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Showing items 46-55 of 65 (7 Page(s) Totally)
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| 國立交通大學 |
2014-12-08T15:29:38Z |
Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy
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Tu, K. N.; Hsiao, Hsiang-Yao; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:29:18Z |
Thermomigration in solder joints
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Chen, Chih; Hsiao, Hsiang-Yao; Chang, Yuan-Wei; Ouyang, Fanyi; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:24:15Z |
Asymmetrical growth of Cu6Sn5 intermetallic compounds due to rapid thermomigration of Cu in molten SnAg solder joints
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Guo, Ming-Yung; Lin, C. K.; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:23:13Z |
Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper
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Hsiao, Hsiang-Yao; Liu, Chien-Min; Lin, Han-Wen; Liu, Tao-Chi; Lu, Chia-Ling; Huang, Yi-Sa; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:22:41Z |
The effect of a concentration gradient on interfacial reactions in microburaps of Ni/SnAg/Cu during liquid-state soldering
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Huang, Y. S.; Hsiao, H. Y.; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:20:40Z |
Inhibiting the consumption of Cu during multiple reflows of Pb-free solder on Cu
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Hsiao, H. -Y.; Hu, C. -C.; Guo, M. -Y.; Chen, C.; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:16:12Z |
Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration
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Liang, S. W.; Chang, Y. W.; Shao, T. L.; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:14:37Z |
Stress analysis of spontaneous Sn whisker growth
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Tu, K. N.; Chen, Chih; Wu, Albert T. |
| 國立交通大學 |
2014-12-08T15:14:35Z |
Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-mu m-thick Cu under-bump metallization
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Nah, Jae-Woong; Chen, Kai; Tu, K. N.; Su, Bor-Rung; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:11:17Z |
Electromigration-induced Pb and Sn whisker growth in SnPb solder stripes
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Wei, C. C.; Liu, P. C.; Chen, Chih; Tu, K. N. |
Showing items 46-55 of 65 (7 Page(s) Totally)
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