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Institution	Date	Title	Author
國立高雄第一科技大學	2004.04	Thermomechanical Behavior of Underfill/Solder Mask/Substrate Interface UnderThermal Cycling	C.-H.Chien;Y.-C.Chen, C.-C;Hsieh, Y.-T.;Chiou;Y.-D.Wu;Chen, T.-R; 謝其昌

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