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"tsui by"的相关文件
显示项目 21-30 / 54 (共6页) << < 1 2 3 4 5 6 > >> 每页显示[10|25|50]项目
| 國立交通大學 |
2014-12-08T15:37:09Z |
Electrical stability and reliability of ultralow dielectric constant porous carbon-doped oxide film for copper interconnect
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Fang, KL; Tsui, BY |
| 國立交通大學 |
2014-12-08T15:36:22Z |
Electrical characteristics of thin HfO(2) gate dielectrics prepared using different pre-deposition surface treatments
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Chen, CW; Chien, CH; Perng, TH; Yang, MJ; Liang, JS; Lehnen, P; Tsui, BY; Chang, CY |
| 國立交通大學 |
2014-12-08T15:27:01Z |
Electrical reliability issues of integrating low-K dielectrics with Cu metallization
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Wu, ZC; Shiung, ZW; Wang, CC; Fang, KL; Wu, RG; Liu, YL; Tsui, BY; Chen, MC; Chang, W; Chou, PF; Jang, SM; Yu, CH; Liang, MS |
| 國立交通大學 |
2014-12-08T15:26:46Z |
Electrical reliability of low dielectric constant diffusion barrier (a-SiC : H) for copper interconnect
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Fang, KL; Tsui, BY; Yang, CC; Lee, SD |
| 國立交通大學 |
2014-12-08T15:26:35Z |
Electrical and material stability of Orion(TM) CVD ultra low-k dielectric film for copper interconnection
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Fang, KL; Tsui, BY; Yang, CC; Chen, MC; Lee, SD; Beekmann, K; Tony, W; Giles, K; Ishaq, S |
| 國立交通大學 |
2014-12-08T15:26:21Z |
Anisotropic thermal conductivity of nano-porous silica film
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Tsui, BY; Yang, CC; Fang, KL |
| 國立交通大學 |
2014-12-08T15:26:19Z |
A novel wafer reclaim method for silicon carbide film
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Tsui, BY; Fang, KL; Wu, CH; Li, YH |
| 國立交通大學 |
2014-12-08T15:25:51Z |
A novel fully self-aligned process for high cell density trench gate power MOSFETs
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Tsui, BY; Gan, TC; Wu, MD; Chou, HH; Wu, ZL; Sune, CT |
| 國立交通大學 |
2014-12-08T15:25:51Z |
Trench gate power MOSFETs with retrograde body profile
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Tsui, BY; Wu, MD; Gan, TC; Chou, HH; Wu, ZL; Sune, CT |
| 國立交通大學 |
2014-12-08T15:25:45Z |
High thermal stability metal gate with tunable work function
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Huang, CF; Tsui, BY |
显示项目 21-30 / 54 (共6页) << < 1 2 3 4 5 6 > >> 每页显示[10|25|50]项目
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