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"tseng wei tsu"的相关文件
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| 國立成功大學 |
2004-12-22 |
Thermal stability and bonding configuration of fluorine-modified low-k SiOC : H composite films
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JangJian, Shiu-Ko; Liu, Chuan-Pu; Wang, Ying-Lang; Hwang, Weng-Sing; Tseng, Wei-Tsu |
| 國立成功大學 |
2004-01-30 |
Fluorine-modified low-k a-SiOC : H composite films prepared by plasma enhanced chemical vapor deposition
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JangJean, Shiuh-Ko; Liu, Chuan-Pu; Wang, Ying-Lang; Hwang, Weng-Sing; Tseng, Wei-Tsu; Chen, Sheng-Wen; Lo, Kuang-Yao |
| 國立成功大學 |
2003-06-30 |
In situ fluorine-modified organosilicate glass prepared by plasma enhanced chemical vapor deposition
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JangJean, Shiuh-Ko; Wang, Ying-Lang; Liu, Chuan-Pu; Hwang, Weng-Sing; Tseng, Wei-Tsu; Liu, Chi-Wen |
| 國立成功大學 |
2001-05 |
Electroless deposition of Cu thin films with CuCl2-HNO3 based chemistry - I. Chemical formulation and reaction mechanisms
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Tseng, Wei-Tsu; Lo, Chia-Hsien; Lee, Chia-Hsien |
| 國立成功大學 |
2001-05 |
Electroless deposition of Cu thin films with CuCl2-HNO3 based chemistry - II. Kinetics and microstructure
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Tseng, Wei-Tsu; Lo, Chia-Hsien; Lee, Shih-Chin |
| 國立成功大學 |
2001-05 |
Novel polymeric surfactants for improving chemical mechanical polishing performance of silicon oxide
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Tseng, Wei-Tsu; Kuo, Ping-Lin; Liao, Chin-Lung; Lu, Rick; Lin, Jen-Fin |
| 國立成功大學 |
2000-07-17 |
Microstructure-related resistivity change after chemical-mechanical polish of Al and W thin films
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Tseng, Wei-Tsu; Wang, Ying-Lang; Niu, James |
| 國立成功大學 |
2000-03-15 |
Formation and characteristics of silicon nanocrystals in plasma-enhanced chemical-vapor-deposited silicon-rich oxide
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Lin, Chi-Fa; Tseng, Wei-Tsu; Feng, Ming Shiann |
| 國立成功大學 |
1999-06-22 |
A ULSI shallow trench isolation process through the integration of multilayered dielectric process and chemical-mechanical planarization
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Lin, C. F.; Tseng, Wei-Tsu; Feng, M. S.; Wang, Y. L. |
| 國立成功大學 |
1999-05 |
A comparative study on the roles of velocity in the material removal rate during chemical mechanical polishing
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Tseng, Wei-Tsu; Chin, Jyh-Hwa; Kang, Lee-Chieh |
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