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Showing items 1-25 of 32  (2 Page(s) Totally)
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Institution Date Title Author
國立交通大學 2019-04-02T05:58:30Z The effect of lead impurity on the DC-etching behaviour of aluminum foil for electrolytic capacitor usage Lin, W; Tu, GC; Lin, CF; Peng, YM
國立交通大學 2014-12-08T15:44:58Z Hard chromium plating on cold swaged Cr-Mo steel using rotating cylinder electrode Huang, CA; Tu, GC; Liao, MC; Kao, YL
國立交通大學 2014-12-08T15:44:22Z Fabrication and characterization of Cu-SiCp composites for electrical discharge machining applications Shu, KM; Tu, GC
國立交通大學 2014-12-08T15:43:54Z Effect of catalyst on growth behavior of carbon nanotube synthesizing by microwave heating thermal chemical vapor deposition process Chen, SC; Shih, LY; Chang, YC; Tu, GC; Lin, IN
國立交通大學 2014-12-08T15:40:51Z The microstructure and the thermal expansion characteristics of Cu/SiCp composites Shu, KM; Tu, GC
國立交通大學 2014-12-08T15:40:48Z Study of electrical discharge grinding using metal matrix composite electrodes Shu, KM; Tu, GC
國立交通大學 2014-12-08T15:40:15Z Simulation analysis and experimental verification of UV-LIGA process for high-aspect-ratio Ni-Fe micro-mold insert Yeh, YM; Tu, GC; Fu, MN
國立交通大學 2014-12-08T15:40:11Z The electrochemical behavior of tin-doped indium oxide during reduction in 0.3 M hydrochloric acid Huang, CA; Li, KC; Tu, GC; Wang, WS
國立交通大學 2014-12-08T15:39:23Z Characteristics of the rough-cut surface of quenched and tempered martensitic stainless steel using wire electrical discharge machining Huang, CA; Tu, GC; Yao, HT; Kuo, HH
國立交通大學 2014-12-08T15:38:58Z Nanomechanical properties of nanocrystalline Ni-Fe mold insert Yeh, YM; Tu, GC; Fang, TH
國立交通大學 2014-12-08T15:38:31Z The annealing behavior of copper deposit electroplated in sulfuric acid bath with various concentrations of thiourea Kao, YL; Tu, GC; Huang, CA; Chang, JH
國立交通大學 2014-12-08T15:37:25Z Simulation analysis and experimental verification of LIGA-like process for Ni-Fe micromold insert with taper angle Fu, MN; Yeh, YM; Tu, GC
國立交通大學 2014-12-08T15:37:01Z Microstructural study of the effect of chloride ion on electroplating of copper in cupric sulfate-sulfuric acid bath Kao, YL; Li, KC; Tu, GC; Huang, CA
國立交通大學 2014-12-08T15:19:23Z Reverse CoSi(2) thermal stability and digitized sheet resistance increase of sub-90 nm polysilicon lines Lo, CY; Peng, YC; Chen, YM; Tu, GC; Lin, SS; Chen, WM
國立交通大學 2014-12-08T15:19:05Z A study on the hardness variation of alpha- and beta-pure titanium with different grain sizes Kao, YL; Tu, GC; Huang, CA; Liu, TT
國立交通大學 2014-12-08T15:17:52Z The electrochemical polishing behavior of porous austenitic stainless steel (AISI 316L) in phosphoric-sulfuric mixed acids Chen, SC; Tu, GC; Huang, CA
國立交通大學 2014-12-08T15:17:41Z CoSix thermal stability on narrow-width polysilicon resistors Chen, YM; Tu, GC; Wang, YL; Hwang, GJ; Lo, CY
國立交通大學 2014-12-08T15:17:31Z The effect of 180 degrees C-annealing on the electrochemical behavior of nano-thick zinc-electroplated copper in aqueous solutions with different pH Kao, YL; Tu, GC; Huang, CA
國立交通大學 2014-12-08T15:17:19Z Oxide-mediated fort-nation of epitaxy silicide on heavily doped Si surfaces and narrow width active region Chen, YM; Tu, GC; Wang, YL
國立交通大學 2014-12-08T15:17:18Z Width-dependent anomalous CoSix sheet resistance change by Ti and TiN capping process Chen, YM; Tu, GC; Wang, YL
國立交通大學 2014-12-08T15:06:04Z HARD ANODIZING OF 2024 ALUMINUM-ALLOY USING PULSED DC AND AC POWER TU, GC; HUANG, LY
國立交通大學 2014-12-08T15:05:38Z PREPARATION OF HIGH-TC SUPERCONDUCTING BI-PB-SR-CA-CU-O CERAMICS BY THE METHOD OF THERMAL-DECOMPOSITION OF AN ETHYLENE DIAMINE TETRAACETATE COLLOIDAL SUSPENSION TU, GC; CHEN, FH; KOO, HS
國立交通大學 2014-12-08T15:05:27Z THE EFFECT OF ANODIZING ON THE CORROSION FATIGUE BEHAVIOR OF 2024-T3 ALUMINUM-ALLOY TU, GC; CHEN, IT; HWANG, RY
國立交通大學 2014-12-08T15:05:25Z HIGH-TC SUPERCONDUCTING OXIDE FILM PREPARED BY SPRAY PYROLYSIS COATING KOO, HS; TU, GC; CHU, JJ; LEE, WH; WU, PT
國立交通大學 2014-12-08T15:05:18Z A STUDY OF CORROSION FATIGUE BEHAVIOR OF ANODIZED AND UNANODIZED 2024-T3 ALUMINUM-ALLOY TU, GC; HWANG, RY; CHEN, IT

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