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Showing items 11-20 of 65 (7 Page(s) Totally)
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| 臺大學術典藏 |
2022-06-30T02:06:08Z |
Fabrication and characteristics of highly ⟨ 110 ⟩ -oriented nanotwinned Au films
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Chiu W.-L.; Liu C.-M.; Lin H.-W.; Wu J.A.; Chou Y.-C.; Tu K.N.; Chen C.; Chiu W.-L.; Liu C.-M.; Lin H.-W.; Wu J.A.; Chou Y.-C.; Tu K.N.; Chen C.; YI-CHIA CHOU |
| 臺大學術典藏 |
2020-05-12T02:53:12Z |
Electromigration in the flip chip solder joint of Sn-8Zn-3Bi on copper pads
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TUNG-HAN CHUANG; Tu, K.N.; Chuang, T.H.; Lin, S.Z.; Wu, A.T.; Lin, W.H. |
| 國立交通大學 |
2020-05-05T00:01:29Z |
Extremely rapid grain growth in scallop-type Cu6Sn5 during solid-liquid interdiffusion reactions in micro-bump solder joints
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Chen, Chih; Tu, K. N.; Gusak, A. M. |
| 國立交通大學 |
2020-02-02T23:55:32Z |
Low-resistance and high-strength copper direct bonding in no-vacuum ambient using highly (111)-oriented nano-twinned copper
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Juang, Jing Ye; Shie, Kai Cheng; Hsu, Po-Ning; Li, Yu Jin; Tu, K. N.; Chen, Chin |
| 國立交通大學 |
2020-01-02T00:04:23Z |
Tuning Stress in Cu Thin Films by Developing Highly (111)-Oriented Nanotwinned Structure
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Wang, I-Ju; Ku, Ching-Shun; Tu-Ngoc Lam; Huang, E-Wen; Tu, K. N.; Chen, Chih |
| 國立交通大學 |
2019-12-13T01:12:53Z |
Low resistance and high reliable Cu-to-Cu joints using highly (111)-oriented nano-twinned copper
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Juang, Jing Ye; Shie, Kai Cheng; Li, Yu Jin; Tu, K. N.; Chen, Chih |
| 國立交通大學 |
2019-12-13T01:12:49Z |
Low-temperature Cu-to-Cu direct bonding enabled by highly (111)-oriented and nanotwinned Cu
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Chen, Chih; Juang, Jing-Ye; Chang, Shih Yang; Shie, Kai Cheng; Li, Yu Jin; Tu, K. N. |
| 國立交通大學 |
2019-12-13T01:09:54Z |
Element Effects on High-Entropy Alloy Vacancy and Heterogeneous Lattice Distortion Subjected to Quasi-equilibrium Heating
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Huang, E-Wen; Chou, Hung-Sheng; Tu, K. N.; Hung, Wei-Song; Tu-Ngoc Lam; Tsai, Che-Wei; Chiang, Ching-Yu; Lin, Bi-Hsuan; Yeh, An-Chou; Chang, Shan-Hsiu; Chang, Yao-Jen; Yang, Jun-Jie; Li, Xiao-Yun; Ku, Ching-Shun; An, Ke; Chang, Yuan-Wei; Jao, Yu-Lun |
| 臺大學術典藏 |
2019-11-27T02:03:01Z |
Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigratton
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C. ROBERT KAO;Tu K.N.;Kao C.R.;Lloyd J.R.;Tamura N.;Wu A.T.; Wu A.T.; Tamura N.; Lloyd J.R.; Kao C.R.; Tu K.N.; C. ROBERT KAO |
| 國立交通大學 |
2019-10-05T00:08:46Z |
A unified model of mean-time-to-failure for electromigration, thermomigration, and stress-migration based on entropy production
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Tu, K. N.; Gusak, A. M. |
Showing items 11-20 of 65 (7 Page(s) Totally)
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