| 臺大學術典藏 |
2020-05-12T02:53:12Z |
Intermetallic reactions in reflowed and aged Sn-58Bi BGA packages with Au/Ni/Cu pads
|
Chi, C.C.; Tsao, L.C.; Tsao, C.W.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:12Z |
Low temperature bonding of alumina/alumina and alumina/copper in air using Sn3.5Ag4Ti(Ce,Ga) filler
|
Chang, S.Y.; Chuang, T.H.; Yang, C.L.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:12Z |
Electromigration in the flip chip solder joint of Sn-8Zn-3Bi on copper pads
|
TUNG-HAN CHUANG; Tu, K.N.; Chuang, T.H.; Lin, S.Z.; Wu, A.T.; Lin, W.H. |
| 臺大學術典藏 |
2020-05-12T02:53:11Z |
Intermetallic reactions in a Sn-51In solder BGA package with immersion Ag surface finish
|
Jain, C.-C.; Wang, S.-S.; Wu, H.-M.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:11Z |
Low temperature direct electroless nickel plating on silicon wafer
|
TUNG-HAN CHUANG; Yang, S.-R.; Chuang, T.-H.; Wang, S.-S.; Jain, C.-C. |
| 臺大學術典藏 |
2020-05-12T02:53:11Z |
Fatigue life evaluation of ball grid array packages with Sn-Ag-Cu and rare-earth addition solder under cyclic bending test
|
Cheng, C.-Y.; Zhan, C.-J.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:11Z |
Size effect of rare-earth intermetallics in Sn-9Zn-0.5Ce and Sn-3Ag-0.5Cu-0.5Ce solders on the growth of tin whiskers
|
TUNG-HAN CHUANG; Chuang, T.H.; Lin, H.J. |
| 臺大學術典藏 |
2020-05-12T02:53:10Z |
Joining 6061 aluminum alloy with Al-Si-Cu filler metals
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Chang, S.Y.; Tsao, L.C.; Li, T.Y.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:10Z |
Intermetallic compounds formed in In-3Ag solder BGA packages with ENIG and ImAg surface finishes
|
Chuang, T.H.; Jain, C.C.; Wang, S.S.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:10Z |
Effect of adding Ge on rapid whisker growth of Sn-3Ag-0.5Cu-0.5Ce alloy
|
Chuang, T.-H.; Chi, C.-C.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:10Z |
Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads
|
Jain, C.C.; Wang, S.S.; Huang, K.W.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:10Z |
Electromigration of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-0.2Zn solder joints with Au/Ni(P)/Cu and Ag/Cu pads
|
Lin, H.-J.; Lin, J.-S.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:10Z |
Inhibition of whisker growth on the surface of Sn-3Ag-0.5Cu-0.5Ce solder alloyed with Zn
|
Chuang, T.-H.; Lin, H.-J.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:09Z |
Thermal stability of grain structure and material properties in an annealing-twinned Ag-8Au-3Pd alloy wire
|
Chuang, T.-H.; Wang, H.-C.; Tsai, C.-H.; Chang, C.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:09Z |
Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder
|
Chang, S.Y.; Jain, C.C.; Chuang, T.H.; Feng, L.P.; Tsao, L.C.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:09Z |
The inhibition of tin whiskers on the surface of Sn-8Zn-3Bi-0.5Ce solders
|
Chuang, T.H.; Lai, H.J.; Chen, C.L.; Jain, C.C.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:09Z |
Morphology of the tin whiskers on the surface of a Sn-3Ag-0.5Cu-0.5Nd alloy
|
Chuang, T.-H.; Jain, C.-C.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:08Z |
Effect of annealing twins on electromigration in Ag-8Au-3Pd bonding wires
|
Chuang, T.-H.; Wang, H.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:08Z |
Diffusion soldering of Pb-doped gete thermoelectric modules with Cu electrodes using a thin-film Sn interlayer
|
Yang, C.L.; Lai, H.J.; Hwang, J.D.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:08Z |
Formation and growth of intermetallics in an annealing-twinned Ag-8Au-3Pd wire bonding package during reliability tests
|
Chuang, T.-H.; Chang, C.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:08Z |
Dual-phase solid-liquid interdiffusion bonding, a solution for the die attachment of WBG
|
TUNG-HAN CHUANG;Lo, W.-C.;Chuang, T.-H.;Chang, J.-Y.;Chang, T.-C.; Chang, T.-C.; Chang, J.-Y.; Chuang, T.-H.; Lo, W.-C.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:08Z |
Dual-phase solid-liquid interdiffusion bonding, a solution for the die attachment of WBG
|
TUNG-HAN CHUANG;Lo, W.-C.;Chuang, T.-H.;Chang, J.-Y.;Chang, T.-C.; Chang, T.-C.; Chang, J.-Y.; Chuang, T.-H.; Lo, W.-C.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:08Z |
Effects of annealing twins on the grain growth and mechanical properties of Ag-8Au-3Pd bonding wires
|
Chuang, T.-H.; Tsai, C.-H.; Wang, H.-C.; Chang, C.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:08Z |
An innovative annealing-twinned Ag-Au-Pd bonding wire for IC and LED packaging
|
Tsai, H.-H.; Lee, J.-D.; Tsai, C.-H.; Wang, H.-C.; Chang, C.-C.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:07Z |
Durability to Electromigration of an Annealing-Twinned Ag-4Pd Alloy Wire Under Current Stressing
|
Chuang, T.-H.; Lin, H.-J.; Chuang, C.-H.; Tsai, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG |
