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"tseng wt"的相关文件
显示项目 31-40 / 41 (共5页)
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| 國立交通大學 |
2014-12-08T15:02:52Z |
Modeling of the wear mechanism during chemical-mechanical polishing
|
Liu, CW; Dai, BT; Tseng, WT; Yeh, CF |
| 國立交通大學 |
2014-12-08T15:02:11Z |
Effects of mechanical characteristics on the chemical-mechanical polishing of dielectric thin films
|
Tseng, WT; Liu, CW; Dai, BT; Yeh, CF |
| 國立交通大學 |
2014-12-08T15:02:02Z |
Re-examination of pressure and speed dependences of removal rate during chemical-mechanical polishing processes
|
Tseng, WT; Wang, YL |
| 國立交通大學 |
2014-12-08T15:02:01Z |
CMP of fluorinated silicon dioxide: Is it necessary and feasible?
|
Tseng, WT; Hsieh, YT; Lin, CF |
| 國立交通大學 |
2014-12-08T15:01:58Z |
Chemical-mechanical polishing and material characteristics of plasma-enhanced chemically vapor deposited fluorinated oxide thin films
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Tseng, WT; Hsieh, YT; Lin, CF; Tsai, MS; Feng, MS |
| 國立交通大學 |
2014-12-08T15:01:30Z |
Integration of modified plasma-enhanced chemical vapor deposited tetraethoxysilane intermetal dielectric and chemical-mechanical polishing processes for 0.35 mu m IC device reliability improvement
|
Wang, YL; Tseng, WT; Feng, MS |
| 國立交通大學 |
2014-12-08T15:01:23Z |
Effects of corrosion environments on the surface finishing of copper chemical mechanical polishing
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Wang, MT; Tsai, MS; Liu, C; Tseng, WT; Chang, TC; Chen, LJ; Cheng, MC |
| 國立交通大學 |
2014-12-08T15:01:23Z |
Chemical-mechanical polishing of low-dielectric-constant spin-on-glasses: film chemistries, slurry formulation and polish selectivity
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Wang, YL; Liu, C; Chang, ST; Tsai, MS; Feng, MS; Tseng, WT |
| 國立交通大學 |
2014-12-08T15:01:23Z |
Chemical mechanical polishing for selective CVD-W
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Wang, MT; Yeh, WK; Tsai, MS; Tseng, WT; Chang, TC; Chen, LJ; Chen, MC |
| 國立交通大學 |
2014-12-08T15:01:09Z |
The exothermic reaction and temperature measurement for tungsten CMP technology and its application on endpoint detection
|
Wang, YL; Liu, C; Feng, MS; Tseng, WT |
显示项目 31-40 / 41 (共5页)
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