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| 國立交通大學 |
2019-04-02T05:59:55Z |
Deposition of indium tin oxide films on polycarbonate substrates by radio-frequency magnetron sputtering
|
Wu, WF; Chiou, BS |
| 國立交通大學 |
2019-04-02T05:58:32Z |
Properties of radio frequency magnetron sputtered silicon dioxide films
|
Wu, WF; Chiou, BS |
| 國立臺灣海洋大學 |
2016 |
Boosted photocatalytic efficiency through plasmonic field confinement with bowtie and diabolo nanostructures under LED irradiation
|
Lee CH;Liao SC;Lin TR;Wang SH;Lai DY;Chiu PK;Lee JW;Wu WF |
| 國立交通大學 |
2014-12-08T15:46:25Z |
Highly (111) textured titanium nitride layers for sub- quarter-micrometer Al metallization
|
Wu, WF; Lin, CC; Huang, CC; Lin, HC; Chang, TC; Yang, RP; Huang, TY |
| 國立交通大學 |
2014-12-08T15:44:33Z |
Effect of aluminum seed layer on the crystallographic texture and electromigration resistance of physical vapor deposited copper interconnect
|
Chin, YL; Chiou, BS; Wu, WF |
| 國立交通大學 |
2014-12-08T15:44:19Z |
Barrier capability of TaNx films deposited by different nitrogen flow rate against Cu diffusion in Cu/TaNx/n(+)-p junction diodes
|
Yang, WL; Wu, WF; Liu, DG; Wu, CC; Ou, KL |
| 國立交通大學 |
2014-12-08T15:42:32Z |
Preventing dielectric damage of low-k organic siloxane by passivation treatment
|
Chang, TC; Mor, YS; Liu, PT; Tsai, TM; Chen, CW; Mei, YJ; Pan, FM; Wu, WF; Sze, SM |
| 國立交通大學 |
2014-12-08T15:42:26Z |
Effect of the tantalum barrier layer on the electromigration and stress migration resistance of physical-vapor-deposited copper interconnect
|
Chin, YL; Chiou, BS; Wu, WF |
| 國立交通大學 |
2014-12-08T15:42:15Z |
Eliminating dielectric degradation of low-k organosilicate glass by trimethylchlorosilane treatment
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Chang, TC; Liu, PT; Mor, YS; Tsai, TM; Chen, CW; Mei, YJ; Pan, FM; Wu, WF; Sze, SM |
| 國立交通大學 |
2014-12-08T15:42:14Z |
Effective repair to ultra-low-k dielectric material (k-2.0) by hexamethyidisilazane treatment
|
Mor, YS; Chang, TC; Liu, PT; Tsai, TM; Chen, CW; Yan, ST; Chu, CJ; Wu, WF; Pan, FM; Lur, W; Sze, SM |
| 國立交通大學 |
2014-12-08T15:42:00Z |
Improved TaN barrier layer against Cu diffusion by formation of an amorphous layer using plasma treatment
|
Ou, KL; Wu, WF; Chou, CP; Chiou, SY; Wu, CC |
| 國立交通大學 |
2014-12-08T15:41:47Z |
Improving the electrical integrity of Cu-CoSi2 contacted n(+)p junction diodes using nitrogen-incorporated Ta films as a diffusion barrier
|
Yang, WL; Wu, WF; You, HC; Ou, KL; Lei, TF; Chou, CP |
| 國立交通大學 |
2014-12-08T15:41:21Z |
Effects of nitrogen plasma treatment on tantalum diffusion barriers in copper metallization
|
Wu, WF; Ou, KL; Chou, CP; Wu, CC |
| 國立交通大學 |
2014-12-08T15:41:19Z |
PECVD-Ti/TiNx barrier with multilayered amorphous structure and high thermal stability for copper metallization
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Wu, WF; Ou, KL; Chou, CP; Hsu, JL |
| 國立交通大學 |
2014-12-08T15:39:18Z |
Influence of N2O plasma treatment on microstructure and thermal stability of WNx barriers for Cu interconnection
|
Tsai, KC; Wu, WF; Chen, JC; Pan, TJ; Chao, CG |
| 國立交通大學 |
2014-12-08T15:38:51Z |
Electromigration and integration aspects for the copper-SiLK system
|
Tseng, HS; Chiou, BS; Wu, WF; Ho, CC |
| 國立交通大學 |
2014-12-08T15:37:09Z |
Numerical and experimental analysis of Cu diffusion in plasma-treated tungsten barrier
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Tsai, KC; Wu, WF; Chen, JC; Pan, TJ; Chao, CG |
| 國立交通大學 |
2014-12-08T15:27:50Z |
FABRICATION AND CHARACTERISTICS OF RF MAGNETRON-SPUTTERED ITO THIN-FILMS
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WU, WF; CHIOU, BS |
| 國立交通大學 |
2014-12-08T15:27:02Z |
Plasma process induced damage in sputtered TiN metal gate capacitors with ultra-thin nitrided oxide
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Chen, CC; Lin, HC; Chang, CY; Chao, TS; Huang, SC; Wu, WF; Huang, TY; Liang, MS |
| 國立交通大學 |
2014-12-08T15:18:43Z |
Novel multilayered Ti/TiN diffusion barrier for Al metallization
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Wu, WF; Tsai, KC; Chao, CG; Chen, JC; Ou, KL |
| 國立交通大學 |
2014-12-08T15:17:54Z |
Carbon nanotubes grown using cobalt silicide as catalyst and hydrogen pretreatment
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Wen, HC; Yang, KH; Ou, KL; Wu, WF; Luo, RC; Chou, CP |
| 國立交通大學 |
2014-12-08T15:17:43Z |
High-reliability Ta2O5 metal-insulator-metal capacitors with Cu-based electrodes
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Tsai, KC; Wu, WF; Chao, CG; Kuan, CP |
| 國立交通大學 |
2014-12-08T15:17:21Z |
Effects of ammonia plasma treatment on the surface characteristics of carbon fibers
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Wen, HC; Yang, K; Ou, KL; Wu, WF; Chou, CP; Luo, RC; Chang, YM |
| 國立交通大學 |
2014-12-08T15:04:43Z |
SIZE EFFECT ON THE ELECTRICAL-CONDUCTION AND NOISE OF RUO2-BASED THICK-FILM RESISTORS
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CHIOU, BS; SHEU, JY; WU, WF |
| 國立交通大學 |
2014-12-08T15:04:24Z |
EFFECT OF ANNEALING ON ELECTRICAL AND OPTICAL-PROPERTIES OF RF MAGNETRON-SPUTTERED INDIUM TIN OXIDE-FILMS
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WU, WF; CHIOU, BS |
Showing items 1-25 of 38 (2 Page(s) Totally)
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