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Showing items 41-65 of 65 (3 Page(s) Totally)
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| 國立交通大學 |
2014-12-08T15:35:49Z |
Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces
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Liu, Chien-Min; Lin, Han-Wen; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:31:05Z |
Microstructure control of unidirectional growth of eta-Cu6Sn5 in microbumps on < 1 1 1 > oriented and nanotwinned Cu
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Lin, Han-wen; Lu, Chia-ling; Liu, Chien-min; Chen, Chih; Chen, Delphic; Kuo, Jui-Chao; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:30:40Z |
The Influence of Surface Oxide on the Growth of Metal/Semiconductor Nanowires
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Lu, Kuo-Chang; Wu, Wen-Wei; Ouyang, Hao; Lin, Yung-Chen; Huang, Yu; Wang, Chun-Wen; Wu, Zheng-Wei; Huang, Chun-Wei; Chen, Lih J.; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:30:34Z |
Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints
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Liang, Y. C.; Lin, H. W.; Chen, H. P.; Chen, C.; Tu, K. N.; Lai, Y. S. |
| 國立交通大學 |
2014-12-08T15:30:31Z |
Side Wall Wetting Induced Void Formation due to Small Solder Volume in Microbumps of Ni/SnAg/Ni upon Reflow
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Liang, Y. C.; Chen, C.; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:29:38Z |
Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy
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Tu, K. N.; Hsiao, Hsiang-Yao; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:29:18Z |
Thermomigration in solder joints
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Chen, Chih; Hsiao, Hsiang-Yao; Chang, Yuan-Wei; Ouyang, Fanyi; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:24:15Z |
Asymmetrical growth of Cu6Sn5 intermetallic compounds due to rapid thermomigration of Cu in molten SnAg solder joints
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Guo, Ming-Yung; Lin, C. K.; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:23:13Z |
Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper
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Hsiao, Hsiang-Yao; Liu, Chien-Min; Lin, Han-Wen; Liu, Tao-Chi; Lu, Chia-Ling; Huang, Yi-Sa; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:22:41Z |
The effect of a concentration gradient on interfacial reactions in microburaps of Ni/SnAg/Cu during liquid-state soldering
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Huang, Y. S.; Hsiao, H. Y.; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:20:40Z |
Inhibiting the consumption of Cu during multiple reflows of Pb-free solder on Cu
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Hsiao, H. -Y.; Hu, C. -C.; Guo, M. -Y.; Chen, C.; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:16:12Z |
Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration
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Liang, S. W.; Chang, Y. W.; Shao, T. L.; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:14:37Z |
Stress analysis of spontaneous Sn whisker growth
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Tu, K. N.; Chen, Chih; Wu, Albert T. |
| 國立交通大學 |
2014-12-08T15:14:35Z |
Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-mu m-thick Cu under-bump metallization
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Nah, Jae-Woong; Chen, Kai; Tu, K. N.; Su, Bor-Rung; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:11:17Z |
Electromigration-induced Pb and Sn whisker growth in SnPb solder stripes
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Wei, C. C.; Liu, P. C.; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:11:14Z |
Effect of migration and condensation of pre-existing voids on increase in bump resistance of flip chips on flexible substrates during electromigration
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Liang, S. W.; Chang, Y. W.; Chen, Chih; Preciado, Jackie; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:11:02Z |
Observation of atomic diffusion at twin-modified grain boundaries in copper
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Chen, Kuan-Chia; Wu, Wen-Wei; Liao, Chien-Neng; Chen, Lih-Juann; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:08:08Z |
Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints
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Liang, S. W.; Hsiao, Hsiang-Yao; Chen, Chih; Xu, Luhua; Tu, K. N.; Lai, Yi-Shao |
| 國立交通大學 |
2014-12-08T15:07:45Z |
Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints
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Chen, Chih; Tong, H. M.; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:07:00Z |
Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration
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Liang, S. W.; Chen, Chih; Han, J. K.; Xu, Luhua; Tu, K. N.; Lai, Yi-Shao |
| 國立成功大學 |
2013-08 |
Microstructure control of unidirectional growth of eta-Cu6Sn5 in microbumps on < 1 1 1 > oriented and nanotwinned Cu
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Lin, Han-wen; Lu, Chia-ling; Liu, Chien-min; Chen, Chih; Chen, Delphic; Kuo, Jui-Chao; Tu, K. N. |
| 國立臺灣大學 |
2007 |
Electromigration in the Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper Pads
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Lin, W.H.; Wu, Albert T.; Lin, S.Z.; Chuang, T.H.; Tu, K.N. |
| 國立臺灣大學 |
2005-06 |
Electromigration-induced grain rotation in anisotropic conducting beta-tin
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Wu, A. T.; Gusak, A. M.; Tu, K. N.; Kao, and C. R. |
| 國立臺灣大學 |
2004-09 |
The study of microstructure evolution of tin grains due to electromigration by using synchrotron X-ray microdiffraction
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Wu, A. T.; Tu, K. N.; Lloyd, J. R.; Tamura, N.; Valek, B. C.; Kao, and C. R. |
| 國立臺灣大學 |
2003-11 |
Electromigration failure in flip chip solder joints due to rapid dissolution of copper
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Hu, Y. C.; Lin, Y. H.; Kao, C. R.; Tu, K. N. |
Showing items 41-65 of 65 (3 Page(s) Totally)
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