| 臺大學術典藏 |
2022-03-22T08:30:50Z |
Formation of High Density ?111? Textured Nanotwins in Evaporated Ag Thin Films Through Post-Deposition Ion Bombardment
|
Lee P.-I;Wu P.-C;Chuang T.-H.; Lee P.-I; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:27:52Z |
Effects of adding active elements to aluminum-based filler alloys on the bonding of 6061 aluminum alloy and alumina
|
Sun Y.-K;Chang S.-Y;Tsao L.-C;Chuang T.-H;Zhang G.-Z;Yeh C.-Y.; Sun Y.-K; Chang S.-Y; Tsao L.-C; Chuang T.-H; Zhang G.-Z; Yeh C.-Y.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:27:52Z |
Effect of post-weld heat treatment on the solid-state diffusion bonding of 6061 aluminum alloy
|
Chen C.-H;Sun Y.-K;Lai Y.-C;Chang S.-Y;Chuang T.-H.; Chen C.-H; Sun Y.-K; Lai Y.-C; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:27:51Z |
Enhancing effect of substrate bias on nanotwin formation of sputtered Ag thin films
|
Wu P.-C;Lai Y.-C;Chuang T.-H.; Wu P.-C; Lai Y.-C; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:27:51Z |
Effects of Grain Size on the Ag Dissolution and Ion Migration of Ag-4Pd Alloy Wires
|
Lin Y.-C;Lee P.-I;Wu P.-C;Chen C.-H;Chuang T.-H.; Lin Y.-C; Lee P.-I; Wu P.-C; Chen C.-H; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:27:51Z |
Evaporation of Ag Nanotwinned Films on Si Substrates with Ion Beam Assistance
|
Wu P.-C;Chuang T.-H.; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:27:50Z |
Thermal stability of grain structure for Ag nanotwinned films sputtered with substrate bias
|
Lai Y.-C;Wu P.-C;Chuang T.-H.; Lai Y.-C; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:27:50Z |
Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes
|
Chen C.-H;Lee P.-I;Yeh W.-T;Chuang T.-H.; Chen C.-H; Lee P.-I; Yeh W.-T; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:27:50Z |
Formation of High Density ?111? Textured Nanotwins in Evaporated Ag Thin Films Through Post-Deposition Ion Bombardment
|
Lee P.-I;Wu P.-C;Chuang T.-H.; Lee P.-I; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:27:50Z |
Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper
|
Tsao L.-C;Li C.-K;Sun Y.-K;Chang S.-Y;Chuang T.-H.; Tsao L.-C; Li C.-K; Sun Y.-K; Chang S.-Y; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-01-22T00:04:06Z |
Evaporation of Ag Nanotwinned Films on Si Substrates with Ion Beam Assistance
|
Wu, Po Ching; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-12-21T23:16:55Z |
Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper
|
Tsao, Lung Chuan; Li, Cheng Kai; Sun, Yu Kai; Chang, Shih Ying; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-12-21T23:16:55Z |
Formation of High Density <111> Textured Nanotwins in Evaporated Ag Thin Films through Post-deposition Ion Bombardment
|
Lee, Pei Ing; Wu, Po Ching; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-11-21T23:18:55Z |
Effects of adding active elements to aluminum-based filler alloys on the bonding of 6061 aluminum alloy and alumina
|
Sun, Yu Kai; Chang, Shih Ying; Tsao, Lung Chuan; TUNG-HAN CHUANG; Zhang, Guo Zhan; Yeh, Chih Yi |
| 臺大學術典藏 |
2021-11-21T23:18:55Z |
Effect of post-weld heat treatment on the solid-state diffusion bonding of 6061 aluminum alloy
|
CHUN-HAO CHEN; Sun, Yu Kai; Lai, Yu Chang; Chang, Shih Ying; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-11-21T23:18:55Z |
Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes
|
CHUN-HAO CHEN; Lee, Pei Ing; Yeh, Wei Ting; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-09-21T23:19:31Z |
Thermal stability of grain structure for Ag nanotwinned films sputtered with substrate bias
|
Lai, Yu Chang; Wu, Po Ching; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-08-21T23:58:54Z |
Effects of Grain Size on the Ag Dissolution and Ion Migration of Ag-4Pd Alloy Wires
|
Lin, Yan Cheng; Lee, Pei Ing; Wu, Po Ching; CHUN-HAO CHEN; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-08-21T23:58:54Z |
Enhancing effect of substrate bias on nanotwin formation of sputtered Ag thin films
|
Wu, Po Ching; Lai, Yu Chang; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-08-05T02:41:05Z |
An Optimized Ag-5Pd-3.5Au Bonding Wire for the Resistance of Ag Ion Migration in LED Packages
|
Chuang T.-H;Lee P.-I;Lin Y.-C.; Chuang T.-H; Lee P.-I; Lin Y.-C.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-08-05T02:41:04Z |
Grain growth and twin formation in a Ag-4Pd alloy ribbon after annealing treatments
|
Chen C.-H;Lai Y.-C;Chuang T.-H.; Chen C.-H; Lai Y.-C; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-08-05T02:41:04Z |
Deposition of (111)-oriented Ag nano-twinned film on (111) Si wafer
|
Wu P.-C;Lee P.-I;Lai Y.-C;Lin Y.-C;Chuang T.-H.; Wu P.-C; Lee P.-I; Lai Y.-C; Lin Y.-C; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-08-05T02:41:04Z |
Corrosion and ion migration of Ag-alloy bonding wires with various Pd and Au contents
|
Chen C.-H;Lin Y.-C;Tsai C.-H;Wang S.-C;Tsai H.-H;Chuang T.-H.; Chen C.-H; Lin Y.-C; Tsai C.-H; Wang S.-C; Tsai H.-H; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-08-05T02:41:04Z |
Characterization of interfacial structure for low-temperature direct bonding of Si substrates sputtered with Ag nanotwinned films
|
Lai Y.-C;Wu P.-C;Chuang T.-H.; Lai Y.-C; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-08-05T02:41:04Z |
Interfacial reactions in Zn4Sb3/titanium diffusion couples
|
Chen C.-H;Yeh W.-T;Chuang T.-H.; Chen C.-H; Yeh W.-T; Chuang T.-H.; TUNG-HAN CHUANG |
