English  |  正體中文  |  简体中文  |  Total items :0  
Visitors :  50950394    Online Users :  795
Project Commissioned by the Ministry of Education
Project Executed by National Taiwan University Library
 
臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
About TAIR

Browse By

News

Copyright

Related Links

"tung han chuang"

Return to Browse by Author
Sorting by Title Sort by Date

Showing items 131-140 of 205  (21 Page(s) Totally)
<< < 9 10 11 12 13 14 15 16 17 18 > >>
View [10|25|50] records per page

Institution Date Title Author
臺大學術典藏 2020-05-12T02:53:13Z Rapid whisker growth on the surface of Sn-3Ag-0.5Cu-1.0Ce solder joints Chuang, T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:13Z Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish Chuang, T.-H.; Yen, S.-F.; Wu, H.-M.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:13Z Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes Chuang, T.H.; Yen, S.F.; Cheng, M.D.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:12Z Active soldering of ZnS-SiO2 sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce, Ga) filler metal Chang, S.Y.; Chuang, T.H.; Tsao, L.C.; Yang, C.L.; Yang, Z.S.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:12Z Enhanced growth of anodic alumina nanochannels on Ga-ion pre-irradiated aluminum TUNG-HAN CHUANG; Liu, C.Y.; Datta, A.; Liu, N.W.; Wu, Y.R.; Wang, H.H.; Chuang, T.H.; Wang, Y.L.
臺大學術典藏 2020-05-12T02:53:12Z Intermetallic reactions in reflowed and aged Sn-58Bi BGA packages with Au/Ni/Cu pads Chi, C.C.; Tsao, L.C.; Tsao, C.W.; Chuang, T.H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:12Z Low temperature bonding of alumina/alumina and alumina/copper in air using Sn3.5Ag4Ti(Ce,Ga) filler Chang, S.Y.; Chuang, T.H.; Yang, C.L.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:12Z Electromigration in the flip chip solder joint of Sn-8Zn-3Bi on copper pads TUNG-HAN CHUANG; Tu, K.N.; Chuang, T.H.; Lin, S.Z.; Wu, A.T.; Lin, W.H.
臺大學術典藏 2020-05-12T02:53:11Z Intermetallic reactions in a Sn-51In solder BGA package with immersion Ag surface finish Jain, C.-C.; Wang, S.-S.; Wu, H.-M.; Chuang, T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:11Z Low temperature direct electroless nickel plating on silicon wafer TUNG-HAN CHUANG; Yang, S.-R.; Chuang, T.-H.; Wang, S.-S.; Jain, C.-C.

Showing items 131-140 of 205  (21 Page(s) Totally)
<< < 9 10 11 12 13 14 15 16 17 18 > >>
View [10|25|50] records per page