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"tsui by"的相关文件
显示项目 16-25 / 54 (共6页)
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| 國立交通大學 |
2014-12-08T15:39:47Z |
Anisotropic thermal conductivity of nanoporous silica film
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Tsui, BY; Yang, CC; Fang, KL |
| 國立交通大學 |
2014-12-08T15:39:16Z |
Simulation study of carbon nanotube field emission display with under-gate and planar-gate structures
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Lan, YC; Lee, CT; Hu, Y; Chen, SH; Lee, CC; Tsui, BY; Lin, TL |
| 國立交通大學 |
2014-12-08T15:39:05Z |
A novel 25-nm modified Schottky-barrier FinFET with high performance
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Tsui, BY; Lin, CP |
| 國立交通大學 |
2014-12-08T15:38:30Z |
A comprehensive study on the FIBL of nanoscale MOSFETs
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Tsui, BY; Chin, LF |
| 國立交通大學 |
2014-12-08T15:37:09Z |
Optimization of back side cleaning process to eliminate copper contamination
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Chou, WY; Tsui, BY; Kuo, CW; Kang, TK |
| 國立交通大學 |
2014-12-08T15:37:09Z |
Electrical stability and reliability of ultralow dielectric constant porous carbon-doped oxide film for copper interconnect
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Fang, KL; Tsui, BY |
| 國立交通大學 |
2014-12-08T15:36:22Z |
Electrical characteristics of thin HfO(2) gate dielectrics prepared using different pre-deposition surface treatments
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Chen, CW; Chien, CH; Perng, TH; Yang, MJ; Liang, JS; Lehnen, P; Tsui, BY; Chang, CY |
| 國立交通大學 |
2014-12-08T15:27:01Z |
Electrical reliability issues of integrating low-K dielectrics with Cu metallization
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Wu, ZC; Shiung, ZW; Wang, CC; Fang, KL; Wu, RG; Liu, YL; Tsui, BY; Chen, MC; Chang, W; Chou, PF; Jang, SM; Yu, CH; Liang, MS |
| 國立交通大學 |
2014-12-08T15:26:46Z |
Electrical reliability of low dielectric constant diffusion barrier (a-SiC : H) for copper interconnect
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Fang, KL; Tsui, BY; Yang, CC; Lee, SD |
| 國立交通大學 |
2014-12-08T15:26:35Z |
Electrical and material stability of Orion(TM) CVD ultra low-k dielectric film for copper interconnection
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Fang, KL; Tsui, BY; Yang, CC; Chen, MC; Lee, SD; Beekmann, K; Tony, W; Giles, K; Ishaq, S |
显示项目 16-25 / 54 (共6页)
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