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Showing items 26-35 of 65 (7 Page(s) Totally)
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| 國立臺灣科技大學 |
2019 |
Element Effects on High-Entropy Alloy Vacancy and Heterogeneous Lattice Distortion Subjected to Quasi-equilibrium Heating
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Huang, E.-W.;Chou, H.-S.;Tu, K.N.;Hung, W.-S.;Lam, T.-N.;Tsai, C.-W.;Chiang, Chiang C.-Y.;Lin, B.-H.;Yeh, A.-C.;Chang, S.-H.;Chang, Y.-J.;Yang, J.-J.;Li, X.-Y.;Ku, C.-S.;An, K.;Chang, Y.-W.;Jao, Y.-L. |
| 國立交通大學 |
2018-08-21T05:53:51Z |
Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bonding
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Tseng, Chih-Han; Tu, K. N.; Chen, Chih |
| 國立交通大學 |
2018-08-21T05:53:03Z |
Growth competition between layer-type and porous-type Cu3Sn in microbumps
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Chu, David T.; Chu, Yi-Cheng; Lin, Jie-An; Chen, Yi-Ting; Wang, Chun-Chieh; Song, Yen-Fang; Chiang, Cheng-Cheng; Chen, Chih; Tu, K. N. |
| 國立臺灣科技大學 |
2018 |
Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient
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Juang J.-Y.; Lu C.-L.; Chen K.-J.; Chen C.-C.A.; Hsu P.-N.; Chen C.; Tu K.N. |
| 國立交通大學 |
2017-04-21T06:56:29Z |
Flux-driven cellular precipitation in open system to form porous Cu3Sn
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Gusak, Andriy M.; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:55:29Z |
Communication-Formation of Porous Cu3Sn by High-Temperature Current Stressing
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Lin, C. K.; Chen, Chih; Chu, David T.; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:49:52Z |
In-situ Transmission Electron Microscopy Study of Nanotwinned Copper under Electromigration
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Liao, Chien-Neng; Chen, Kuan-Chia; Wu, Wen-Wei; Chen, Lih-Juann; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:49:40Z |
Electromigration in Pb-free solder bumps with Cu column as flip chip joints
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Nah, Jae-Woong; Suh, J. O.; Tu, K. N.; Yoon, Seung Wook; Chong, Chai Tai; Kripesh, V.; Su, B. R.; Chen, Chih |
| 國立交通大學 |
2017-04-21T06:49:38Z |
LOW-TEMPERATURE AND LOW-PRESSURE DIRECT COPPER-TO-COPPER BONDING BY HIGHLY (111)-ORIENTED NANOTWINNED CU
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Chen, Chih; Liu, Chien-Min; Lin, Han-Wen; Huang, Yi-Sa; Chu, Yi-Cheng; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:49:36Z |
In-situ TEM Study of Electromigration in Cu lines
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Liao, C. N.; Chen, K. C.; Wu, W. W.; Chen, L. J.; Tu, K. N. |
Showing items 26-35 of 65 (7 Page(s) Totally)
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