| 臺大學術典藏 |
2020-05-12T02:53:28Z |
The morphology of discontinuous precipitation on the surface of NiIn and NiSn alloys
|
Chuang, T.H.; Fournelle, R.A.; Gust, W.; Predel, B.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:28Z |
Electrical and Magnetic Studies on Grain Boundary Segregation in a NI-3AT.%Sn Alloy
|
Yao, Y.D.; Chuang, T.H.; Lee, C.K.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:28Z |
Discontinuous coarsening and dissolution in an Fe13.5at.%Zn solid solution
|
Chuang, T.-H.; Gust, W.; Predel, B.; Fournelle, R.A.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:27Z |
The mutual effects of boron, zirconium and aluminium on grain boundary segregation in Ni3Al intermetallic compounds
|
Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:27Z |
Grain boundary pest of boron- doped Niin3Al at 1200 °C
|
Chuang, T.H.; Pan, Y.C.; Hsu, S.E.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:27Z |
Magnetization study on grain-boundary precipitation in a Ni-8 at. % Sn alloy
|
Yao, Y.D.; Chen, Y.Y.; Li, T.J.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:27Z |
Electrical Resistivity of Nickel‐Rich Nickel‐Indium Alloys between 10 and 800 K
|
Tzeng, S.J.; Yao, Y.D.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:27Z |
Electrical resistivity, magnetization, and grain boundary precipitates in NiSn alloys
|
Yao, Y.D.; Chen, Y.Y.; Tzeng, S.J.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:26Z |
Low-pressure diffusion bonding of SAE 316 stainless steel by inserting a superplastic interlayer
|
Yeh, M.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:26Z |
Grain boundary melting of hafnium containing Ni3Al intermetallic compounds
|
Chang, T.T.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:26Z |
On the mechanisms of high-temperature intergranular embrittlements of Ni3Al-Zr Alloys
|
Chuang, T.H.; Pan, Y.C.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:26Z |
Electrical resistivity, magnetization, and grain-boundary precipitate in nickel-rich nickel-indium alloys
|
Yao, Y.D.; Chen, Y.Y.; Chuang, T.H.; Kung, C.; Lin, C.J.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:26Z |
Evaluation of the superplastic formability of SP-inconel 718 superalloy
|
Yeh, M.S.; Tsau, C.W.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:26Z |
Long-term oxidation behaviour of Ni3Al alloys with and without chromium additions
|
TUNG-HAN CHUANG; Yao, Y.D.; Chuang, T.H.; Pan, Y.C. |
| 臺大學術典藏 |
2020-05-12T02:53:25Z |
Atmospheric stress corrosion cracking of a superplastic 7475 aluminum alloy
|
Tsai, T.C.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:25Z |
Superplastic forming by decomposition of (CaCO3 + C) and MgCO3
|
Shyu, J.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:25Z |
Diffusion bonding/superplastic forming of Ti-6Al-6V-2Sn/SUS 304 Stainless Steel/Ti-6Al-6V-2Sn
|
Shyu, J.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:25Z |
Corrosive wear of SiC whisker- and particulate-reinforced 6061 aluminum alloy composites
|
Yu, S.Y.; Ishii, H.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:24Z |
Effects of post-weld heat treatments on the residual stress and mechanical properties of laser beam welded SAE 4130 steel plates
|
TUNG-HAN CHUANG; Huang, C.C.; Chuang, T.H. |
| 臺大學術典藏 |
2020-05-12T02:53:24Z |
Effects of applied pressure on the brazing of superplastic INCONEL718 superalloy
|
Yeh, M.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:24Z |
Stress corrosion cracking of superplastically formed 7475 aluminum alloy
|
Tsai, T.C.; Chang, J.C.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:24Z |
Effects of post-weld heat treatments on the residual stress and mechanical properties of electron beam welded SAE 4130 steel plates
|
Huang, C.C.; Pan, Y.C.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:23Z |
Relationship between wettability and interfacial reaction for Sn10Ag4Ti on Al2O3 and SiC substrates
|
TUNG-HAN CHUANG; Chuang, T.H.; Weng, W.P.; Chai, Y.H. |
| 臺大學術典藏 |
2020-05-12T02:53:23Z |
Interfacial characteristics for brazing of aluminum matrix composites with Al-12Si filler metals
|
Weng, W.P.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:23Z |
Influence of zr addition on the corrosion behavior of the Ni3AI intermetallic compounds
|
Chang, T.-T.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:23Z |
Discontinuous coarsening of discontinuous precipitates in a Co-6 at.% Mo alloy
|
Lee, S.-L.; Lee, K.-C.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:23Z |
Brazing of aluminum matrix composite with Sn 10 Ag 4 Ti active filler metal
|
TUNG-HAN CHUANG; Chuang, T.H.; Weng, W.P. |
| 臺大學術典藏 |
2020-05-12T02:53:22Z |
Progress on superplasticity and superplastic forming in Taiwan during 1987-1997
|
Huang, J.C.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:22Z |
Stress-corrosion cracking susceptibility of the superplastically formed 5083 aluminum alloy in 3.5 pct NaCl solution
|
Chang, J.C.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:22Z |
Interfacial Reactions between Liquid Indium and Nickel Substrate
|
Tseng, Y.H.; Yeh, M.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:22Z |
Applicability of ultrasonic testing for the determination of volume fraction of particulates in alumina-reinforced aluminum matrix composites
|
Fang, C.-K.; Fang, R.L.; Weng, W.P.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:22Z |
Erosion of SS41 steel by sand blasting
|
Fang, C.-K.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:21Z |
Effects of microstructures on corrosion and stress corrosion behaviors of an Al-12.1 at.% Zn alloy
|
Yeh, M.S.; Tsao, L.C.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:21Z |
Plastic flow behavior during the forging of a 6061 AI/10 Vol Pct Al2O3 (p) composite
|
Yeh, M.S.; Weng, W.P.; Wang, S.C.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:21Z |
The effect of humidity on the erosive wear of 6063 Al alloy
|
Fang, C.-K.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:21Z |
Surface morphologies and erosion rates of metallic building materials after sandblasting
|
Fang, C.-K.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:20Z |
Interfacial reactions between liquid indium and Au-deposited substrates
|
Liu, Y.M.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:20Z |
Degradation of corrosion resistance for Al 5083 alloy after thermal and superplastic forming processes
|
Chang, J.C.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:20Z |
Characterization of alumina ceramics by ultrasonic testing
|
Chang, L.-S.; Chuang, T.-H.; Wei, W.J.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:20Z |
Interfacial reactions between liquid indium and silver substrates
|
Liu, Y.M.; Chen, Y.L.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:20Z |
Interfacial reactions between In10Ag solders and Ag substrates
|
TUNG-HAN CHUANG; Chuang, T.H.; Liu, Y.M. |
| 臺大學術典藏 |
2020-05-12T02:53:19Z |
Corrosion behaviors of Al-Si-Cu-based filler metals and 6061-T6 brazements
|
Su, T.L.; Wang, S.S.; Tsao, L.C.; Chang, S.Y.; Chuang, T.H.; Yeh, M.S.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:19Z |
Corrosion behavior of Al-Si-Cu-(Sn, Zn) brazing filler metals
|
Wang, S.S.; Cheng, M.D.; Tsao, L.C.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:19Z |
AgIn2/Ag2In transformations in an In-49Sn/Ag soldered joint under thermal aging
|
TUNG-HAN CHUANG; Tsao, L.C.; Huang, Y.T.; Chuang, T.H. |
| 臺大學術典藏 |
2020-05-12T02:53:19Z |
Erosion- and wear-corrosion behavior of Fe-Mn-Al alloys in NaC1 solution
|
Huang, H.-H.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:19Z |
Brazeability of the 6061-T6 aluminum alloy with Al-Si-20Cu-based filler metals
|
Tsao, L.C.; Tsai, T.C.; Wu, C.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Interfacial reaction between liquid Sn-20In-2.8Ag solder and Ag substrate
|
Chiang, M.J.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Intermetallic compounds formed at the interface between liquid indium and copper substrates
|
Yu, C.L.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates
|
Chiu, M.Y.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Soldering reactions between In49Sn and Ag thick films
|
Cheng, M.D.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG |
