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Showing items 11-20 of 54 (6 Page(s) Totally)
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| 國立交通大學 |
2014-12-08T15:40:58Z |
Process sensitivity and robustness analysis of via-first dual-damascene process
|
Tsui, BY; Chen, CW; Huang, SM; Lin, SS |
| 國立交通大學 |
2014-12-08T15:40:53Z |
Metal drift induced electrical instability of porous low dielectric constant film
|
Fang, KL; Tsui, BY |
| 國立交通大學 |
2014-12-08T15:40:45Z |
Formation of interfacial layer during reactive sputtering of hafnium oxide
|
Tsui, BY; Chang, HW |
| 國立交通大學 |
2014-12-08T15:40:42Z |
Stability investigation of single-wafer process by using a spin etcher
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Kang, TK; Wang, CC; Tsui, BY; Yang, WL; Chien, FT; Yang, SY; Chang, CY; Li, YH |
| 國立交通大學 |
2014-12-08T15:40:41Z |
Via-filling capability of copper film by CVD
|
Lin, CL; Chen, PS; Lin, YC; Tsui, BY; Chen, MC |
| 國立交通大學 |
2014-12-08T15:39:47Z |
Anisotropic thermal conductivity of nanoporous silica film
|
Tsui, BY; Yang, CC; Fang, KL |
| 國立交通大學 |
2014-12-08T15:39:16Z |
Simulation study of carbon nanotube field emission display with under-gate and planar-gate structures
|
Lan, YC; Lee, CT; Hu, Y; Chen, SH; Lee, CC; Tsui, BY; Lin, TL |
| 國立交通大學 |
2014-12-08T15:39:05Z |
A novel 25-nm modified Schottky-barrier FinFET with high performance
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Tsui, BY; Lin, CP |
| 國立交通大學 |
2014-12-08T15:38:30Z |
A comprehensive study on the FIBL of nanoscale MOSFETs
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Tsui, BY; Chin, LF |
| 國立交通大學 |
2014-12-08T15:37:09Z |
Optimization of back side cleaning process to eliminate copper contamination
|
Chou, WY; Tsui, BY; Kuo, CW; Kang, TK |
Showing items 11-20 of 54 (6 Page(s) Totally)
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