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机构 日期 题名 作者
臺大學術典藏 2020-05-12T02:53:10Z Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads Jain, C.C.; Wang, S.S.; Huang, K.W.; Chuang, T.H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:10Z Electromigration of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-0.2Zn solder joints with Au/Ni(P)/Cu and Ag/Cu pads Lin, H.-J.; Lin, J.-S.; Chuang, T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:10Z Inhibition of whisker growth on the surface of Sn-3Ag-0.5Cu-0.5Ce solder alloyed with Zn Chuang, T.-H.; Lin, H.-J.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:09Z Thermal stability of grain structure and material properties in an annealing-twinned Ag-8Au-3Pd alloy wire Chuang, T.-H.; Wang, H.-C.; Tsai, C.-H.; Chang, C.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:09Z Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder Chang, S.Y.; Jain, C.C.; Chuang, T.H.; Feng, L.P.; Tsao, L.C.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:09Z The inhibition of tin whiskers on the surface of Sn-8Zn-3Bi-0.5Ce solders Chuang, T.H.; Lai, H.J.; Chen, C.L.; Jain, C.C.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:09Z Morphology of the tin whiskers on the surface of a Sn-3Ag-0.5Cu-0.5Nd alloy Chuang, T.-H.; Jain, C.-C.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:08Z Effect of annealing twins on electromigration in Ag-8Au-3Pd bonding wires Chuang, T.-H.; Wang, H.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:08Z Diffusion soldering of Pb-doped gete thermoelectric modules with Cu electrodes using a thin-film Sn interlayer Yang, C.L.; Lai, H.J.; Hwang, J.D.; Chuang, T.H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:08Z Formation and growth of intermetallics in an annealing-twinned Ag-8Au-3Pd wire bonding package during reliability tests Chuang, T.-H.; Chang, C.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG

显示项目 146-155 / 205 (共21页)
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