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"tung han chuang"
Showing items 46-55 of 205 (21 Page(s) Totally)
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| 臺大學術典藏 |
2021-08-05T02:41:03Z |
The structures and thermoelectric properties of Zn-Sb alloy films fabricated by electron beam evaporation through an ion beam assisted deposition
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Hsu S.-C;Hong J.-Y;Chen C.-L;Chen S.-C;Zhen J.-H;Hsieh W.-P;Chen Y.-Y;Chuang T.-H.; Hsu S.-C; Hong J.-Y; Chen C.-L; Chen S.-C; Zhen J.-H; Hsieh W.-P; Chen Y.-Y; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-08-05T02:41:03Z |
Sputtering of Ag (111) nanotwinned films on Si (100) wafers for backside metallization of power devices
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Wu P.-C;Lai Y.-C;Lee P.-I;Chiang M.-T;Chou J;Chuang T.-H.; Wu P.-C; Lai Y.-C; Lee P.-I; Chiang M.-T; Chou J; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-04-21T23:29:53Z |
Characterization of interfacial structure for low-temperature direct bonding of Si substrates sputtered with Ag nanotwinned films
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Lai, Yu Chang; Wu, Po Ching; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-02-04T02:48:59Z |
p-type semi-transparent conductive NiO films with high deposition rate produced by superimposed high power impulse magnetron sputtering
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Chuang, T.-H.; Wen, C.-K.; Chen, S.-C.; Liao, M.-H.; Liu, F.; Sun, H.; Chuang, T.-H.; Wen, C.-K.; Chen, S.-C.; Liao, M.-H.; Liu, F.; Sun, H.; MING-HAN LIAO; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-02-02T09:21:29Z |
Grain growth and twin formation in a Ag-4Pd alloy ribbon after annealing treatments
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CHUN-HAO CHEN; Lai, Yu Chang; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-01-19T12:08:26Z |
An Optimized Ag-5Pd-3.5Au Bonding Wire for the Resistance of Ag Ion Migration in LED Packages
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TUNG-HAN CHUANG; Lee, Pei Ing; Lin, Yan Cheng |
| 臺大學術典藏 |
2020-05-12T02:53:30Z |
Synergistic effects of wear and corrosion for Al2O3 particulate-reinforced 6061 aluminum matrix composites
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Fang, C. K.; Huang, C. C.; Chuang, T. H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:30Z |
Recent research and development activities on superplasticity in Taiwan
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Huang, J. C.; Chuang, T. H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Observations of fracture surface chemistry on Cu-0.5 At. % Sb bicrystals
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Chuang, T.H.; Gust, W.; Heldt, L.A.; Hintz, M.B.; Hofmann, S.; Lučić, R.; Predel, B.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Diffusion Soldering of Bi0.5Sb1.5Te3 Thermoelectric Material with Cu Electrode
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Yang, C. L.; Lai, H. J.; Hwang, J. D.; Chuang, T. H.; TUNG-HAN CHUANG |
Showing items 46-55 of 205 (21 Page(s) Totally)
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