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"tu gc"
Showing items 1-32 of 32 (1 Page(s) Totally)
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| 國立交通大學 |
2019-04-02T05:58:30Z |
The effect of lead impurity on the DC-etching behaviour of aluminum foil for electrolytic capacitor usage
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Lin, W; Tu, GC; Lin, CF; Peng, YM |
| 國立交通大學 |
2014-12-08T15:44:58Z |
Hard chromium plating on cold swaged Cr-Mo steel using rotating cylinder electrode
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Huang, CA; Tu, GC; Liao, MC; Kao, YL |
| 國立交通大學 |
2014-12-08T15:44:22Z |
Fabrication and characterization of Cu-SiCp composites for electrical discharge machining applications
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Shu, KM; Tu, GC |
| 國立交通大學 |
2014-12-08T15:43:54Z |
Effect of catalyst on growth behavior of carbon nanotube synthesizing by microwave heating thermal chemical vapor deposition process
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Chen, SC; Shih, LY; Chang, YC; Tu, GC; Lin, IN |
| 國立交通大學 |
2014-12-08T15:40:51Z |
The microstructure and the thermal expansion characteristics of Cu/SiCp composites
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Shu, KM; Tu, GC |
| 國立交通大學 |
2014-12-08T15:40:48Z |
Study of electrical discharge grinding using metal matrix composite electrodes
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Shu, KM; Tu, GC |
| 國立交通大學 |
2014-12-08T15:40:15Z |
Simulation analysis and experimental verification of UV-LIGA process for high-aspect-ratio Ni-Fe micro-mold insert
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Yeh, YM; Tu, GC; Fu, MN |
| 國立交通大學 |
2014-12-08T15:40:11Z |
The electrochemical behavior of tin-doped indium oxide during reduction in 0.3 M hydrochloric acid
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Huang, CA; Li, KC; Tu, GC; Wang, WS |
| 國立交通大學 |
2014-12-08T15:39:23Z |
Characteristics of the rough-cut surface of quenched and tempered martensitic stainless steel using wire electrical discharge machining
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Huang, CA; Tu, GC; Yao, HT; Kuo, HH |
| 國立交通大學 |
2014-12-08T15:38:58Z |
Nanomechanical properties of nanocrystalline Ni-Fe mold insert
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Yeh, YM; Tu, GC; Fang, TH |
| 國立交通大學 |
2014-12-08T15:38:31Z |
The annealing behavior of copper deposit electroplated in sulfuric acid bath with various concentrations of thiourea
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Kao, YL; Tu, GC; Huang, CA; Chang, JH |
| 國立交通大學 |
2014-12-08T15:37:25Z |
Simulation analysis and experimental verification of LIGA-like process for Ni-Fe micromold insert with taper angle
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Fu, MN; Yeh, YM; Tu, GC |
| 國立交通大學 |
2014-12-08T15:37:01Z |
Microstructural study of the effect of chloride ion on electroplating of copper in cupric sulfate-sulfuric acid bath
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Kao, YL; Li, KC; Tu, GC; Huang, CA |
| 國立交通大學 |
2014-12-08T15:19:23Z |
Reverse CoSi(2) thermal stability and digitized sheet resistance increase of sub-90 nm polysilicon lines
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Lo, CY; Peng, YC; Chen, YM; Tu, GC; Lin, SS; Chen, WM |
| 國立交通大學 |
2014-12-08T15:19:05Z |
A study on the hardness variation of alpha- and beta-pure titanium with different grain sizes
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Kao, YL; Tu, GC; Huang, CA; Liu, TT |
| 國立交通大學 |
2014-12-08T15:17:52Z |
The electrochemical polishing behavior of porous austenitic stainless steel (AISI 316L) in phosphoric-sulfuric mixed acids
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Chen, SC; Tu, GC; Huang, CA |
| 國立交通大學 |
2014-12-08T15:17:41Z |
CoSix thermal stability on narrow-width polysilicon resistors
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Chen, YM; Tu, GC; Wang, YL; Hwang, GJ; Lo, CY |
| 國立交通大學 |
2014-12-08T15:17:31Z |
The effect of 180 degrees C-annealing on the electrochemical behavior of nano-thick zinc-electroplated copper in aqueous solutions with different pH
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Kao, YL; Tu, GC; Huang, CA |
| 國立交通大學 |
2014-12-08T15:17:19Z |
Oxide-mediated fort-nation of epitaxy silicide on heavily doped Si surfaces and narrow width active region
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Chen, YM; Tu, GC; Wang, YL |
| 國立交通大學 |
2014-12-08T15:17:18Z |
Width-dependent anomalous CoSix sheet resistance change by Ti and TiN capping process
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Chen, YM; Tu, GC; Wang, YL |
| 國立交通大學 |
2014-12-08T15:06:04Z |
HARD ANODIZING OF 2024 ALUMINUM-ALLOY USING PULSED DC AND AC POWER
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TU, GC; HUANG, LY |
| 國立交通大學 |
2014-12-08T15:05:38Z |
PREPARATION OF HIGH-TC SUPERCONDUCTING BI-PB-SR-CA-CU-O CERAMICS BY THE METHOD OF THERMAL-DECOMPOSITION OF AN ETHYLENE DIAMINE TETRAACETATE COLLOIDAL SUSPENSION
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TU, GC; CHEN, FH; KOO, HS |
| 國立交通大學 |
2014-12-08T15:05:27Z |
THE EFFECT OF ANODIZING ON THE CORROSION FATIGUE BEHAVIOR OF 2024-T3 ALUMINUM-ALLOY
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TU, GC; CHEN, IT; HWANG, RY |
| 國立交通大學 |
2014-12-08T15:05:25Z |
HIGH-TC SUPERCONDUCTING OXIDE FILM PREPARED BY SPRAY PYROLYSIS COATING
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KOO, HS; TU, GC; CHU, JJ; LEE, WH; WU, PT |
| 國立交通大學 |
2014-12-08T15:05:18Z |
A STUDY OF CORROSION FATIGUE BEHAVIOR OF ANODIZED AND UNANODIZED 2024-T3 ALUMINUM-ALLOY
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TU, GC; HWANG, RY; CHEN, IT |
| 國立交通大學 |
2014-12-08T15:05:08Z |
A STUDY OF THE FEATURELESS ZONE IN RAPIDLY-SOLIDIFIED GAS-ATOMIZED ALUMINUM-ALLOY POWDER
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TU, GC; CHEN, IT; CHUNG, MS |
| 國立交通大學 |
2014-12-08T15:04:10Z |
PREPARATION AND CHARACTERIZATION OF TL-BA-CA-CU-O SUPERCONDUCTING FILMS BY SPRAY-PYROLYSIS AND TL-DIFFUSION TECHNIQUE
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KOO, HS; TU, GC; TSENG, TY |
| 國立交通大學 |
2014-12-08T15:03:43Z |
THE EFFECT OF TI-ADDITION ON THE L12 PRECIPITATES OF RAPIDLY-SOLIDIFIED AL-CR-ZR ALLOY
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CHUANG, MS; TU, GC |
| 國立交通大學 |
2014-12-08T15:03:00Z |
THE EFFECT OF NB-ADDITION ON THE LL(2) PRECIPITATES OF RAPIDLY-SOLIDIFIED AL-CR-ZR ALLOY
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CHUANG, MS; TU, GC |
| 國立交通大學 |
2014-12-08T15:02:43Z |
Fabrication and microstructure of the dc-magnetron-sputtered YBa2Cu3O7-x superconducting thin films
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Koo, HS; Tseng, TY; Chang, WR; Tu, GC |
| 國立交通大學 |
2014-12-08T15:02:35Z |
The effect of lead impurity on the DC-etching behaviour of aluminum foil for electrolytic capacitor usage
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Lin, W; Tu, GC; Lin, CF; Peng, YM |
| 國立交通大學 |
2014-12-08T15:01:29Z |
The effect of indium impurity on the DC-etching behaviour of aluminum foil for electrolytic capacitor usage
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Lin, W; Tu, GC; Lin, CF; Peng, YM |
Showing items 1-32 of 32 (1 Page(s) Totally)
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