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"tu king ning"的相關文件
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| 國立交通大學 |
2020-07-01T05:21:22Z |
Tensile Properties of < 111 >-Oriented Nanotwinned Cu with Different Columnar Grain Structures
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Li, Yu-Jin; Tu, King-Ning; Chen, Chih |
| 國立交通大學 |
2020-03-01 |
Tensile Properties and Thermal Stability of Unidirectionally < 111 >-Oriented Nanotwinned and < 110 >-Oriented Microtwinned Copper
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Li, Yu-Jin; Chen, Chih; Tu, King-Ning |
| 國立交通大學 |
2019-04-03T06:44:31Z |
Formation Mechanism of Porous Cu3Sn Intermetallic Compounds by High Current Stressing at High Temperatures in Low-Bump-Height Solder Joints
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Lin, Jie-An; Lin, Chung-Kuang; Liu, Chen-Min; Huang, Yi-Sa; Chen, Chih; Chu, David T.; Tu, King-Ning |
| 國立交通大學 |
2019-04-03T06:42:01Z |
Intermetallic compounds in 3D integrated circuits technology: a brief review
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Annuar, Syahira; Mahmoodian, Reza; Hamdi, Mohd; Tu, King-Ning |
| 國立交通大學 |
2019-04-03T06:41:32Z |
Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation
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Chang, Yuan-Wei; Cheng, Yin; Helfen, Lukas; Xu, Feng; Tian, Tian; Scheel, Mario; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo |
| 國立交通大學 |
2019-04-03T06:38:02Z |
Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu
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Liu, Chien-Min; Lin, Han-Wen; Huang, Yi-Sa; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, King-Ning |
| 國立交通大學 |
2019-04-02T06:00:14Z |
Homogeneous Nucleation of Epitaxial CoSi2 and NiSi in Si Nanowires
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Chou, Yi-Chia; Wu, Wen-Wei; Chen, Lih-Juann; Tu, King-Ning |
| 國立交通大學 |
2019-04-02T05:59:39Z |
Heterogeneous and Homogeneous Nucleation of Epitaxial NiSi2 in [110] Si Nanowires
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Chou, Yi-Chia; Wu, Wen-Wei; Lee, Chung-Yang; Liu, Chun-Yi; Chen, Lih-Juann; Tu, King-Ning |
| 國立交通大學 |
2018-08-21T05:56:50Z |
Study of Discrete Voids Formation in Flip-Chip Solder Joints due to Electromigration Using In-Situ 3D Laminography and Finite-Element Modeling
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Chang, Yuan-Wei; Cheng, Yin; Xu, Feng; Helfen, Lukas; Tian, Tian; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo |
| 國立交通大學 |
2018-08-21T05:56:49Z |
Low temperature Cu-Cu direct bonding by (111) oriented nano-twin Cu
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Juang, Jing-Ye; Chu, Yi-Cheng; Lu, Chia-Ling; Chen, Chih; Tu, King-Ning |
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