| 臺大學術典藏 |
2021-01-19T12:08:26Z |
An Optimized Ag-5Pd-3.5Au Bonding Wire for the Resistance of Ag Ion Migration in LED Packages
|
TUNG-HAN CHUANG; Lee, Pei Ing; Lin, Yan Cheng |
| 臺大學術典藏 |
2020-05-12T02:53:30Z |
Synergistic effects of wear and corrosion for Al2O3 particulate-reinforced 6061 aluminum matrix composites
|
Fang, C. K.; Huang, C. C.; Chuang, T. H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:30Z |
Recent research and development activities on superplasticity in Taiwan
|
Huang, J. C.; Chuang, T. H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Observations of fracture surface chemistry on Cu-0.5 At. % Sb bicrystals
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Chuang, T.H.; Gust, W.; Heldt, L.A.; Hintz, M.B.; Hofmann, S.; Lučić, R.; Predel, B.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Diffusion Soldering of Bi0.5Sb1.5Te3 Thermoelectric Material with Cu Electrode
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Yang, C. L.; Lai, H. J.; Hwang, J. D.; Chuang, T. H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates
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Wang, S. S.; Tseng, Y. H.; Chuang, T. H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages (vol 33, pg 171, 2004)
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TUNG-HAN CHUANG; Yen, S. F.; Chuang, T. H.; Chang, S. Y.; Cheng, M. D. |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Plasma-enhanced chemical-vapor deposition oxide prepared at low-flow conditions for course wavelength-division multiplexing optical-waveguide devices
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Chu, A. K.; Lin, J. Y.; Wang, M. L.; Fan, C. C.; Shue, H. S.; Chuang, T. H.; Chen, S. Y.; Chiu, C. H.; Lin, S. F.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:28Z |
Nontraditional grain refinement through phase transformation in an Al-Zn alloy
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Chuang, T.-W.; Chen, S.-J.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:28Z |
Discontinuous coarsening of discontinuous precipitate in a Ni-7.5 at.% In alloy
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Chuang, T.H.; Fournelle, R.A.; Gust, W.; Predel, B.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:28Z |
The morphology of discontinuous precipitation on the surface of NiIn and NiSn alloys
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Chuang, T.H.; Fournelle, R.A.; Gust, W.; Predel, B.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:28Z |
Electrical and Magnetic Studies on Grain Boundary Segregation in a NI-3AT.%Sn Alloy
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Yao, Y.D.; Chuang, T.H.; Lee, C.K.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:28Z |
Discontinuous coarsening and dissolution in an Fe13.5at.%Zn solid solution
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Chuang, T.-H.; Gust, W.; Predel, B.; Fournelle, R.A.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:27Z |
The mutual effects of boron, zirconium and aluminium on grain boundary segregation in Ni3Al intermetallic compounds
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Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:27Z |
Grain boundary pest of boron- doped Niin3Al at 1200 °C
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Chuang, T.H.; Pan, Y.C.; Hsu, S.E.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:27Z |
Magnetization study on grain-boundary precipitation in a Ni-8 at. % Sn alloy
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Yao, Y.D.; Chen, Y.Y.; Li, T.J.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:27Z |
Electrical Resistivity of Nickel‐Rich Nickel‐Indium Alloys between 10 and 800 K
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Tzeng, S.J.; Yao, Y.D.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:27Z |
Electrical resistivity, magnetization, and grain boundary precipitates in NiSn alloys
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Yao, Y.D.; Chen, Y.Y.; Tzeng, S.J.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:26Z |
Low-pressure diffusion bonding of SAE 316 stainless steel by inserting a superplastic interlayer
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Yeh, M.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:26Z |
Grain boundary melting of hafnium containing Ni3Al intermetallic compounds
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Chang, T.T.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:26Z |
On the mechanisms of high-temperature intergranular embrittlements of Ni3Al-Zr Alloys
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Chuang, T.H.; Pan, Y.C.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:26Z |
Electrical resistivity, magnetization, and grain-boundary precipitate in nickel-rich nickel-indium alloys
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Yao, Y.D.; Chen, Y.Y.; Chuang, T.H.; Kung, C.; Lin, C.J.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:26Z |
Evaluation of the superplastic formability of SP-inconel 718 superalloy
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Yeh, M.S.; Tsau, C.W.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:26Z |
Long-term oxidation behaviour of Ni3Al alloys with and without chromium additions
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TUNG-HAN CHUANG; Yao, Y.D.; Chuang, T.H.; Pan, Y.C. |
| 臺大學術典藏 |
2020-05-12T02:53:25Z |
Atmospheric stress corrosion cracking of a superplastic 7475 aluminum alloy
|
Tsai, T.C.; Chuang, T.H.; TUNG-HAN CHUANG |
