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"tung han chuang"
Showing items 101-110 of 205 (21 Page(s) Totally)
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| 臺大學術典藏 |
2020-05-12T02:53:20Z |
Interfacial reactions between In10Ag solders and Ag substrates
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TUNG-HAN CHUANG; Chuang, T.H.; Liu, Y.M. |
| 臺大學術典藏 |
2020-05-12T02:53:19Z |
Corrosion behaviors of Al-Si-Cu-based filler metals and 6061-T6 brazements
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Su, T.L.; Wang, S.S.; Tsao, L.C.; Chang, S.Y.; Chuang, T.H.; Yeh, M.S.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:19Z |
Corrosion behavior of Al-Si-Cu-(Sn, Zn) brazing filler metals
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Wang, S.S.; Cheng, M.D.; Tsao, L.C.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:19Z |
AgIn2/Ag2In transformations in an In-49Sn/Ag soldered joint under thermal aging
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TUNG-HAN CHUANG; Tsao, L.C.; Huang, Y.T.; Chuang, T.H. |
| 臺大學術典藏 |
2020-05-12T02:53:19Z |
Erosion- and wear-corrosion behavior of Fe-Mn-Al alloys in NaC1 solution
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Huang, H.-H.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:19Z |
Brazeability of the 6061-T6 aluminum alloy with Al-Si-20Cu-based filler metals
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Tsao, L.C.; Tsai, T.C.; Wu, C.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Interfacial reaction between liquid Sn-20In-2.8Ag solder and Ag substrate
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Chiang, M.J.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Intermetallic compounds formed at the interface between liquid indium and copper substrates
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Yu, C.L.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates
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Chiu, M.Y.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Soldering reactions between In49Sn and Ag thick films
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Cheng, M.D.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG |
Showing items 101-110 of 205 (21 Page(s) Totally)
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