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機構 日期 題名 作者
臺大學術典藏 2020-05-12T02:53:05Z Low temperature bonding of Pd/Ni assembly for hydrogen purifier Lin, Y.-C.; Chuang, C.-H.; Tsai, H.-H.; Chuang, T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:05Z Microstructures and optoelectronic properties of CuxO films deposited by high-power impulse magnetron sputtering Sun, H.; Wen, C.-K.; Chen, S.-C.; Chuang, T.-H.; Arab Pour Yazdi, M.; Sanchette, F.; Billard, A.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:05Z Influence of glass transition temperature of underfill on the stress behavior and reliability of microjoints within a chip stacking architecture Chang, J.-Y.; Huang, S.-Y.; Lee, C.-C.; Chuang, T.-H.; Chang, T.-C.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:05Z Magnetic pinning effect in YBa2Cu3O7-d/Nd0.35Sr0.65MnO3 bilayer Cheng, S.; Lin, J.; Chuang, T.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:05Z Spin injection induced phase transition in YBa2Cu3O7-δ/Nd0.35Sr0.65MnO3 bilayer Cheng, S.L.; Lin, J.G.; Chuang, T.H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:04Z p-type cuprous oxide thin films with high conductivity deposited by high power impulse magnetron sputtering Sun, H.; Chen, S.-C.; Wen, C.-K.; Chuang, T.-H.; Arab Pour Yazdi, M.; Sanchette, F.; Billard, A.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:04Z Solid Liquid Interdiffusion Bonding of Zn4Sb3 Thermoelectric Material with Cu Electrode Lin, Y.C.; Lee, K.T.; Hwang, J.D.; Chu, H.S.; Hsu, C.C.; Chen, S.C.; Chuang, T.H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:04Z Low-Temperature Bonding of Bi0.5Sb1.5Te3 Thermoelectric Material with Cu Electrodes Using a Thin-Film In Interlayer Lin, Y.-C.; Yang, C.-L.; Huang, J.-Y.; Jain, C.-C.; Hwang, J.-D.; Chu, H.-S.; Chen, S.-C.; Chuang, T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:04Z Materials Characteristics of Ag-Alloy Wires and Their Applications in Advanced Packages Tsai, C.-H.; Chuang, C.-H.; Tsai, H.-H.; Lee, J.-D.; Chang, D.; Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:04Z Microstructures, electrical and magnetic properties of (Ga, Co)-ZnO films by radio frequency magnetron co-sputtering Chen, S.-C.; Wang, C.-H.; Sun, H.; Wen, C.-K.; Lu, C.-F.; Tsai, C.-L.; Fu, Y.-K.; Chuang, T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:03Z The influence of oxygen flow ratio on the optoelectronic properties of p-type Ni1-xO films deposited by ion beam assisted sputtering TUNG-HAN CHUANG; Chuang, T.-H.; Wang, X.; Wen, C.-K.; Peng, W.-C.; Chen, S.-C.; Sun, H.
臺大學術典藏 2020-05-12T02:53:03Z Evaluation of corrosion resistance of ag-alloy bonding wires for electronic packaging Chen, C.-H.; Lin, Y.-C.; Shih, Y.-T.; Chen, S.-C.; Tsai, C.-H.; Wang, S.-C.; Chuang, T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:03Z Spin Diffusion Length in Ferromagnet/Superconductor Bilayers Cheng, S.L.; Chuang, T.H.; Lin, J.G.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:03Z Microstructures and optoelectronic properties of nickel oxide films deposited by reactive magnetron sputtering at various working pressures of pure oxygen environment Sun, H.; Chen, S.-C.; Hsu, S.-W.; Wen, C.-K.; Chuang, T.-H.; Wang, X.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:03Z Characterization and crystallization kinetics of sputtered NiSi thin films for blue laser optical recording application Ou, S.-L.; Chen, S.-C.; Lin, Y.-C.; Lin, P.-C.; Wen, C.-K.; Chuang, T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:02Z Luminous efficiency of pd-doped ag-alloy wire bonded led package after reliability tests Yuan, J.-H.; Chuang, T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:02Z Mechanism of the Electromigration in Ag-Pd Alloy Bonding Wires Chuang, T.-H.; Chen, C.-H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:02Z Effect of Au Addition on the Microstructure and Properties of Ag-4Pd Bonding Wires Kuo, B.-H.; Tsai, D.-C.; Huang, Y.-L.; Hsu, P.-C.; Chuang, T.-H.; Tsai, H.-H.; Shieu, F.-S.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:02Z Electrolytic Migration of Ag-Pd Alloy Wires with Various Pd Contents Lin, Y.-C.; Chen, C.-H.; He, Y.-Z.; Chen, S.-C.; Chuang, T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:02Z Design of diffusion barrier and buffer layers for β-Zn 4 Sb 3 mid-temperature thermoelectric modules Chen, L.-W.; Wang, C.; Liao, Y.-C.; Li, C.-L.; Chuang, T.-H.; Hsueh, C.-H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:01Z Atomic replacement effects on the band structure of doped perovskite thin films Cheng, S.L.; Du, C.H.; Chuang, T.H.; Lin, J.G.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:01Z Au-induced improvements in the grain stability and mechanical properties of Ag-based alloy wires under electrical current stressing Kuo, B.-H.; Tsai, D.-C.; Huang, Y.-L.; Hsu, P.-C.; Chuang, T.-H.; Lee, J.-D.; Tsai, H.-H.; Shieu, F.-S.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:01Z Effect of alloying Au on the microstructural, mechanical and electrical properties of Ag-based alloy wires Kuo, B.-H.; Tsai, D.-C.; Huang, Y.-L.; Hsu, P.-C.; Chuang, T.-H.; Lee, J.-D.; Tsai, H.-H.; Shieu, F.-S.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:01Z Comparison of microstructural and optoelectronic properties of NiO:Cu thin films deposited by ion-beam assisted rf sputtering in different gas atmospheres Wen, C.-K.; Xin, Y.-Q.; Chen, S.-C.; Chuang, T.-H.; Chen, P.-J.; Sun, H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:01Z Electrical and magnetic properties of (Al, Co) co-doped ZnO films deposited by RF magnetron sputtering Sun, H.; Chen, S.-C.; Wang, C.-H.; Lin, Y.-W.; Wen, C.-K.; Chuang, T.-H.; Wang, X.; Lin, S.-S.; Dai, M.-J.; TUNG-HAN CHUANG

顯示項目 171-195 / 205 (共9頁)
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