臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
國立交通大學	2014-12-08T15:22:00Z	Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder joints	Liang, Y. C.; Tsao, W. A.; Chen, Chih; Yao, Da-Jeng; Huang, Annie T.; Lai, Yi-Shao

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