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Showing items 16-25 of 65 (7 Page(s) Totally)
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| 國立交通大學 |
2019-12-13T01:12:53Z |
Low resistance and high reliable Cu-to-Cu joints using highly (111)-oriented nano-twinned copper
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Juang, Jing Ye; Shie, Kai Cheng; Li, Yu Jin; Tu, K. N.; Chen, Chih |
| 國立交通大學 |
2019-12-13T01:12:49Z |
Low-temperature Cu-to-Cu direct bonding enabled by highly (111)-oriented and nanotwinned Cu
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Chen, Chih; Juang, Jing-Ye; Chang, Shih Yang; Shie, Kai Cheng; Li, Yu Jin; Tu, K. N. |
| 國立交通大學 |
2019-12-13T01:09:54Z |
Element Effects on High-Entropy Alloy Vacancy and Heterogeneous Lattice Distortion Subjected to Quasi-equilibrium Heating
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Huang, E-Wen; Chou, Hung-Sheng; Tu, K. N.; Hung, Wei-Song; Tu-Ngoc Lam; Tsai, Che-Wei; Chiang, Ching-Yu; Lin, Bi-Hsuan; Yeh, An-Chou; Chang, Shan-Hsiu; Chang, Yao-Jen; Yang, Jun-Jie; Li, Xiao-Yun; Ku, Ching-Shun; An, Ke; Chang, Yuan-Wei; Jao, Yu-Lun |
| 臺大學術典藏 |
2019-11-27T02:03:01Z |
Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigratton
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C. ROBERT KAO;Tu K.N.;Kao C.R.;Lloyd J.R.;Tamura N.;Wu A.T.; Wu A.T.; Tamura N.; Lloyd J.R.; Kao C.R.; Tu K.N.; C. ROBERT KAO |
| 國立交通大學 |
2019-10-05T00:08:46Z |
A unified model of mean-time-to-failure for electromigration, thermomigration, and stress-migration based on entropy production
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Tu, K. N.; Gusak, A. M. |
| 國立交通大學 |
2019-04-02T06:04:30Z |
Chip-to-chip copper direct bonding in no-vacuum ambient using (111) oriented nano-twinned copper
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Juang, Jing Ye; Shie, Kai Cheng; Li, Yu Jin; Lin, Benson; Chang, Chia Cheng; Tu, K. N.; Chen, Chih |
| 國立交通大學 |
2019-04-02T06:00:50Z |
Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu
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Juang, Jing-Ye; Lu, Chia-Ling; Li, Yu-Jin; Tu, K. N.; Chen, Chih |
| 國立交通大學 |
2019-04-02T06:00:47Z |
Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient
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Juang, Jing-Ye; Lu, Chia-Ling; Chen, Kuan-Ju; Chen, Chao-Chang A.; Hsu, Po-Ning; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2019-04-02T06:00:16Z |
Growth of Multiple Metal/Semiconductor Nanoheterostructures through Point and Line Contact Reactions
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Wu, W. W.; Lu, K. C.; Wang, C. W.; Hsieh, H. Y.; Chen, S. Y.; Chou, Y. C.; Yu, S. Y.; Chen, L. J.; Tu, K. N. |
| 國立交通大學 |
2019-04-02T06:00:16Z |
Stability of nanoscale twins in copper under electric current stressing
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Chen, Kuan-Chia; Wu, Wen-Wei; Liao, Chien-Neng; Chen, Lih-Juann; Tu, K. N. |
Showing items 16-25 of 65 (7 Page(s) Totally)
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