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"tung han chuang"的相关文件
显示项目 191-205 / 205 (共9页)
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| 臺大學術典藏 |
2020-05-12T02:53:01Z |
Atomic replacement effects on the band structure of doped perovskite thin films
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Cheng, S.L.; Du, C.H.; Chuang, T.H.; Lin, J.G.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:01Z |
Au-induced improvements in the grain stability and mechanical properties of Ag-based alloy wires under electrical current stressing
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Kuo, B.-H.; Tsai, D.-C.; Huang, Y.-L.; Hsu, P.-C.; Chuang, T.-H.; Lee, J.-D.; Tsai, H.-H.; Shieu, F.-S.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:01Z |
Effect of alloying Au on the microstructural, mechanical and electrical properties of Ag-based alloy wires
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Kuo, B.-H.; Tsai, D.-C.; Huang, Y.-L.; Hsu, P.-C.; Chuang, T.-H.; Lee, J.-D.; Tsai, H.-H.; Shieu, F.-S.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:01Z |
Comparison of microstructural and optoelectronic properties of NiO:Cu thin films deposited by ion-beam assisted rf sputtering in different gas atmospheres
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Wen, C.-K.; Xin, Y.-Q.; Chen, S.-C.; Chuang, T.-H.; Chen, P.-J.; Sun, H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:01Z |
Electrical and magnetic properties of (Al, Co) co-doped ZnO films deposited by RF magnetron sputtering
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Sun, H.; Chen, S.-C.; Wang, C.-H.; Lin, Y.-W.; Wen, C.-K.; Chuang, T.-H.; Wang, X.; Lin, S.-S.; Dai, M.-J.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2011 |
Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish
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Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2009 |
Evaluations of whisker growth and fatigue reliability of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.05Ce solder ball grid array packages
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Chuang, T.-H.; TUNG-HAN CHUANG; Chang, T.-C.; Cheng, C.-Y. |
| 臺大學術典藏 |
2006 |
Mechanical properties of intermetallic compounds on lead-free solder by Moire techniques
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Tsai, Iting; Wu, Enboa; Yen, S. F.; Chuang, T. H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2004 |
Erratum: Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20ln-2Ag-0.5Cu solder ball grid arrav packaaes(Journal of Electronics Materials (March 2004) 33 (171-180))
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Cheng, M.D.; Chang, S.Y.; Yen, S.F.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2003 |
Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler
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Tung, C.N.; Pan, G.H.; Chuang, T.H.; TUNG-HAN CHUANG; Chiang, M.J.; Tsao, L.C.; Chang, S.Y. |
| 臺大學術典藏 |
2003 |
Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al2O3 with Sn interlayers
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Liang, M.W.; Hsieh, T.E.; Chang, S.Y.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2002 |
Characterization of intermetallic compounds formed during the interfacial reactions of liquid Sn and Sn-58Bi solders with Ni substrates
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Tseng, Y.H.; Chan, Y.C.; Chuang, T.H.; TUNG-HAN CHUANG; Chiu, M.Y.; Chang, S.Y. |
| 臺大學術典藏 |
2000 |
Diffusion bonding of a superplastic Inconel 718SPF superalloy by electroless nickel plating
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TUNG-HAN CHUANG; Chuang, T.H.; Chang, C.B.; Yeh, M.S. |
| 臺大學術典藏 |
1996 |
The oxidation behavior of Ni3Al-Zr alloys with various zirconium contents
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Pan, Y.C.; Chuang, T.H.; TUNG-HAN CHUANG; Chang, T.T. |
| 臺大學術典藏 |
1996 |
Technical Note: Relationship between Electrical Conductivity and Stress Corrosion Cracking Susceptibility of Al 7075 and Al 7475 Alloys
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Tsai, T.C.; Chuang, T.H.; TUNG-HAN CHUANG |
显示项目 191-205 / 205 (共9页)
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