| 國立交通大學 |
2017-04-21T06:55:33Z |
Optimization of the nanotwin-induced zigzag surface of copper by electromigration
|
Chen, Hsin-Ping; Huang, Chun-Wei; Wang, Chun-Wen; Wu, Wen-Wei; Liao, Chien-Neng; Chen, Lih-Juann; Tu, King-Ning |
| 國立交通大學 |
2017-04-21T06:55:10Z |
Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling
|
Chang, Yuan-Wei; Cheng, Yin; Xu, Feng; Helfen, Lukas; Tian, Tian; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo |
| 國立交通大學 |
2017-04-21T06:48:31Z |
Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging
|
Chiu, Wei-Lan; Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning |
| 國立交通大學 |
2015-07-21T11:20:25Z |
Extremely anisotropic single-crystal growth in nanotwinned copper
|
Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning |
| 國立交通大學 |
2015-07-21T08:28:39Z |
Materials challenges in three-dimensional integrated circuits
|
Chen, Kuan-Neng; Tu, King-Ning |
| 國立交通大學 |
2015-05-12T02:59:51Z |
SINGLE CRYSTAL COPPER, MANUFACTURING METHOD THEREOF AND SUBSTRATE COMPRISING THE SAME
|
CHEN Chih; TU King-Ning; LU Chia-Ling |
| 國立交通大學 |
2014-12-16T06:16:14Z |
Process for protecting solder joints and structure for alleviating electromigration and joule heating in solder joints
|
Chen, Chih; Yeh, Everett Chang-Ching; Tu, King-Ning |
| 國立交通大學 |
2014-12-16T06:15:02Z |
SPECIMEN BOX FOR ELECTRON MICROSCOPE
|
CHEN Chih; TU King-Ning |
| 國立交通大學 |
2014-12-16T06:15:02Z |
SPECIMEN BOX FOR ELECTRON MICROSCOPE
|
CHEN Chih; Tu King-Ning |
| 國立交通大學 |
2014-12-16T06:15:01Z |
METHOD FOR INHIBITING GROWTH OF INTERMETALLIC COMPOUNDS
|
CHEN Chih; TU King-Ning; HSIAO Hsiang-Yao |
| 國立交通大學 |
2014-12-16T06:14:59Z |
Electrodeposited Nano-Twins Copper Layer and Method of Fabricating the Same
|
CHEN Chih; TU King-Ning; LIU Taochi |
| 國立交通大學 |
2014-12-16T06:14:03Z |
Specimen box for electron microscope
|
Chen Chih; Tu King-Ning |
| 國立交通大學 |
2014-12-16T06:13:57Z |
Specimen box for electron microscope
|
Chen Chih; Tu King-Ning |
| 國立交通大學 |
2014-12-16T06:13:48Z |
Method for inhibiting growth of intermetallic compounds
|
Chen Chih; Tu King-Ning; Hsiao Hsiang-Yao |
| 國立交通大學 |
2014-12-08T15:37:37Z |
Heterogeneous and Homogeneous Nucleation of Epitaxial NiSi(2) in [110] Si Nanowires
|
Chou, Yi-Chia; Wu, Wen-Wei; Lee, Chung-Yang; Liu, Chun-Yi; Chen, Lih-Juann; Tu, King-Ning |
| 國立交通大學 |
2014-12-08T15:30:49Z |
The preferential growth of eta-Cu6Sn5 on (111) uni-directional Cu pads
|
Lin, Han-wen; Lu, Jia-ling; Liu, Chen-min; Chen, Chih; Tu, King-ning; Chen, Delphic; Kuo, Jui-Chao |
| 國立交通大學 |
2014-12-08T15:29:09Z |
Eliminate Kirkendall voids in solder reactions on nanotwinned copper
|
Liu, Tao-Chi; Liu, Chien-Min; Huang, Yi-Sa; Chen, Chih; Tu, King-Ning |
| 國立交通大學 |
2014-12-08T15:10:54Z |
Failure induced by thermomigration of interstitial Cu in Pb-free flip chip solder joints
|
Chen, Hsiao-Yun; Chen, Chih; Tu, King-Ning |
| 國立交通大學 |
2014-12-08T15:09:20Z |
Homogeneous Nucleation of Epitaxial CoSi(2) and NiSi in Si Nanowires
|
Chou, Yi-Chia; Wu, Wen-Wei; Chen, Lih-Juann; Tu, King-Ning |
| 國立成功大學 |
2014-10 |
Extremely anisotropic single-crystal growth in nanotwinned copper
|
Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning |
| 國立成功大學 |
2013-03 |
Formation of Epitaxial Silicide in Silicon Nanowires
|
Chou, Yi-Chia; Lu, Kuo-Chang; Tu, King-Ning |
| 國立成功大學 |
2011-06-09 |
The Influence of Surface Oxide on the Growth of Metal/Semiconductor Nanowires
|
Lu, Kuo-Chang; Wu, Wen-Wei; Hao Ouyang; Lin, Yung-Chen; Huang, Yu; Wang, Chun-Wen; Wu, Zheng-Wei; Huang, Chun-Wei; Chen, Lih J.; Tu, King-Ning |
