| 國立交通大學 |
2020-07-01T05:21:22Z |
Tensile Properties of < 111 >-Oriented Nanotwinned Cu with Different Columnar Grain Structures
|
Li, Yu-Jin; Tu, King-Ning; Chen, Chih |
| 國立交通大學 |
2020-03-01 |
Tensile Properties and Thermal Stability of Unidirectionally < 111 >-Oriented Nanotwinned and < 110 >-Oriented Microtwinned Copper
|
Li, Yu-Jin; Chen, Chih; Tu, King-Ning |
| 國立交通大學 |
2019-04-03T06:44:31Z |
Formation Mechanism of Porous Cu3Sn Intermetallic Compounds by High Current Stressing at High Temperatures in Low-Bump-Height Solder Joints
|
Lin, Jie-An; Lin, Chung-Kuang; Liu, Chen-Min; Huang, Yi-Sa; Chen, Chih; Chu, David T.; Tu, King-Ning |
| 國立交通大學 |
2019-04-03T06:42:01Z |
Intermetallic compounds in 3D integrated circuits technology: a brief review
|
Annuar, Syahira; Mahmoodian, Reza; Hamdi, Mohd; Tu, King-Ning |
| 國立交通大學 |
2019-04-03T06:41:32Z |
Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation
|
Chang, Yuan-Wei; Cheng, Yin; Helfen, Lukas; Xu, Feng; Tian, Tian; Scheel, Mario; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo |
| 國立交通大學 |
2019-04-03T06:38:02Z |
Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu
|
Liu, Chien-Min; Lin, Han-Wen; Huang, Yi-Sa; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, King-Ning |
| 國立交通大學 |
2019-04-02T06:00:14Z |
Homogeneous Nucleation of Epitaxial CoSi2 and NiSi in Si Nanowires
|
Chou, Yi-Chia; Wu, Wen-Wei; Chen, Lih-Juann; Tu, King-Ning |
| 國立交通大學 |
2019-04-02T05:59:39Z |
Heterogeneous and Homogeneous Nucleation of Epitaxial NiSi2 in [110] Si Nanowires
|
Chou, Yi-Chia; Wu, Wen-Wei; Lee, Chung-Yang; Liu, Chun-Yi; Chen, Lih-Juann; Tu, King-Ning |
| 國立交通大學 |
2018-08-21T05:56:50Z |
Study of Discrete Voids Formation in Flip-Chip Solder Joints due to Electromigration Using In-Situ 3D Laminography and Finite-Element Modeling
|
Chang, Yuan-Wei; Cheng, Yin; Xu, Feng; Helfen, Lukas; Tian, Tian; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo |
| 國立交通大學 |
2018-08-21T05:56:49Z |
Low temperature Cu-Cu direct bonding by (111) oriented nano-twin Cu
|
Juang, Jing-Ye; Chu, Yi-Cheng; Lu, Chia-Ling; Chen, Chih; Tu, King-Ning |
| 國立交通大學 |
2017-04-21T06:55:33Z |
Optimization of the nanotwin-induced zigzag surface of copper by electromigration
|
Chen, Hsin-Ping; Huang, Chun-Wei; Wang, Chun-Wen; Wu, Wen-Wei; Liao, Chien-Neng; Chen, Lih-Juann; Tu, King-Ning |
| 國立交通大學 |
2017-04-21T06:55:10Z |
Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling
|
Chang, Yuan-Wei; Cheng, Yin; Xu, Feng; Helfen, Lukas; Tian, Tian; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo |
| 國立交通大學 |
2017-04-21T06:48:31Z |
Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging
|
Chiu, Wei-Lan; Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning |
| 國立交通大學 |
2015-07-21T11:20:25Z |
Extremely anisotropic single-crystal growth in nanotwinned copper
|
Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning |
| 國立交通大學 |
2015-07-21T08:28:39Z |
Materials challenges in three-dimensional integrated circuits
|
Chen, Kuan-Neng; Tu, King-Ning |
| 國立交通大學 |
2015-05-12T02:59:51Z |
SINGLE CRYSTAL COPPER, MANUFACTURING METHOD THEREOF AND SUBSTRATE COMPRISING THE SAME
|
CHEN Chih; TU King-Ning; LU Chia-Ling |
| 國立交通大學 |
2014-12-16T06:16:14Z |
Process for protecting solder joints and structure for alleviating electromigration and joule heating in solder joints
|
Chen, Chih; Yeh, Everett Chang-Ching; Tu, King-Ning |
| 國立交通大學 |
2014-12-16T06:15:02Z |
SPECIMEN BOX FOR ELECTRON MICROSCOPE
|
CHEN Chih; TU King-Ning |
| 國立交通大學 |
2014-12-16T06:15:02Z |
SPECIMEN BOX FOR ELECTRON MICROSCOPE
|
CHEN Chih; Tu King-Ning |
| 國立交通大學 |
2014-12-16T06:15:01Z |
METHOD FOR INHIBITING GROWTH OF INTERMETALLIC COMPOUNDS
|
CHEN Chih; TU King-Ning; HSIAO Hsiang-Yao |
| 國立交通大學 |
2014-12-16T06:14:59Z |
Electrodeposited Nano-Twins Copper Layer and Method of Fabricating the Same
|
CHEN Chih; TU King-Ning; LIU Taochi |
| 國立交通大學 |
2014-12-16T06:14:03Z |
Specimen box for electron microscope
|
Chen Chih; Tu King-Ning |
| 國立交通大學 |
2014-12-16T06:13:57Z |
Specimen box for electron microscope
|
Chen Chih; Tu King-Ning |
| 國立交通大學 |
2014-12-16T06:13:48Z |
Method for inhibiting growth of intermetallic compounds
|
Chen Chih; Tu King-Ning; Hsiao Hsiang-Yao |
| 國立交通大學 |
2014-12-08T15:37:37Z |
Heterogeneous and Homogeneous Nucleation of Epitaxial NiSi(2) in [110] Si Nanowires
|
Chou, Yi-Chia; Wu, Wen-Wei; Lee, Chung-Yang; Liu, Chun-Yi; Chen, Lih-Juann; Tu, King-Ning |
