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"tu k n"的相关文件
显示项目 41-50 / 65 (共7页)
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| 國立交通大學 |
2014-12-08T15:35:49Z |
Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces
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Liu, Chien-Min; Lin, Han-Wen; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:31:05Z |
Microstructure control of unidirectional growth of eta-Cu6Sn5 in microbumps on < 1 1 1 > oriented and nanotwinned Cu
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Lin, Han-wen; Lu, Chia-ling; Liu, Chien-min; Chen, Chih; Chen, Delphic; Kuo, Jui-Chao; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:30:40Z |
The Influence of Surface Oxide on the Growth of Metal/Semiconductor Nanowires
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Lu, Kuo-Chang; Wu, Wen-Wei; Ouyang, Hao; Lin, Yung-Chen; Huang, Yu; Wang, Chun-Wen; Wu, Zheng-Wei; Huang, Chun-Wei; Chen, Lih J.; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:30:34Z |
Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints
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Liang, Y. C.; Lin, H. W.; Chen, H. P.; Chen, C.; Tu, K. N.; Lai, Y. S. |
| 國立交通大學 |
2014-12-08T15:30:31Z |
Side Wall Wetting Induced Void Formation due to Small Solder Volume in Microbumps of Ni/SnAg/Ni upon Reflow
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Liang, Y. C.; Chen, C.; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:29:38Z |
Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy
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Tu, K. N.; Hsiao, Hsiang-Yao; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:29:18Z |
Thermomigration in solder joints
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Chen, Chih; Hsiao, Hsiang-Yao; Chang, Yuan-Wei; Ouyang, Fanyi; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:24:15Z |
Asymmetrical growth of Cu6Sn5 intermetallic compounds due to rapid thermomigration of Cu in molten SnAg solder joints
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Guo, Ming-Yung; Lin, C. K.; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:23:13Z |
Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper
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Hsiao, Hsiang-Yao; Liu, Chien-Min; Lin, Han-Wen; Liu, Tao-Chi; Lu, Chia-Ling; Huang, Yi-Sa; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:22:41Z |
The effect of a concentration gradient on interfacial reactions in microburaps of Ni/SnAg/Cu during liquid-state soldering
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Huang, Y. S.; Hsiao, H. Y.; Chen, Chih; Tu, K. N. |
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