|
|
???tair.name??? >
???browser.page.title.author???
|
"tu k n"???jsp.browse.items-by-author.description???
Showing items 31-40 of 65 (7 Page(s) Totally)
<< < 1 2 3 4 5 6 7 > >>
View [10|25|50] records per page
| 國立交通大學 |
2017-04-21T06:55:29Z |
Communication-Formation of Porous Cu3Sn by High-Temperature Current Stressing
|
Lin, C. K.; Chen, Chih; Chu, David T.; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:49:52Z |
In-situ Transmission Electron Microscopy Study of Nanotwinned Copper under Electromigration
|
Liao, Chien-Neng; Chen, Kuan-Chia; Wu, Wen-Wei; Chen, Lih-Juann; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:49:40Z |
Electromigration in Pb-free solder bumps with Cu column as flip chip joints
|
Nah, Jae-Woong; Suh, J. O.; Tu, K. N.; Yoon, Seung Wook; Chong, Chai Tai; Kripesh, V.; Su, B. R.; Chen, Chih |
| 國立交通大學 |
2017-04-21T06:49:38Z |
LOW-TEMPERATURE AND LOW-PRESSURE DIRECT COPPER-TO-COPPER BONDING BY HIGHLY (111)-ORIENTED NANOTWINNED CU
|
Chen, Chih; Liu, Chien-Min; Lin, Han-Wen; Huang, Yi-Sa; Chu, Yi-Cheng; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:49:36Z |
In-situ TEM Study of Electromigration in Cu lines
|
Liao, C. N.; Chen, K. C.; Wu, W. W.; Chen, L. J.; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:48:31Z |
Low-temperature and low pressure copper-to-copper direct bonding enabled by creep on highly (111)-oriented Cu surfaces
|
Tseng, Chih-Han; Liu, Chien-Min; Lin, Han-wen; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:48:21Z |
Fabrication of (111) nanotwinned Cu and its applications in interconnects of microelectronic devices
|
Chen, Chih; Liu, Chien-Min; Lu, Tien-Lin; Lin, Han-wen; Chu, Yi-Cheng; Lu, Chia-Ling; Juang, Jing-Ye; Chen, Kuan-Neng; Tu, K. N. |
| 國立交通大學 |
2015-12-02T02:59:12Z |
Effect of Elastic Strain Fluctuation on Atomic Layer Growth of Epitaxial Silicide in Si Nanowires by Point Contact Reactions
|
Chou, Yi-Chia; Tang, Wei; Chiou, Chien-Jyun; Chen, Kai; Minor, Andrew M.; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:48:17Z |
Stability of nanoscale twins in copper under electric current stressing
|
Chen, Kuan-Chia; Wu, Wen-Wei; Liao, Chien-Neng; Chen, Lih-Juann; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:48:15Z |
Growth of Multiple Metal/Semiconductor Nanoheterostructures through Point and Line Contact Reactions
|
Wu, W. W.; Lu, K. C.; Wang, C. W.; Hsieh, H. Y.; Chen, S. Y.; Chou, Y. C.; Yu, S. Y.; Chen, L. J.; Tu, K. N. |
Showing items 31-40 of 65 (7 Page(s) Totally)
<< < 1 2 3 4 5 6 7 > >>
View [10|25|50] records per page
|
