English  |  正體中文  |  简体中文  |  总笔数 :2818750  
造访人次 :  28348363    在线人数 :  384
教育部委托研究计画      计画执行:国立台湾大学图书馆
 		 
搜寻范围 进阶搜寻
臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
关于TAIR
计画说明

浏览
典藏机构
作者
题名
日期
统计图表
机构即时统计
学术趋势

消息
2019臺灣學術機構典藏
研討會
機構典藏系統RC7版本已
發佈

著作权
出版社及期刊政策查询
TAIR著作权会议记录

相关连结
機構典藏計畫網站
ROAR
OpenDOAR
SHERPA
OAIster
JAIRO
Ira
DSPACE
RWWR
臺大學術典藏NTU Scholars
台湾机构典藏 TAIR >  依作者浏览

"wee chin lim"的相关文件

回到依作者浏览
依题名排序 依日期排序

显示项目 1-12 / 12 (共1页)
1 
每页显示[10|25|50]项目

机构 日期 题名 作者
元智大學 2013-11 Assessment of Thermal Impact on Performance of Metamorphic High-Electron-Mobility Transistors on Polymer Substrates Using Flip-Chip-on-Board Technology Ching-Te Wang; Heng-Tung Hsu; Che-Yang Chiang; Edward Yi Chang; Wee-Chin Lim
元智大學 2012-12-04 Impact of Bonding Temperature on the Performance of In0.6Ga0.4As Metamorphic High Electron Mobility Transistor (mHEMT) Device Packaged Using Flip-Chip-on-Board (FCOB) Technology Che-Yang Chiang; Heng-Tung Hsu; Chien-I Kuo; Ching-Te Wang; Wee Chin Lim; Edward Yi Chang
元智大學 2012-12-04 Impact of Bonding Temperature on the Performance of In0.6Ga0.4As Metamorphic High Electron Mobility Transistor (mHEMT) Device Packaged Using Flip-Chip-on-Board (FCOB) Technology Che-Yang Chiang; Heng-Tung Hsu; Chien-I Kuo; Ching-Te Wang; Wee Chin Lim; Edward Yi Chang
元智大學 2011-09 Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate Chin-Te Wang; Chien-I Kuo; Heng-Tung Hsu; Edward Yi Chang; Li-Han Hsu; Wee-Chin Lim; Yasuyuki Miyamoto
元智大學 2011-09 Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate Chin-Te Wang; Chien-I Kuo; Heng-Tung Hsu; Edward Yi Chang; Li-Han Hsu; Wee-Chin Lim; Yasuyuki Miyamoto
元智大學 2011-02 A Flip-Chip Packaged 80-nm In0.7Ga0.3As MHEMT for Millimeter-Wave Low-Noise Applications Chin-Te Wang; Chien-I Kuo; Heng-Tung Hsu; Edward Yi Chang; Li-Han Hsu; Wee-Chin Lim; Che-Yang Chiang; Suz-Ping Tsai; Guo-Wei Huang
元智大學 2011-02 A Flip-Chip Packaged 80-nm In0.7Ga0.3As MHEMT for Millimeter-Wave Low-Noise Applications Chin-Te Wang; Chien-I Kuo; Heng-Tung Hsu; Edward Yi Chang; Li-Han Hsu; Wee-Chin Lim; Che-Yang Chiang; Suz-Ping Tsai; Guo-Wei Huang
元智大學 2010-12 Improvement in RF Performance of 40-nm InAs-Channel Based HEMTs Using Pt Gate Sinking With Two-Step Recess Processes Technology C.I.Kuo; Heng-Tung Hsu; Chien-Ying Wu; E.Y.Chang; Chen-Yu Lin; Wee-Chin Lim
元智大學 2010-12 Improvement in RF Performance of 40-nm InAs-Channel Based HEMTs Using Pt Gate Sinking With Two-Step Recess Processes Technology C.I.Kuo; Heng-Tung Hsu; Chien-Ying Wu; E.Y.Chang; Chen-Yu Lin; Wee-Chin Lim
元智大學 2010-12 Bonding Temperature Effect on the Performance of Flip Chip Assembled 150nm mHEMT Device on Organic Substrate Chien-I Kuo; Wee-Chin Lim; Heng-Tung Hsu; Chin-Te Wang; Li-Han Hsu; Faiz Aizad; Guo-Wei Huang; Yasuyuki Miyamoto; Edward Yi Chang
元智大學 2010-12 Bonding Temperature Effect on the Performance of Flip Chip Assembled 150nm mHEMT Device on Organic Substrate Chien-I Kuo; Wee-Chin Lim; Heng-Tung Hsu; Chin-Te Wang; Li-Han Hsu; Faiz Aizad; Guo-Wei Huang; Yasuyuki Miyamoto; Edward Yi Chang
元智大學 2010-12 Bonding Temperature Effect on the Performance of Flip Chip Assembled 150nm mHEMT Device on Organic Substrate Chien-I Kuo; Wee-Chin Lim; Heng-Tung Hsu; Chin-Te Wang; Li-Han Hsu; Faiz Aizad; Guo-Wei Huang; Yasuyuki Miyamoto; Edward Yi Chang

显示项目 1-12 / 12 (共1页)
1 
每页显示[10|25|50]项目

DSpace Software Copyright © 2002-2004  MIT   &  Hewlett-Packard   /   Enhanced by   NTU Library IR team