English  |  正體中文  |  简体中文  |  总笔数 :2851802  
造访人次 :  44718717    在线人数 :  1232
教育部委托研究计画      计画执行:国立台湾大学图书馆
 
臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
关于TAIR

浏览

消息

著作权

相关连结

"tung han chuang"的相关文件

回到依作者浏览
依题名排序 依日期排序

显示项目 51-60 / 205 (共21页)
<< < 1 2 3 4 5 6 7 8 9 10 > >>
每页显示[10|25|50]项目

机构 日期 题名 作者
臺大學術典藏 2021-01-19T12:08:26Z An Optimized Ag-5Pd-3.5Au Bonding Wire for the Resistance of Ag Ion Migration in LED Packages TUNG-HAN CHUANG; Lee, Pei Ing; Lin, Yan Cheng
臺大學術典藏 2020-05-12T02:53:30Z Synergistic effects of wear and corrosion for Al2O3 particulate-reinforced 6061 aluminum matrix composites Fang, C. K.; Huang, C. C.; Chuang, T. H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:30Z Recent research and development activities on superplasticity in Taiwan Huang, J. C.; Chuang, T. H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:29Z Observations of fracture surface chemistry on Cu-0.5 At. % Sb bicrystals Chuang, T.H.; Gust, W.; Heldt, L.A.; Hintz, M.B.; Hofmann, S.; Lučić, R.; Predel, B.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:29Z Diffusion Soldering of Bi0.5Sb1.5Te3 Thermoelectric Material with Cu Electrode Yang, C. L.; Lai, H. J.; Hwang, J. D.; Chuang, T. H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:29Z Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates Wang, S. S.; Tseng, Y. H.; Chuang, T. H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:29Z Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages (vol 33, pg 171, 2004) TUNG-HAN CHUANG; Yen, S. F.; Chuang, T. H.; Chang, S. Y.; Cheng, M. D.
臺大學術典藏 2020-05-12T02:53:29Z Plasma-enhanced chemical-vapor deposition oxide prepared at low-flow conditions for course wavelength-division multiplexing optical-waveguide devices Chu, A. K.; Lin, J. Y.; Wang, M. L.; Fan, C. C.; Shue, H. S.; Chuang, T. H.; Chen, S. Y.; Chiu, C. H.; Lin, S. F.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:28Z Nontraditional grain refinement through phase transformation in an Al-Zn alloy Chuang, T.-W.; Chen, S.-J.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:28Z Discontinuous coarsening of discontinuous precipitate in a Ni-7.5 at.% In alloy Chuang, T.H.; Fournelle, R.A.; Gust, W.; Predel, B.; TUNG-HAN CHUANG

显示项目 51-60 / 205 (共21页)
<< < 1 2 3 4 5 6 7 8 9 10 > >>
每页显示[10|25|50]项目