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Showing items 1-25 of 205 (9 Page(s) Totally)
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Institution	Date	Title	Author
臺大學術典藏	2022-06-21T23:23:45Z	Evaporating and Sputtering of High-Density Ag Nanotwinned Films on GaAs Compound Semiconductor Wafers	Lee, Pei Ing; Chen, Yin Hsuan; Wu, Po Ching; TUNG-HAN CHUANG
臺大學術典藏	2022-05-21T23:36:03Z	Atomic Migration of Cu on the Surface of Si/Ti/Ni/Cu/Ag Thin Films	Lee, Pei Ing; Wu, Po Ching; TUNG-HAN CHUANG
臺大學術典藏	2022-05-21T23:36:03Z	Microstructure evolution and failure mechanism of electromigration in Ag-alloy bonding wire	CHUN-HAO CHEN; Lee, Pei Ing; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:54Z	Effects of adding active elements to aluminum-based filler alloys on the bonding of 6061 aluminum alloy and alumina	Sun Y.-K;Chang S.-Y;Tsao L.-C;Chuang T.-H;Zhang G.-Z;Yeh C.-Y.; Sun Y.-K; Chang S.-Y; Tsao L.-C; Chuang T.-H; Zhang G.-Z; Yeh C.-Y.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:54Z	Effect of post-weld heat treatment on the solid-state diffusion bonding of 6061 aluminum alloy	Chen C.-H;Sun Y.-K;Lai Y.-C;Chang S.-Y;Chuang T.-H.; Chen C.-H; Sun Y.-K; Lai Y.-C; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:53Z	Evaporation of Ag Nanotwinned Films on Si Substrates with Ion Beam Assistance	Wu P.-C;Chuang T.-H.; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:53Z	Enhancing effect of substrate bias on nanotwin formation of sputtered Ag thin films	Wu P.-C;Lai Y.-C;Chuang T.-H.; Wu P.-C; Lai Y.-C; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:53Z	Effects of Grain Size on the Ag Dissolution and Ion Migration of Ag-4Pd Alloy Wires	Lin Y.-C;Lee P.-I;Wu P.-C;Chen C.-H;Chuang T.-H.; Lin Y.-C; Lee P.-I; Wu P.-C; Chen C.-H; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:52Z	Effects of Grain Size on the Ag Dissolution and Ion Migration of Ag-4Pd Alloy Wires	Lin Y.-C;Lee P.-I;Wu P.-C;Chen C.-H;Chuang T.-H.; Lin Y.-C; Lee P.-I; Wu P.-C; Chen C.-H; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:52Z	Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes	Chen C.-H;Lee P.-I;Yeh W.-T;Chuang T.-H.; Chen C.-H; Lee P.-I; Yeh W.-T; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:52Z	Effects of adding active elements to aluminum-based filler alloys on the bonding of 6061 aluminum alloy and alumina	Sun Y.-K;Chang S.-Y;Tsao L.-C;Chuang T.-H;Zhang G.-Z;Yeh C.-Y.; Sun Y.-K; Chang S.-Y; Tsao L.-C; Chuang T.-H; Zhang G.-Z; Yeh C.-Y.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:52Z	Formation of High Density ?111? Textured Nanotwins in Evaporated Ag Thin Films Through Post-Deposition Ion Bombardment	Lee P.-I;Wu P.-C;Chuang T.-H.; Lee P.-I; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:52Z	Effect of post-weld heat treatment on the solid-state diffusion bonding of 6061 aluminum alloy	Chen C.-H;Sun Y.-K;Lai Y.-C;Chang S.-Y;Chuang T.-H.; Chen C.-H; Sun Y.-K; Lai Y.-C; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:52Z	Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper	Tsao L.-C;Li C.-K;Sun Y.-K;Chang S.-Y;Chuang T.-H.; Tsao L.-C; Li C.-K; Sun Y.-K; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:51Z	Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper	Tsao L.-C;Li C.-K;Sun Y.-K;Chang S.-Y;Chuang T.-H.; Tsao L.-C; Li C.-K; Sun Y.-K; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:51Z	Evaporation of Ag Nanotwinned Films on Si Substrates with Ion Beam Assistance	Wu P.-C;Chuang T.-H.; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:51Z	Enhancing effect of substrate bias on nanotwin formation of sputtered Ag thin films	Wu P.-C;Lai Y.-C;Chuang T.-H.; Wu P.-C; Lai Y.-C; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:51Z	Thermal stability of grain structure for Ag nanotwinned films sputtered with substrate bias	Lai Y.-C;Wu P.-C;Chuang T.-H.; Lai Y.-C; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:50Z	Thermal stability of grain structure for Ag nanotwinned films sputtered with substrate bias	Lai Y.-C;Wu P.-C;Chuang T.-H.; Lai Y.-C; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:50Z	Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes	Chen C.-H;Lee P.-I;Yeh W.-T;Chuang T.-H.; Chen C.-H; Lee P.-I; Yeh W.-T; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:30:50Z	Formation of High Density ?111? Textured Nanotwins in Evaporated Ag Thin Films Through Post-Deposition Ion Bombardment	Lee P.-I;Wu P.-C;Chuang T.-H.; Lee P.-I; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:27:52Z	Effects of adding active elements to aluminum-based filler alloys on the bonding of 6061 aluminum alloy and alumina	Sun Y.-K;Chang S.-Y;Tsao L.-C;Chuang T.-H;Zhang G.-Z;Yeh C.-Y.; Sun Y.-K; Chang S.-Y; Tsao L.-C; Chuang T.-H; Zhang G.-Z; Yeh C.-Y.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:27:52Z	Effect of post-weld heat treatment on the solid-state diffusion bonding of 6061 aluminum alloy	Chen C.-H;Sun Y.-K;Lai Y.-C;Chang S.-Y;Chuang T.-H.; Chen C.-H; Sun Y.-K; Lai Y.-C; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:27:51Z	Enhancing effect of substrate bias on nanotwin formation of sputtered Ag thin films	Wu P.-C;Lai Y.-C;Chuang T.-H.; Wu P.-C; Lai Y.-C; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2022-03-22T08:27:51Z	Effects of Grain Size on the Ag Dissolution and Ion Migration of Ag-4Pd Alloy Wires	Lin Y.-C;Lee P.-I;Wu P.-C;Chen C.-H;Chuang T.-H.; Lin Y.-C; Lee P.-I; Wu P.-C; Chen C.-H; Chuang T.-H.; TUNG-HAN CHUANG

Showing items 1-25 of 205 (9 Page(s) Totally)
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View [10|25|50] records per page

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