| 臺大學術典藏 |
2020-05-12T02:53:20Z |
Interfacial reactions between In10Ag solders and Ag substrates
|
TUNG-HAN CHUANG; Chuang, T.H.; Liu, Y.M. |
| 臺大學術典藏 |
2020-05-12T02:53:19Z |
Corrosion behaviors of Al-Si-Cu-based filler metals and 6061-T6 brazements
|
Su, T.L.; Wang, S.S.; Tsao, L.C.; Chang, S.Y.; Chuang, T.H.; Yeh, M.S.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:19Z |
Corrosion behavior of Al-Si-Cu-(Sn, Zn) brazing filler metals
|
Wang, S.S.; Cheng, M.D.; Tsao, L.C.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:19Z |
AgIn2/Ag2In transformations in an In-49Sn/Ag soldered joint under thermal aging
|
TUNG-HAN CHUANG; Tsao, L.C.; Huang, Y.T.; Chuang, T.H. |
| 臺大學術典藏 |
2020-05-12T02:53:19Z |
Erosion- and wear-corrosion behavior of Fe-Mn-Al alloys in NaC1 solution
|
Huang, H.-H.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:19Z |
Brazeability of the 6061-T6 aluminum alloy with Al-Si-20Cu-based filler metals
|
Tsao, L.C.; Tsai, T.C.; Wu, C.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Interfacial reaction between liquid Sn-20In-2.8Ag solder and Ag substrate
|
Chiang, M.J.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Intermetallic compounds formed at the interface between liquid indium and copper substrates
|
Yu, C.L.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates
|
Chiu, M.Y.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Soldering reactions between In49Sn and Ag thick films
|
Cheng, M.D.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Intermetallic compounds formed during the soldering reactions of eutectic Sn-9Zn with Cu and Ni substrates
|
Chan, Y.C.; Chiu, M.Y.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:17Z |
Intermetallic compounds formed during the reflow of In-49Sn solder ball-grid array packages
|
Chuang, T.H.; Chang, S.Y.; Tsao, L.C.; Weng, W.P.; Wu, H.M.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:17Z |
Evaluation of the formability of plastic/Zn22Al/plastic sandwiched structures by gas blowing
|
Tsao, L.C.; Su, T.L.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:17Z |
Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films
|
Su, T.L.; Tsao, L.C.; Chang, S.Y.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:17Z |
Morphology and growth kinetics of Ag3Sn during soldering reaction between liquid Sn and an Ag substrate
|
Su, T.L.; Tsao, L.C.; Chang, S.Y.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:17Z |
Brazeability of a 3003 aluminum alloy with Al-Si-Cu-based filler metals
|
TUNG-HAN CHUANG; Chuang, T.H.; Tsao, C.W.; Cheng, M.D.; Weng, W.P.; Tsao, L.C. |
| 臺大學術典藏 |
2020-05-12T02:53:17Z |
Effects of zinc additions on the microstructure and melting temperatures of Al-Si-Cu filler metals
|
Tsao, L.C.; Chiang, M.J.; Lin, W.H.; Cheng, M.D.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:16Z |
Interfacial reactions between liquid Sn-8Zn-3Bi solders and Cu substrates
|
Lin, W.H.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:16Z |
Joining alumina to Inconel 600 and UMCo-50 superalloys using an Sn10Ag4Ti active filler metal
|
Chang, S.Y.; Hung, Y.T.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:16Z |
Morphology and kinetics of discontinuous precipitation and dissolution in an Fe-8.5Al-27Mn-1.0Si-0.92C alloy
|
Chang, S.-Y.; Wang, S.-S.; Tsao, L.-C.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:15Z |
Characterization of thin films and intermetallic compounds in solder joint
|
Tsai, I.; Tai, L.J.; Yen, S.F.; Chuang, T.H.; Lo, R.; Ku, T.; Wu, E.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:15Z |
Reflow and Burn-in of a Sn-20ln-0.8Cu Ball Grid Array Package with a Au/Ni/Cu Pad
|
Chuang, T.H.; TUNG-HAN CHUANG; Chang, S.Y.; Chiang, M.J. |
| 臺大學術典藏 |
2020-05-12T02:53:15Z |
Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20ln-2Ag-0.5Cu Solder Ball Grid Array Packages
|
Cheng, M.D.; Yen, S.F.; Yen, S.F.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:14Z |
Abnormal growth of tin whiskers in a Sn3Ag0.5Cu0.5Ce solder ball grid array package
|
Chuang, T.-H.; Yen, S.-F.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:14Z |
Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu Pads
|
TUNG-HAN CHUANG; Chuang, T.-H.; Lin, H.-J. |
