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"tu k n"的相關文件
顯示項目 16-40 / 65 (共3頁)
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| 國立交通大學 |
2019-12-13T01:12:53Z |
Low resistance and high reliable Cu-to-Cu joints using highly (111)-oriented nano-twinned copper
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Juang, Jing Ye; Shie, Kai Cheng; Li, Yu Jin; Tu, K. N.; Chen, Chih |
| 國立交通大學 |
2019-12-13T01:12:49Z |
Low-temperature Cu-to-Cu direct bonding enabled by highly (111)-oriented and nanotwinned Cu
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Chen, Chih; Juang, Jing-Ye; Chang, Shih Yang; Shie, Kai Cheng; Li, Yu Jin; Tu, K. N. |
| 國立交通大學 |
2019-12-13T01:09:54Z |
Element Effects on High-Entropy Alloy Vacancy and Heterogeneous Lattice Distortion Subjected to Quasi-equilibrium Heating
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Huang, E-Wen; Chou, Hung-Sheng; Tu, K. N.; Hung, Wei-Song; Tu-Ngoc Lam; Tsai, Che-Wei; Chiang, Ching-Yu; Lin, Bi-Hsuan; Yeh, An-Chou; Chang, Shan-Hsiu; Chang, Yao-Jen; Yang, Jun-Jie; Li, Xiao-Yun; Ku, Ching-Shun; An, Ke; Chang, Yuan-Wei; Jao, Yu-Lun |
| 臺大學術典藏 |
2019-11-27T02:03:01Z |
Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigratton
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C. ROBERT KAO;Tu K.N.;Kao C.R.;Lloyd J.R.;Tamura N.;Wu A.T.; Wu A.T.; Tamura N.; Lloyd J.R.; Kao C.R.; Tu K.N.; C. ROBERT KAO |
| 國立交通大學 |
2019-10-05T00:08:46Z |
A unified model of mean-time-to-failure for electromigration, thermomigration, and stress-migration based on entropy production
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Tu, K. N.; Gusak, A. M. |
| 國立交通大學 |
2019-04-02T06:04:30Z |
Chip-to-chip copper direct bonding in no-vacuum ambient using (111) oriented nano-twinned copper
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Juang, Jing Ye; Shie, Kai Cheng; Li, Yu Jin; Lin, Benson; Chang, Chia Cheng; Tu, K. N.; Chen, Chih |
| 國立交通大學 |
2019-04-02T06:00:50Z |
Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu
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Juang, Jing-Ye; Lu, Chia-Ling; Li, Yu-Jin; Tu, K. N.; Chen, Chih |
| 國立交通大學 |
2019-04-02T06:00:47Z |
Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient
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Juang, Jing-Ye; Lu, Chia-Ling; Chen, Kuan-Ju; Chen, Chao-Chang A.; Hsu, Po-Ning; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2019-04-02T06:00:16Z |
Growth of Multiple Metal/Semiconductor Nanoheterostructures through Point and Line Contact Reactions
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Wu, W. W.; Lu, K. C.; Wang, C. W.; Hsieh, H. Y.; Chen, S. Y.; Chou, Y. C.; Yu, S. Y.; Chen, L. J.; Tu, K. N. |
| 國立交通大學 |
2019-04-02T06:00:16Z |
Stability of nanoscale twins in copper under electric current stressing
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Chen, Kuan-Chia; Wu, Wen-Wei; Liao, Chien-Neng; Chen, Lih-Juann; Tu, K. N. |
| 國立臺灣科技大學 |
2019 |
Element Effects on High-Entropy Alloy Vacancy and Heterogeneous Lattice Distortion Subjected to Quasi-equilibrium Heating
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Huang, E.-W.;Chou, H.-S.;Tu, K.N.;Hung, W.-S.;Lam, T.-N.;Tsai, C.-W.;Chiang, Chiang C.-Y.;Lin, B.-H.;Yeh, A.-C.;Chang, S.-H.;Chang, Y.-J.;Yang, J.-J.;Li, X.-Y.;Ku, C.-S.;An, K.;Chang, Y.-W.;Jao, Y.-L. |
| 國立交通大學 |
2018-08-21T05:53:51Z |
Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bonding
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Tseng, Chih-Han; Tu, K. N.; Chen, Chih |
| 國立交通大學 |
2018-08-21T05:53:03Z |
Growth competition between layer-type and porous-type Cu3Sn in microbumps
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Chu, David T.; Chu, Yi-Cheng; Lin, Jie-An; Chen, Yi-Ting; Wang, Chun-Chieh; Song, Yen-Fang; Chiang, Cheng-Cheng; Chen, Chih; Tu, K. N. |
| 國立臺灣科技大學 |
2018 |
Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient
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Juang J.-Y.; Lu C.-L.; Chen K.-J.; Chen C.-C.A.; Hsu P.-N.; Chen C.; Tu K.N. |
| 國立交通大學 |
2017-04-21T06:56:29Z |
Flux-driven cellular precipitation in open system to form porous Cu3Sn
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Gusak, Andriy M.; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:55:29Z |
Communication-Formation of Porous Cu3Sn by High-Temperature Current Stressing
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Lin, C. K.; Chen, Chih; Chu, David T.; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:49:52Z |
In-situ Transmission Electron Microscopy Study of Nanotwinned Copper under Electromigration
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Liao, Chien-Neng; Chen, Kuan-Chia; Wu, Wen-Wei; Chen, Lih-Juann; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:49:40Z |
Electromigration in Pb-free solder bumps with Cu column as flip chip joints
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Nah, Jae-Woong; Suh, J. O.; Tu, K. N.; Yoon, Seung Wook; Chong, Chai Tai; Kripesh, V.; Su, B. R.; Chen, Chih |
| 國立交通大學 |
2017-04-21T06:49:38Z |
LOW-TEMPERATURE AND LOW-PRESSURE DIRECT COPPER-TO-COPPER BONDING BY HIGHLY (111)-ORIENTED NANOTWINNED CU
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Chen, Chih; Liu, Chien-Min; Lin, Han-Wen; Huang, Yi-Sa; Chu, Yi-Cheng; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:49:36Z |
In-situ TEM Study of Electromigration in Cu lines
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Liao, C. N.; Chen, K. C.; Wu, W. W.; Chen, L. J.; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:48:31Z |
Low-temperature and low pressure copper-to-copper direct bonding enabled by creep on highly (111)-oriented Cu surfaces
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Tseng, Chih-Han; Liu, Chien-Min; Lin, Han-wen; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:48:21Z |
Fabrication of (111) nanotwinned Cu and its applications in interconnects of microelectronic devices
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Chen, Chih; Liu, Chien-Min; Lu, Tien-Lin; Lin, Han-wen; Chu, Yi-Cheng; Lu, Chia-Ling; Juang, Jing-Ye; Chen, Kuan-Neng; Tu, K. N. |
| 國立交通大學 |
2015-12-02T02:59:12Z |
Effect of Elastic Strain Fluctuation on Atomic Layer Growth of Epitaxial Silicide in Si Nanowires by Point Contact Reactions
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Chou, Yi-Chia; Tang, Wei; Chiou, Chien-Jyun; Chen, Kai; Minor, Andrew M.; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:48:17Z |
Stability of nanoscale twins in copper under electric current stressing
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Chen, Kuan-Chia; Wu, Wen-Wei; Liao, Chien-Neng; Chen, Lih-Juann; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:48:15Z |
Growth of Multiple Metal/Semiconductor Nanoheterostructures through Point and Line Contact Reactions
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Wu, W. W.; Lu, K. C.; Wang, C. W.; Hsieh, H. Y.; Chen, S. Y.; Chou, Y. C.; Yu, S. Y.; Chen, L. J.; Tu, K. N. |
顯示項目 16-40 / 65 (共3頁)
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