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Institution Date Title Author
臺大學術典藏 2018-09-10T05:56:11Z In-vacuum cleaving and coating of semiconductor laser facets using thin silicon and a dielectric Tu, L Wu;Schubert, EF;Hong, M;Zydzik, GJ; Tu, L Wu; Schubert, EF; Hong, M; Zydzik, GJ; MINGHWEI HONG
臺大學術典藏 2018-09-10T05:56:11Z In-vacuum cleaving and coating of semiconductor laser facets using thin silicon and a dielectric Tu, L Wu;Schubert, EF;Hong, M;Zydzik, GJ; Tu, L Wu; Schubert, EF; Hong, M; Zydzik, GJ; MINGHWEI HONG

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