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"tu k n"的相关文件
显示项目 56-65 / 65 (共3页)
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| 國立交通大學 |
2014-12-08T15:11:14Z |
Effect of migration and condensation of pre-existing voids on increase in bump resistance of flip chips on flexible substrates during electromigration
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Liang, S. W.; Chang, Y. W.; Chen, Chih; Preciado, Jackie; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:11:02Z |
Observation of atomic diffusion at twin-modified grain boundaries in copper
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Chen, Kuan-Chia; Wu, Wen-Wei; Liao, Chien-Neng; Chen, Lih-Juann; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:08:08Z |
Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints
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Liang, S. W.; Hsiao, Hsiang-Yao; Chen, Chih; Xu, Luhua; Tu, K. N.; Lai, Yi-Shao |
| 國立交通大學 |
2014-12-08T15:07:45Z |
Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints
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Chen, Chih; Tong, H. M.; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:07:00Z |
Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration
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Liang, S. W.; Chen, Chih; Han, J. K.; Xu, Luhua; Tu, K. N.; Lai, Yi-Shao |
| 國立成功大學 |
2013-08 |
Microstructure control of unidirectional growth of eta-Cu6Sn5 in microbumps on < 1 1 1 > oriented and nanotwinned Cu
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Lin, Han-wen; Lu, Chia-ling; Liu, Chien-min; Chen, Chih; Chen, Delphic; Kuo, Jui-Chao; Tu, K. N. |
| 國立臺灣大學 |
2007 |
Electromigration in the Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper Pads
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Lin, W.H.; Wu, Albert T.; Lin, S.Z.; Chuang, T.H.; Tu, K.N. |
| 國立臺灣大學 |
2005-06 |
Electromigration-induced grain rotation in anisotropic conducting beta-tin
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Wu, A. T.; Gusak, A. M.; Tu, K. N.; Kao, and C. R. |
| 國立臺灣大學 |
2004-09 |
The study of microstructure evolution of tin grains due to electromigration by using synchrotron X-ray microdiffraction
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Wu, A. T.; Tu, K. N.; Lloyd, J. R.; Tamura, N.; Valek, B. C.; Kao, and C. R. |
| 國立臺灣大學 |
2003-11 |
Electromigration failure in flip chip solder joints due to rapid dissolution of copper
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Hu, Y. C.; Lin, Y. H.; Kao, C. R.; Tu, K. N. |
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