| 臺大學術典藏 |
2022-03-22T08:27:51Z |
Evaporation of Ag Nanotwinned Films on Si Substrates with Ion Beam Assistance
|
Wu P.-C;Chuang T.-H.; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:27:50Z |
Thermal stability of grain structure for Ag nanotwinned films sputtered with substrate bias
|
Lai Y.-C;Wu P.-C;Chuang T.-H.; Lai Y.-C; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:27:50Z |
Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes
|
Chen C.-H;Lee P.-I;Yeh W.-T;Chuang T.-H.; Chen C.-H; Lee P.-I; Yeh W.-T; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:27:50Z |
Formation of High Density ?111? Textured Nanotwins in Evaporated Ag Thin Films Through Post-Deposition Ion Bombardment
|
Lee P.-I;Wu P.-C;Chuang T.-H.; Lee P.-I; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:27:50Z |
Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper
|
Tsao L.-C;Li C.-K;Sun Y.-K;Chang S.-Y;Chuang T.-H.; Tsao L.-C; Li C.-K; Sun Y.-K; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-01-22T00:04:06Z |
Evaporation of Ag Nanotwinned Films on Si Substrates with Ion Beam Assistance
|
Wu, Po Ching; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-12-21T23:16:55Z |
Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper
|
Tsao, Lung Chuan; Li, Cheng Kai; Sun, Yu Kai; Chang, Shih Ying; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-12-21T23:16:55Z |
Formation of High Density <111> Textured Nanotwins in Evaporated Ag Thin Films through Post-deposition Ion Bombardment
|
Lee, Pei Ing; Wu, Po Ching; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-11-21T23:18:55Z |
Effects of adding active elements to aluminum-based filler alloys on the bonding of 6061 aluminum alloy and alumina
|
Sun, Yu Kai; Chang, Shih Ying; Tsao, Lung Chuan; TUNG-HAN CHUANG; Zhang, Guo Zhan; Yeh, Chih Yi |
| 臺大學術典藏 |
2021-11-21T23:18:55Z |
Effect of post-weld heat treatment on the solid-state diffusion bonding of 6061 aluminum alloy
|
CHUN-HAO CHEN; Sun, Yu Kai; Lai, Yu Chang; Chang, Shih Ying; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-11-21T23:18:55Z |
Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes
|
CHUN-HAO CHEN; Lee, Pei Ing; Yeh, Wei Ting; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-09-21T23:19:31Z |
Thermal stability of grain structure for Ag nanotwinned films sputtered with substrate bias
|
Lai, Yu Chang; Wu, Po Ching; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-08-21T23:58:54Z |
Effects of Grain Size on the Ag Dissolution and Ion Migration of Ag-4Pd Alloy Wires
|
Lin, Yan Cheng; Lee, Pei Ing; Wu, Po Ching; CHUN-HAO CHEN; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-08-21T23:58:54Z |
Enhancing effect of substrate bias on nanotwin formation of sputtered Ag thin films
|
Wu, Po Ching; Lai, Yu Chang; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-08-05T02:41:05Z |
An Optimized Ag-5Pd-3.5Au Bonding Wire for the Resistance of Ag Ion Migration in LED Packages
|
Chuang T.-H;Lee P.-I;Lin Y.-C.; Chuang T.-H; Lee P.-I; Lin Y.-C.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-08-05T02:41:04Z |
Grain growth and twin formation in a Ag-4Pd alloy ribbon after annealing treatments
|
Chen C.-H;Lai Y.-C;Chuang T.-H.; Chen C.-H; Lai Y.-C; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-08-05T02:41:04Z |
Deposition of (111)-oriented Ag nano-twinned film on (111) Si wafer
|
Wu P.-C;Lee P.-I;Lai Y.-C;Lin Y.-C;Chuang T.-H.; Wu P.-C; Lee P.-I; Lai Y.-C; Lin Y.-C; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-08-05T02:41:04Z |
Corrosion and ion migration of Ag-alloy bonding wires with various Pd and Au contents
|
Chen C.-H;Lin Y.-C;Tsai C.-H;Wang S.-C;Tsai H.-H;Chuang T.-H.; Chen C.-H; Lin Y.-C; Tsai C.-H; Wang S.-C; Tsai H.-H; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-08-05T02:41:04Z |
Characterization of interfacial structure for low-temperature direct bonding of Si substrates sputtered with Ag nanotwinned films
|
Lai Y.-C;Wu P.-C;Chuang T.-H.; Lai Y.-C; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-08-05T02:41:04Z |
Interfacial reactions in Zn4Sb3/titanium diffusion couples
|
Chen C.-H;Yeh W.-T;Chuang T.-H.; Chen C.-H; Yeh W.-T; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-08-05T02:41:03Z |
The structures and thermoelectric properties of Zn-Sb alloy films fabricated by electron beam evaporation through an ion beam assisted deposition
|
Hsu S.-C;Hong J.-Y;Chen C.-L;Chen S.-C;Zhen J.-H;Hsieh W.-P;Chen Y.-Y;Chuang T.-H.; Hsu S.-C; Hong J.-Y; Chen C.-L; Chen S.-C; Zhen J.-H; Hsieh W.-P; Chen Y.-Y; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-08-05T02:41:03Z |
Sputtering of Ag (111) nanotwinned films on Si (100) wafers for backside metallization of power devices
|
Wu P.-C;Lai Y.-C;Lee P.-I;Chiang M.-T;Chou J;Chuang T.-H.; Wu P.-C; Lai Y.-C; Lee P.-I; Chiang M.-T; Chou J; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-04-21T23:29:53Z |
Characterization of interfacial structure for low-temperature direct bonding of Si substrates sputtered with Ag nanotwinned films
|
Lai, Yu Chang; Wu, Po Ching; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-02-04T02:48:59Z |
p-type semi-transparent conductive NiO films with high deposition rate produced by superimposed high power impulse magnetron sputtering
|
Chuang, T.-H.; Wen, C.-K.; Chen, S.-C.; Liao, M.-H.; Liu, F.; Sun, H.; Chuang, T.-H.; Wen, C.-K.; Chen, S.-C.; Liao, M.-H.; Liu, F.; Sun, H.; MING-HAN LIAO; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-02-02T09:21:29Z |
Grain growth and twin formation in a Ag-4Pd alloy ribbon after annealing treatments
|
CHUN-HAO CHEN; Lai, Yu Chang; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-01-19T12:08:26Z |
An Optimized Ag-5Pd-3.5Au Bonding Wire for the Resistance of Ag Ion Migration in LED Packages
|
TUNG-HAN CHUANG; Lee, Pei Ing; Lin, Yan Cheng |
| 臺大學術典藏 |
2020-05-12T02:53:30Z |
Synergistic effects of wear and corrosion for Al2O3 particulate-reinforced 6061 aluminum matrix composites
|
Fang, C. K.; Huang, C. C.; Chuang, T. H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:30Z |
Recent research and development activities on superplasticity in Taiwan
|
Huang, J. C.; Chuang, T. H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Observations of fracture surface chemistry on Cu-0.5 At. % Sb bicrystals
|
Chuang, T.H.; Gust, W.; Heldt, L.A.; Hintz, M.B.; Hofmann, S.; Lučić, R.; Predel, B.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Diffusion Soldering of Bi0.5Sb1.5Te3 Thermoelectric Material with Cu Electrode
|
Yang, C. L.; Lai, H. J.; Hwang, J. D.; Chuang, T. H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates
|
Wang, S. S.; Tseng, Y. H.; Chuang, T. H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages (vol 33, pg 171, 2004)
|
TUNG-HAN CHUANG; Yen, S. F.; Chuang, T. H.; Chang, S. Y.; Cheng, M. D. |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Plasma-enhanced chemical-vapor deposition oxide prepared at low-flow conditions for course wavelength-division multiplexing optical-waveguide devices
|
Chu, A. K.; Lin, J. Y.; Wang, M. L.; Fan, C. C.; Shue, H. S.; Chuang, T. H.; Chen, S. Y.; Chiu, C. H.; Lin, S. F.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:28Z |
Nontraditional grain refinement through phase transformation in an Al-Zn alloy
|
Chuang, T.-W.; Chen, S.-J.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:28Z |
Discontinuous coarsening of discontinuous precipitate in a Ni-7.5 at.% In alloy
|
Chuang, T.H.; Fournelle, R.A.; Gust, W.; Predel, B.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:28Z |
The morphology of discontinuous precipitation on the surface of NiIn and NiSn alloys
|
Chuang, T.H.; Fournelle, R.A.; Gust, W.; Predel, B.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:28Z |
Electrical and Magnetic Studies on Grain Boundary Segregation in a NI-3AT.%Sn Alloy
|
Yao, Y.D.; Chuang, T.H.; Lee, C.K.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:28Z |
Discontinuous coarsening and dissolution in an Fe13.5at.%Zn solid solution
|
Chuang, T.-H.; Gust, W.; Predel, B.; Fournelle, R.A.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:27Z |
The mutual effects of boron, zirconium and aluminium on grain boundary segregation in Ni3Al intermetallic compounds
|
Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:27Z |
Grain boundary pest of boron- doped Niin3Al at 1200 °C
|
Chuang, T.H.; Pan, Y.C.; Hsu, S.E.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:27Z |
Magnetization study on grain-boundary precipitation in a Ni-8 at. % Sn alloy
|
Yao, Y.D.; Chen, Y.Y.; Li, T.J.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:27Z |
Electrical Resistivity of Nickel‐Rich Nickel‐Indium Alloys between 10 and 800 K
|
Tzeng, S.J.; Yao, Y.D.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:27Z |
Electrical resistivity, magnetization, and grain boundary precipitates in NiSn alloys
|
Yao, Y.D.; Chen, Y.Y.; Tzeng, S.J.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:26Z |
Low-pressure diffusion bonding of SAE 316 stainless steel by inserting a superplastic interlayer
|
Yeh, M.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:26Z |
Grain boundary melting of hafnium containing Ni3Al intermetallic compounds
|
Chang, T.T.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:26Z |
On the mechanisms of high-temperature intergranular embrittlements of Ni3Al-Zr Alloys
|
Chuang, T.H.; Pan, Y.C.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:26Z |
Electrical resistivity, magnetization, and grain-boundary precipitate in nickel-rich nickel-indium alloys
|
Yao, Y.D.; Chen, Y.Y.; Chuang, T.H.; Kung, C.; Lin, C.J.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:26Z |
Evaluation of the superplastic formability of SP-inconel 718 superalloy
|
Yeh, M.S.; Tsau, C.W.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:26Z |
Long-term oxidation behaviour of Ni3Al alloys with and without chromium additions
|
TUNG-HAN CHUANG; Yao, Y.D.; Chuang, T.H.; Pan, Y.C. |
| 臺大學術典藏 |
2020-05-12T02:53:25Z |
Atmospheric stress corrosion cracking of a superplastic 7475 aluminum alloy
|
Tsai, T.C.; Chuang, T.H.; TUNG-HAN CHUANG |
