|
English
|
正體中文
|
简体中文
|
Total items :2815444
|
|
Visitors :
27396506
Online Users :
598
Project Commissioned by the Ministry of Education Project Executed by National Taiwan University Library
|
|
|
Taiwan Academic Institutional Repository >
Browse by Author
|
"tzan s r"
Showing items 1-4 of 4 (1 Page(s) Totally) 1 View [10|25|50] records per page
國立臺灣科技大學 |
2005 |
The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints
|
Huang, M.K.;Lee, C.;Wu, P.L.;Tzan, S.R. |
國立臺灣科技大學 |
2004 |
Failure behavior of small outline J lead/Sn-X (X = AgCu or Pb) solder joints under thermomechanical fatigue test
|
Wu, P.L.;Huang, M.K.;Lee, C.;Tzan, S.R. |
國立臺灣科技大學 |
2004 |
Effects of printed circuit board surface finish and thermomechanical fatigue on the microstructure and mechanical strength of small outline J leads/Sn-X (X = AgCu and Pb) solder joints
|
Wu, P.L.;Huang, M.K.;Lee, C.;Tzan, S.R. |
國立臺灣科技大學 |
2004 |
Effects of different printed-circuit-board surface finishes on the formation and growth of intermetallics at thermomechanically fatigued, small outline J Leads/Sn-Ag-Cu interfaces
|
Wu, P.L.;Huang, M.K.;Lee, C.Y.;Tzan, S.R. |
Showing items 1-4 of 4 (1 Page(s) Totally) 1 View [10|25|50] records per page
|