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"tu k n"的相關文件
顯示項目 31-55 / 65 (共3頁)
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| 國立交通大學 |
2017-04-21T06:55:29Z |
Communication-Formation of Porous Cu3Sn by High-Temperature Current Stressing
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Lin, C. K.; Chen, Chih; Chu, David T.; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:49:52Z |
In-situ Transmission Electron Microscopy Study of Nanotwinned Copper under Electromigration
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Liao, Chien-Neng; Chen, Kuan-Chia; Wu, Wen-Wei; Chen, Lih-Juann; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:49:40Z |
Electromigration in Pb-free solder bumps with Cu column as flip chip joints
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Nah, Jae-Woong; Suh, J. O.; Tu, K. N.; Yoon, Seung Wook; Chong, Chai Tai; Kripesh, V.; Su, B. R.; Chen, Chih |
| 國立交通大學 |
2017-04-21T06:49:38Z |
LOW-TEMPERATURE AND LOW-PRESSURE DIRECT COPPER-TO-COPPER BONDING BY HIGHLY (111)-ORIENTED NANOTWINNED CU
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Chen, Chih; Liu, Chien-Min; Lin, Han-Wen; Huang, Yi-Sa; Chu, Yi-Cheng; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:49:36Z |
In-situ TEM Study of Electromigration in Cu lines
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Liao, C. N.; Chen, K. C.; Wu, W. W.; Chen, L. J.; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:48:31Z |
Low-temperature and low pressure copper-to-copper direct bonding enabled by creep on highly (111)-oriented Cu surfaces
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Tseng, Chih-Han; Liu, Chien-Min; Lin, Han-wen; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:48:21Z |
Fabrication of (111) nanotwinned Cu and its applications in interconnects of microelectronic devices
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Chen, Chih; Liu, Chien-Min; Lu, Tien-Lin; Lin, Han-wen; Chu, Yi-Cheng; Lu, Chia-Ling; Juang, Jing-Ye; Chen, Kuan-Neng; Tu, K. N. |
| 國立交通大學 |
2015-12-02T02:59:12Z |
Effect of Elastic Strain Fluctuation on Atomic Layer Growth of Epitaxial Silicide in Si Nanowires by Point Contact Reactions
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Chou, Yi-Chia; Tang, Wei; Chiou, Chien-Jyun; Chen, Kai; Minor, Andrew M.; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:48:17Z |
Stability of nanoscale twins in copper under electric current stressing
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Chen, Kuan-Chia; Wu, Wen-Wei; Liao, Chien-Neng; Chen, Lih-Juann; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:48:15Z |
Growth of Multiple Metal/Semiconductor Nanoheterostructures through Point and Line Contact Reactions
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Wu, W. W.; Lu, K. C.; Wang, C. W.; Hsieh, H. Y.; Chen, S. Y.; Chou, Y. C.; Yu, S. Y.; Chen, L. J.; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:35:49Z |
Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces
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Liu, Chien-Min; Lin, Han-Wen; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:31:05Z |
Microstructure control of unidirectional growth of eta-Cu6Sn5 in microbumps on < 1 1 1 > oriented and nanotwinned Cu
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Lin, Han-wen; Lu, Chia-ling; Liu, Chien-min; Chen, Chih; Chen, Delphic; Kuo, Jui-Chao; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:30:40Z |
The Influence of Surface Oxide on the Growth of Metal/Semiconductor Nanowires
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Lu, Kuo-Chang; Wu, Wen-Wei; Ouyang, Hao; Lin, Yung-Chen; Huang, Yu; Wang, Chun-Wen; Wu, Zheng-Wei; Huang, Chun-Wei; Chen, Lih J.; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:30:34Z |
Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints
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Liang, Y. C.; Lin, H. W.; Chen, H. P.; Chen, C.; Tu, K. N.; Lai, Y. S. |
| 國立交通大學 |
2014-12-08T15:30:31Z |
Side Wall Wetting Induced Void Formation due to Small Solder Volume in Microbumps of Ni/SnAg/Ni upon Reflow
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Liang, Y. C.; Chen, C.; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:29:38Z |
Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy
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Tu, K. N.; Hsiao, Hsiang-Yao; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:29:18Z |
Thermomigration in solder joints
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Chen, Chih; Hsiao, Hsiang-Yao; Chang, Yuan-Wei; Ouyang, Fanyi; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:24:15Z |
Asymmetrical growth of Cu6Sn5 intermetallic compounds due to rapid thermomigration of Cu in molten SnAg solder joints
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Guo, Ming-Yung; Lin, C. K.; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:23:13Z |
Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper
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Hsiao, Hsiang-Yao; Liu, Chien-Min; Lin, Han-Wen; Liu, Tao-Chi; Lu, Chia-Ling; Huang, Yi-Sa; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:22:41Z |
The effect of a concentration gradient on interfacial reactions in microburaps of Ni/SnAg/Cu during liquid-state soldering
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Huang, Y. S.; Hsiao, H. Y.; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:20:40Z |
Inhibiting the consumption of Cu during multiple reflows of Pb-free solder on Cu
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Hsiao, H. -Y.; Hu, C. -C.; Guo, M. -Y.; Chen, C.; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:16:12Z |
Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration
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Liang, S. W.; Chang, Y. W.; Shao, T. L.; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:14:37Z |
Stress analysis of spontaneous Sn whisker growth
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Tu, K. N.; Chen, Chih; Wu, Albert T. |
| 國立交通大學 |
2014-12-08T15:14:35Z |
Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-mu m-thick Cu under-bump metallization
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Nah, Jae-Woong; Chen, Kai; Tu, K. N.; Su, Bor-Rung; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:11:17Z |
Electromigration-induced Pb and Sn whisker growth in SnPb solder stripes
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Wei, C. C.; Liu, P. C.; Chen, Chih; Tu, K. N. |
顯示項目 31-55 / 65 (共3頁)
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