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| 臺大學術典藏 |
2020-02-19T07:21:41Z |
?H, ??C and ??N backbone and side-chain resonance assignments of a family 36 carbohydrate binding module of xylanase from Paenibacillus campinasensis
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Wang, Yu-Sheng; Ko, Chun-Han; Chang, Hao-Ting; Yang, Kai-Jay; Chen, Yu-Jen; Huang, Shing-Jong; Fang, Pei-Ju; Chang, Chi-Fon; Tzou, Der-Lii M.; HUI-TING CHANG |
| 國立交通大學 |
2019-04-02T06:04:50Z |
A Study on the Plating and Wetting Ability of Ruthenium-Tungsten Multi-layers for Advanced Cu Metallization
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Kuo, Tai-Chen; Su, Yin-Hsien; Lee, Wen-Hsi; Liao, Wei-Hsiang; Wang, Yu-Sheng; Hung, Chi-Cheng; Wang, Ying-Lang |
| 國立暨南國際大學 |
2019 |
Doping Effects of Li-rich Mn-based Oxides Battery Materials
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王裕勝; Wang, Yu-Sheng |
| 國立交通大學 |
2018-08-21T05:54:18Z |
Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaning
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Wei, Kuo-Hsiu; Hung, Chi-Cheng; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立交通大學 |
2018-08-21T05:52:53Z |
Effect of tungsten incorporation in cobalt tungsten alloys as seedless diffusion barrier materials
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Su, Yin-Hsien; Kuo, Tai-Chen; Lee, Wen-Hsi; Wang, Yu-Sheng; Hung, Chi-Cheng; Tseng, Wei-Hsiang; Wei, Kuo-Hsiu; Wang, Ying-Lang |
| 臺大學術典藏 |
2018-06-28T21:15:36Z |
Enhancement of the optical transmission by mixing the metallic and dielectric nanoparticles atop the silicon substrate
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Yeh, Yung-Ming; Wang, Yu-Sheng; Li, Jia-Han; Yeh, Yung-Ming; Wang, Yu-Sheng; Li, Jia-Han |
| 國立交通大學 |
2017-04-21T06:49:59Z |
A study on the plating and wetting ability of ruthenium-tungsten multi-layers for advanced Cu metallization
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Kuo, Tai-Chen; Su, Yin-Hsien; Lee, Wen-Hsi; Liao, Wei-Hsiang; Wang, Yu-Sheng; Hung, Chi-Cheng; Wang, Ying-Lang |
| 國立交通大學 |
2017-04-21T06:48:55Z |
Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaning
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Wei, Kuo-Hsiu; Hung, Chi-Cheng; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立成功大學 |
2016-11-01 |
Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaning
|
Wei, Kuo-Hsiu; Hung, Chi-Cheng; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立成功大學 |
2016-08-16 |
A study on the plating and wetting ability of ruthenium-tungsten multi-layers for advanced Cu metallization
|
Kuo, Tai-Chen; Su, Yin-Hsien; Lee, Wen-Hsi; Liao, Wei-Hsiang; Wang, Yu-Sheng; Hung, Chi-Cheng; Wang, Ying-Lang |
| 亞洲大學 |
2016 |
Role interaction in tourism governance of district office during the structure of regime In Taichung Dajia District Case.
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WANG, YU-SHENG |
| 國立臺灣大學 |
2016 |
微弧氧化加工於鈦金屬鍍膜白色粉末之研究
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王昱勝; Wang, Yu-Sheng |
| 國立交通大學 |
2014-12-08T15:35:19Z |
Evaluating the sensitizing effect on the photocatalytic decoloration of dyes using anatase-TiO2
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Hsiao, Yu-Cheng; Wu, Tsai-Fang; Wang, Yu-Sheng; Hu, Chi-Chang; Huang, Chihpin |
| 國立交通大學 |
2014-12-08T15:33:46Z |
The influence of abrasive particle size in copper chemical mechanical planarization
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Wei, Kuo-Hsiu; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang; Cheng, Yi-Lung |
| 國立交通大學 |
2014-12-08T15:32:22Z |
An electroplating method for copper plane twin boundary manufacturing
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Wang, Yu-Sheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Nian, Jun-Nan; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:29:55Z |
Effects of (002) beta-Ta barrier on copper chemical mechanical polishing behavior
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Wang, Yu-Sheng; Chen, Kei-Wei; Cheng, Min-Yuan; Lee, Wen-Hsi; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:22:20Z |
A Study of Trimethylsilane (3MS) and Tetramethylsilane (4MS) Based alpha-SiCN:H/alpha-SiCO:H Diffusion Barrier Films
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Chen, Sheng-Wen; Wang, Yu-Sheng; Hu, Shao-Yu; Lee, Wen-Hsi; Chi, Chieh-Cheng; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:11:02Z |
Effect of Under-Layer Treatment of Ta/TaN Barrier Film on Corrosion Between Cu Seed and Ta in Chemical-Mechanical-Polishing Slurry
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Lee, Wen-Hsi; Hung, Chi-Cheng; Wang, Yu-Sheng; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立成功大學 |
2014-07-25 |
應用於次世代金屬銅製程鉭/釕/鈷基底多功能阻障層材料電化學及物理特性之研究
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王喻生; Wang, Yu-Sheng |
| 國立成功大學 |
2014-07-09 |
Lightweight and Flexible Reduced Graphene Oxide/Water-Borne Polyurethane Composites with High Electrical Conductivity and Excellent Electromagnetic Interference Shielding Performance
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Hsiao, Sheng-Tsung; Ma, Chen-Chi M.; Liao, Wei-Hao; Wang, Yu-Sheng; Li, Shin-Ming; Huang, Yu-Chin; Yang, Ruey-Bin; Liang, Wen-Fan |
| 國立成功大學 |
2013-10-01 |
An electroplating method for copper plane twin boundary manufacturing
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Wang, Yu-Sheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Nian, Jun-Nan; Wang, Ying-Lang |
| 國立成功大學 |
2013-09 |
The influence of abrasive particle size in copper chemical mechanical planarization
|
Wei, Kuo-Hsiu; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang; Cheng, Yi-Lung |
| 國立成功大學 |
2013-07-30 |
EC-225型機隊對我國搜救效能提升之探討
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王昱昇; Wang, Yu-Sheng |
| 國立成功大學 |
2013-07-07 |
EC-225型機隊對我國搜救效能提升之探討
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王昱昇; Wang, Yu-Sheng |
| 國立成功大學 |
2013-02-01 |
Effects of (002) beta-Ta barrier on copper chemical mechanical polishing behavior
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Wang, Yu-Sheng; Chen, Kei-Wei; Cheng, Min-Yuan; Lee, Wen-Hsi; Wang, Ying-Lang |
Showing items 1-25 of 49 (2 Page(s) Totally)
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