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Institution Date Title Author
國立交通大學 2017-04-21T06:50:04Z Generic Rules to Achieve Bump Electromigration Immortality for 3D IC Integration Chen, Hsiao-Yun; Shih, Da-Yuan; Wei, Cheng-Chang; Tung, Chih-Hang; Hsiao, Yi-Li; Yu, Douglas Cheng-Hua; Liang, Yu-Chun; Chen, Chih
國立交通大學 2017-04-21T06:49:13Z Electromigration Immortality of Purely Intermetallic Micro -bump for 3D Integration Chen, Hsiao-Yun; Tung, Chih-Hang; Hsiao, Yi-Li; Wu, Jyun-lin; Yeh, Tung-Ching; Lin, Larry Liang-Chen; Chen, Chih; Yu, Douglas Cheng-Hua

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