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"tung han chuang"
Showing items 151-200 of 205 (5 Page(s) Totally)
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| 臺大學術典藏 |
2020-05-12T02:53:09Z |
The inhibition of tin whiskers on the surface of Sn-8Zn-3Bi-0.5Ce solders
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Chuang, T.H.; Lai, H.J.; Chen, C.L.; Jain, C.C.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:09Z |
Morphology of the tin whiskers on the surface of a Sn-3Ag-0.5Cu-0.5Nd alloy
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Chuang, T.-H.; Jain, C.-C.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:08Z |
Effect of annealing twins on electromigration in Ag-8Au-3Pd bonding wires
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Chuang, T.-H.; Wang, H.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:08Z |
Diffusion soldering of Pb-doped gete thermoelectric modules with Cu electrodes using a thin-film Sn interlayer
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Yang, C.L.; Lai, H.J.; Hwang, J.D.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:08Z |
Formation and growth of intermetallics in an annealing-twinned Ag-8Au-3Pd wire bonding package during reliability tests
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Chuang, T.-H.; Chang, C.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:08Z |
Dual-phase solid-liquid interdiffusion bonding, a solution for the die attachment of WBG
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TUNG-HAN CHUANG;Lo, W.-C.;Chuang, T.-H.;Chang, J.-Y.;Chang, T.-C.; Chang, T.-C.; Chang, J.-Y.; Chuang, T.-H.; Lo, W.-C.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:08Z |
Dual-phase solid-liquid interdiffusion bonding, a solution for the die attachment of WBG
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TUNG-HAN CHUANG;Lo, W.-C.;Chuang, T.-H.;Chang, J.-Y.;Chang, T.-C.; Chang, T.-C.; Chang, J.-Y.; Chuang, T.-H.; Lo, W.-C.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:08Z |
Effects of annealing twins on the grain growth and mechanical properties of Ag-8Au-3Pd bonding wires
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Chuang, T.-H.; Tsai, C.-H.; Wang, H.-C.; Chang, C.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:08Z |
An innovative annealing-twinned Ag-Au-Pd bonding wire for IC and LED packaging
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Tsai, H.-H.; Lee, J.-D.; Tsai, C.-H.; Wang, H.-C.; Chang, C.-C.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:07Z |
Durability to Electromigration of an Annealing-Twinned Ag-4Pd Alloy Wire Under Current Stressing
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Chuang, T.-H.; Lin, H.-J.; Chuang, C.-H.; Tsai, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:07Z |
Solid Liquid Interdiffusion Bonding of (Pb, Sn)Te Thermoelectric Modules with Cu Electrodes Using a Thin-Film Sn Interlayer
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Chuang, T.H.; Lin, H.J.; Chuang, C.H.; Yeh, W.T.; Hwang, J.D.; Chu, H.S.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:07Z |
Surface reconstruction of an annealing twinned Ag-8Au-3Pd alloy wire under current stressing
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Chuang, T.-H.; Wang, H.-C.; Chuang, C.-H.; Lin, H.-J.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:07Z |
Effects of la addition on microstructure and mechanical properties of SN-58BI solders joints with osp pads
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Shiue, Y.Y.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:07Z |
Diffusion soldering of Bi0.5Sb1.5Te3 thermoelectric material with Cu electrode
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Yang, C.L.; Lai, H.J.; Hwang, J.D.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:07Z |
High performance Ag-Pd alloy wires for high frequency IC packages
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Tsai, H.-H.; Chuang, T.-H.; Lee, J.-D.; Tsai, C.-H.; Wang, H.-C.; Lin, H.-J.; Chang, C.-C.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:06Z |
Applications of Ag-Alloy stud bump for IC and LED packages
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Tsai, H.-H.; Tsai, C.-H.; Lee, J.-D.; Chang, D.; Shih, Y.-T.; Chen, C.-H.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:06Z |
Thermal stability of grain structure and material properties in an annealing twinned Ag-4Pd alloy wire
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Chuang, T.-H.; Lin, H.-J.; Chuang, C.-H.; Shiue, Y.-Y.; Shieu, F.-S.; Huang, Y.-L.; Hsu, P.-C.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:06Z |
Improvement of bonding strength of a (Pb, Sn)Te-Cu contact manufactured in a low temperature SLID-bonding process
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Chuang, T.-H.; Yeh, W.-T.; Chuang, C.-H.; Hwang, J.-D.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:06Z |
Mechanism of Electromigration in Ag-Alloy Bonding Wires with Different Pd and Au Content
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Chuang, T.-H.; Lin, H.-J.; Wang, H.-C.; Chuang, C.-H.; Tsai, C.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:06Z |
Nickel-tin solid-liquid inter-diffusion bonding
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Yu, C.-C.; Su, P.-C.; Bai, S.J.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:05Z |
Low temperature bonding of Pd/Ni assembly for hydrogen purifier
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Lin, Y.-C.; Chuang, C.-H.; Tsai, H.-H.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:05Z |
Microstructures and optoelectronic properties of CuxO films deposited by high-power impulse magnetron sputtering
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Sun, H.; Wen, C.-K.; Chen, S.-C.; Chuang, T.-H.; Arab Pour Yazdi, M.; Sanchette, F.; Billard, A.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:05Z |
Influence of glass transition temperature of underfill on the stress behavior and reliability of microjoints within a chip stacking architecture
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Chang, J.-Y.; Huang, S.-Y.; Lee, C.-C.; Chuang, T.-H.; Chang, T.-C.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:05Z |
Magnetic pinning effect in YBa2Cu3O7-d/Nd0.35Sr0.65MnO3 bilayer
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Cheng, S.; Lin, J.; Chuang, T.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:05Z |
Spin injection induced phase transition in YBa2Cu3O7-δ/Nd0.35Sr0.65MnO3 bilayer
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Cheng, S.L.; Lin, J.G.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:04Z |
p-type cuprous oxide thin films with high conductivity deposited by high power impulse magnetron sputtering
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Sun, H.; Chen, S.-C.; Wen, C.-K.; Chuang, T.-H.; Arab Pour Yazdi, M.; Sanchette, F.; Billard, A.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:04Z |
Solid Liquid Interdiffusion Bonding of Zn4Sb3 Thermoelectric Material with Cu Electrode
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Lin, Y.C.; Lee, K.T.; Hwang, J.D.; Chu, H.S.; Hsu, C.C.; Chen, S.C.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:04Z |
Low-Temperature Bonding of Bi0.5Sb1.5Te3 Thermoelectric Material with Cu Electrodes Using a Thin-Film In Interlayer
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Lin, Y.-C.; Yang, C.-L.; Huang, J.-Y.; Jain, C.-C.; Hwang, J.-D.; Chu, H.-S.; Chen, S.-C.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:04Z |
Materials Characteristics of Ag-Alloy Wires and Their Applications in Advanced Packages
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Tsai, C.-H.; Chuang, C.-H.; Tsai, H.-H.; Lee, J.-D.; Chang, D.; Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:04Z |
Microstructures, electrical and magnetic properties of (Ga, Co)-ZnO films by radio frequency magnetron co-sputtering
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Chen, S.-C.; Wang, C.-H.; Sun, H.; Wen, C.-K.; Lu, C.-F.; Tsai, C.-L.; Fu, Y.-K.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:03Z |
The influence of oxygen flow ratio on the optoelectronic properties of p-type Ni1-xO films deposited by ion beam assisted sputtering
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TUNG-HAN CHUANG; Chuang, T.-H.; Wang, X.; Wen, C.-K.; Peng, W.-C.; Chen, S.-C.; Sun, H. |
| 臺大學術典藏 |
2020-05-12T02:53:03Z |
Evaluation of corrosion resistance of ag-alloy bonding wires for electronic packaging
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Chen, C.-H.; Lin, Y.-C.; Shih, Y.-T.; Chen, S.-C.; Tsai, C.-H.; Wang, S.-C.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:03Z |
Spin Diffusion Length in Ferromagnet/Superconductor Bilayers
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Cheng, S.L.; Chuang, T.H.; Lin, J.G.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:03Z |
Microstructures and optoelectronic properties of nickel oxide films deposited by reactive magnetron sputtering at various working pressures of pure oxygen environment
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Sun, H.; Chen, S.-C.; Hsu, S.-W.; Wen, C.-K.; Chuang, T.-H.; Wang, X.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:03Z |
Characterization and crystallization kinetics of sputtered NiSi thin films for blue laser optical recording application
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Ou, S.-L.; Chen, S.-C.; Lin, Y.-C.; Lin, P.-C.; Wen, C.-K.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:02Z |
Luminous efficiency of pd-doped ag-alloy wire bonded led package after reliability tests
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Yuan, J.-H.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:02Z |
Mechanism of the Electromigration in Ag-Pd Alloy Bonding Wires
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Chuang, T.-H.; Chen, C.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:02Z |
Effect of Au Addition on the Microstructure and Properties of Ag-4Pd Bonding Wires
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Kuo, B.-H.; Tsai, D.-C.; Huang, Y.-L.; Hsu, P.-C.; Chuang, T.-H.; Tsai, H.-H.; Shieu, F.-S.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:02Z |
Electrolytic Migration of Ag-Pd Alloy Wires with Various Pd Contents
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Lin, Y.-C.; Chen, C.-H.; He, Y.-Z.; Chen, S.-C.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:02Z |
Design of diffusion barrier and buffer layers for β-Zn 4 Sb 3 mid-temperature thermoelectric modules
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Chen, L.-W.; Wang, C.; Liao, Y.-C.; Li, C.-L.; Chuang, T.-H.; Hsueh, C.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:01Z |
Atomic replacement effects on the band structure of doped perovskite thin films
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Cheng, S.L.; Du, C.H.; Chuang, T.H.; Lin, J.G.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:01Z |
Au-induced improvements in the grain stability and mechanical properties of Ag-based alloy wires under electrical current stressing
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Kuo, B.-H.; Tsai, D.-C.; Huang, Y.-L.; Hsu, P.-C.; Chuang, T.-H.; Lee, J.-D.; Tsai, H.-H.; Shieu, F.-S.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:01Z |
Effect of alloying Au on the microstructural, mechanical and electrical properties of Ag-based alloy wires
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Kuo, B.-H.; Tsai, D.-C.; Huang, Y.-L.; Hsu, P.-C.; Chuang, T.-H.; Lee, J.-D.; Tsai, H.-H.; Shieu, F.-S.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:01Z |
Comparison of microstructural and optoelectronic properties of NiO:Cu thin films deposited by ion-beam assisted rf sputtering in different gas atmospheres
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Wen, C.-K.; Xin, Y.-Q.; Chen, S.-C.; Chuang, T.-H.; Chen, P.-J.; Sun, H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:01Z |
Electrical and magnetic properties of (Al, Co) co-doped ZnO films deposited by RF magnetron sputtering
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Sun, H.; Chen, S.-C.; Wang, C.-H.; Lin, Y.-W.; Wen, C.-K.; Chuang, T.-H.; Wang, X.; Lin, S.-S.; Dai, M.-J.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2011 |
Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish
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Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2009 |
Evaluations of whisker growth and fatigue reliability of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.05Ce solder ball grid array packages
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Chuang, T.-H.; TUNG-HAN CHUANG; Chang, T.-C.; Cheng, C.-Y. |
| 臺大學術典藏 |
2006 |
Mechanical properties of intermetallic compounds on lead-free solder by Moire techniques
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Tsai, Iting; Wu, Enboa; Yen, S. F.; Chuang, T. H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2004 |
Erratum: Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20ln-2Ag-0.5Cu solder ball grid arrav packaaes(Journal of Electronics Materials (March 2004) 33 (171-180))
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Cheng, M.D.; Chang, S.Y.; Yen, S.F.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2003 |
Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler
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Tung, C.N.; Pan, G.H.; Chuang, T.H.; TUNG-HAN CHUANG; Chiang, M.J.; Tsao, L.C.; Chang, S.Y. |
Showing items 151-200 of 205 (5 Page(s) Totally)
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