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Showing items 11-20 of 32 (4 Page(s) Totally)
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| 國立交通大學 |
2014-12-08T15:38:31Z |
The annealing behavior of copper deposit electroplated in sulfuric acid bath with various concentrations of thiourea
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Kao, YL; Tu, GC; Huang, CA; Chang, JH |
| 國立交通大學 |
2014-12-08T15:37:25Z |
Simulation analysis and experimental verification of LIGA-like process for Ni-Fe micromold insert with taper angle
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Fu, MN; Yeh, YM; Tu, GC |
| 國立交通大學 |
2014-12-08T15:37:01Z |
Microstructural study of the effect of chloride ion on electroplating of copper in cupric sulfate-sulfuric acid bath
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Kao, YL; Li, KC; Tu, GC; Huang, CA |
| 國立交通大學 |
2014-12-08T15:19:23Z |
Reverse CoSi(2) thermal stability and digitized sheet resistance increase of sub-90 nm polysilicon lines
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Lo, CY; Peng, YC; Chen, YM; Tu, GC; Lin, SS; Chen, WM |
| 國立交通大學 |
2014-12-08T15:19:05Z |
A study on the hardness variation of alpha- and beta-pure titanium with different grain sizes
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Kao, YL; Tu, GC; Huang, CA; Liu, TT |
| 國立交通大學 |
2014-12-08T15:17:52Z |
The electrochemical polishing behavior of porous austenitic stainless steel (AISI 316L) in phosphoric-sulfuric mixed acids
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Chen, SC; Tu, GC; Huang, CA |
| 國立交通大學 |
2014-12-08T15:17:41Z |
CoSix thermal stability on narrow-width polysilicon resistors
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Chen, YM; Tu, GC; Wang, YL; Hwang, GJ; Lo, CY |
| 國立交通大學 |
2014-12-08T15:17:31Z |
The effect of 180 degrees C-annealing on the electrochemical behavior of nano-thick zinc-electroplated copper in aqueous solutions with different pH
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Kao, YL; Tu, GC; Huang, CA |
| 國立交通大學 |
2014-12-08T15:17:19Z |
Oxide-mediated fort-nation of epitaxy silicide on heavily doped Si surfaces and narrow width active region
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Chen, YM; Tu, GC; Wang, YL |
| 國立交通大學 |
2014-12-08T15:17:18Z |
Width-dependent anomalous CoSix sheet resistance change by Ti and TiN capping process
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Chen, YM; Tu, GC; Wang, YL |
Showing items 11-20 of 32 (4 Page(s) Totally)
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