K.-C.
國立臺灣大學	2007	Flexible temperature sensor array using electro-resistive polymer for humanoid artificial skin	Tsao, L.C.; Cheng, Ming-Yuan; Chen, I.L.; Shih, Wen-Pin; Yang, Yao-Joe Joseph; Chang, Fu-Yu; Fan, Kuang-Chao; Chang, Shuo-Hung
國立臺灣大學	2007	Self-aligned stylus with high sphericity for micro coordinate measurement	Tsai, Yao-Chuan; Chang, D.R.; Tsao, L.C.; Wu, Ming-Dao; Shih, Po-Jen; Shih, Wen-Pin
國立臺灣大學	2007	Design and fabrication of an artificial skin using PI-copper films	Cheng, Ming-Yuan; Chang, Wan-Yi; Tsao, L.-C.; Yang, S.-A.; Yang, Yao-Joe Joseph; Shih, Wen-Pin; Chang, Fu-Yu; Chang, Shuo-Hung; Fan, Kuang-Chao
臺大學術典藏	2007	Flexible temperature sensor array using electro-resistive pouymer for humanoid artificial skin	YAO-JOE YANG; Chang, S.-H.; Fan, K.-C.; Chang, F.-Y.; Yang, Y.-J.; Shih, W.-P.; Chen, L-L.; Tsao, L.-C.; Cheng, M.-Y.
國立臺灣大學	2006	Active Soldering of ITO to Copper	Chang, S. Y.; Lu, M. H.; Tsao, L. C.; Chuang, T. H.
國立臺灣大學	2006	Characterization of pressure sensitive rubber for artificial skin of robotics	Cheng, C.-H.; Chang, F.-Y.; Tsao, L.-C.; Shih, W.-P.; Chang, S.-H.; Fan, K.-C.
國立臺灣大學	2006	Integrated temperature and tactile sensing arrays on a flexible substrate	Cheng, M.-Y.; Chang, W.-Y.; Tsao, L.-C.; Yang, S.-A.; Yang, Y.-J.; Shih, W.-P.; Chang, F.-Y.; Fan, K.-C.
國立臺灣大學	2003	Morphology and kinetics of discontinuous precipitation and dissolution in an Fe-8.5Al-27Mn-1.0Si-0.92C alloy	Chang, S. Y.; Wang, S. S.; Tsao, L. C.; Chuang, T. H.
國立臺灣大學	2003	Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages	Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.
國立臺灣大學	2003	Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler	Chang, S. Y.; Tsao, L. C.; Chiang, M. J.; Chuang, T. H.; Tung, C. N.; Pan, G. H.
臺大學術典藏	2003	Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler	Tung, C.N.; Pan, G.H.; Chuang, T.H.; TUNG-HAN CHUANG; Chiang, M.J.; Tsao, L.C.; Chang, S.Y.
國立臺灣大學	2002	Effects of zinc additions on the microstructure and melting temperatures of Al–Si–Cu filler metals	Tsao, L. C.; Chiang, M. J.; Lin, W. H.; Cheng, M. D.; Chuang, T. H.
國立臺灣大學	2002	Evaluation of the Formability of Plastic/Zn22AI/Plastic Sandwiched Structures by Gas Blowing	Tsao, L. C.; Su, T. L.; Chuang, T. H.
國立臺灣大學	2002	Corrosion behaviors of Al-Si-Cu-based filler metals and 6061-T6 brazements	Su, T. L.; Wang, S. S.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H.; Yeh, M. S.
國立臺灣大學	2002	Brazeability of a 3003 Aluminum alloy with Al-Si-Cu-based filler metals	Tsao, L. C.; Weng, W. P.; Cheng, M. D.; Tsao, C. W.; Chuang, T. H.
國立臺灣大學	2002	Morphology and growth kinetics of Ag3Sn during soldering reaction between liquid Sn and an Ag substrate	Su, T. L.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H.
國立臺灣大學	2002	Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films	Su, T. L.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H.
國立臺灣大學	2001	Corrosion behavior of Al–Si–Cu–(Sn, Zn) brazing filler metals	Wang, S. S.; Cheng, M. D.; Tsao, L. C.; Chuang, T. H.
國立臺灣大學	2001	AgIn2/Ag2In transformations in an In-49Sn/Ag soldered joint	Chuang, T. H.; Huang, Y. T.; Tsao, L. C.
國立臺灣大學	2001	Evaluation of Superplastic Formability of the AZ31, Magnesium Alloy	Tsao, L. C.; Wu, C. F.; Chuang, T. H.
國立臺灣大學	2001	Surface Self-Cleaning Effect of Zn-22 Alloy during Superplastic Deformation	Chuang, T. H.; Tsao, L. C.
國立臺灣大學	2001	Brazeability of the 6061-T6 Aluminum Alloy with Al-Si-20Cu Based Filler Metals	Tsao, L. C.; Tsai, T. C.; Wu, C. S.; Chuang, T. H.

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