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Taiwan Academic Institutional Repository >
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"tung han chuang"
Showing items 51-60 of 205 (21 Page(s) Totally)
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| 臺大學術典藏 |
2021-01-19T12:08:26Z |
An Optimized Ag-5Pd-3.5Au Bonding Wire for the Resistance of Ag Ion Migration in LED Packages
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TUNG-HAN CHUANG; Lee, Pei Ing; Lin, Yan Cheng |
| 臺大學術典藏 |
2020-05-12T02:53:30Z |
Synergistic effects of wear and corrosion for Al2O3 particulate-reinforced 6061 aluminum matrix composites
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Fang, C. K.; Huang, C. C.; Chuang, T. H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:30Z |
Recent research and development activities on superplasticity in Taiwan
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Huang, J. C.; Chuang, T. H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Observations of fracture surface chemistry on Cu-0.5 At. % Sb bicrystals
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Chuang, T.H.; Gust, W.; Heldt, L.A.; Hintz, M.B.; Hofmann, S.; Lučić, R.; Predel, B.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Diffusion Soldering of Bi0.5Sb1.5Te3 Thermoelectric Material with Cu Electrode
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Yang, C. L.; Lai, H. J.; Hwang, J. D.; Chuang, T. H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates
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Wang, S. S.; Tseng, Y. H.; Chuang, T. H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages (vol 33, pg 171, 2004)
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TUNG-HAN CHUANG; Yen, S. F.; Chuang, T. H.; Chang, S. Y.; Cheng, M. D. |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Plasma-enhanced chemical-vapor deposition oxide prepared at low-flow conditions for course wavelength-division multiplexing optical-waveguide devices
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Chu, A. K.; Lin, J. Y.; Wang, M. L.; Fan, C. C.; Shue, H. S.; Chuang, T. H.; Chen, S. Y.; Chiu, C. H.; Lin, S. F.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:28Z |
Nontraditional grain refinement through phase transformation in an Al-Zn alloy
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Chuang, T.-W.; Chen, S.-J.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:28Z |
Discontinuous coarsening of discontinuous precipitate in a Ni-7.5 at.% In alloy
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Chuang, T.H.; Fournelle, R.A.; Gust, W.; Predel, B.; TUNG-HAN CHUANG |
Showing items 51-60 of 205 (21 Page(s) Totally)
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