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Showing items 21-30 of 205  (21 Page(s) Totally)
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Institution Date Title Author
臺大學術典藏 2022-03-22T08:30:50Z Formation of High Density ?111? Textured Nanotwins in Evaporated Ag Thin Films Through Post-Deposition Ion Bombardment Lee P.-I;Wu P.-C;Chuang T.-H.; Lee P.-I; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2022-03-22T08:27:52Z Effects of adding active elements to aluminum-based filler alloys on the bonding of 6061 aluminum alloy and alumina Sun Y.-K;Chang S.-Y;Tsao L.-C;Chuang T.-H;Zhang G.-Z;Yeh C.-Y.; Sun Y.-K; Chang S.-Y; Tsao L.-C; Chuang T.-H; Zhang G.-Z; Yeh C.-Y.; TUNG-HAN CHUANG
臺大學術典藏 2022-03-22T08:27:52Z Effect of post-weld heat treatment on the solid-state diffusion bonding of 6061 aluminum alloy Chen C.-H;Sun Y.-K;Lai Y.-C;Chang S.-Y;Chuang T.-H.; Chen C.-H; Sun Y.-K; Lai Y.-C; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2022-03-22T08:27:51Z Enhancing effect of substrate bias on nanotwin formation of sputtered Ag thin films Wu P.-C;Lai Y.-C;Chuang T.-H.; Wu P.-C; Lai Y.-C; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2022-03-22T08:27:51Z Effects of Grain Size on the Ag Dissolution and Ion Migration of Ag-4Pd Alloy Wires Lin Y.-C;Lee P.-I;Wu P.-C;Chen C.-H;Chuang T.-H.; Lin Y.-C; Lee P.-I; Wu P.-C; Chen C.-H; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2022-03-22T08:27:51Z Evaporation of Ag Nanotwinned Films on Si Substrates with Ion Beam Assistance Wu P.-C;Chuang T.-H.; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2022-03-22T08:27:50Z Thermal stability of grain structure for Ag nanotwinned films sputtered with substrate bias Lai Y.-C;Wu P.-C;Chuang T.-H.; Lai Y.-C; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2022-03-22T08:27:50Z Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes Chen C.-H;Lee P.-I;Yeh W.-T;Chuang T.-H.; Chen C.-H; Lee P.-I; Yeh W.-T; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2022-03-22T08:27:50Z Formation of High Density ?111? Textured Nanotwins in Evaporated Ag Thin Films Through Post-Deposition Ion Bombardment Lee P.-I;Wu P.-C;Chuang T.-H.; Lee P.-I; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2022-03-22T08:27:50Z Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper Tsao L.-C;Li C.-K;Sun Y.-K;Chang S.-Y;Chuang T.-H.; Tsao L.-C; Li C.-K; Sun Y.-K; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG

Showing items 21-30 of 205  (21 Page(s) Totally)
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