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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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2019臺灣學術機構典藏
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Institution Date Title Author
國立高雄第一科技大學 2006.01 Nanoscale deformation measurement by using the hybrid method of gray-level and holographic interferometry C.H.Chien;Y.D.Wu;Y.T.Chiou;C.C.Hsieh;Y.C.Chen;T.P.Chen;M.L.Tsai;C.T.Wang; 謝其昌
國立中山大學 2006 Nanoscale Deformation Measurement using the Gray-level Method by Holographic Interferometry C.H. Chien; Y.D. Wu; Y.T. Chiou; C.C. Hsieh; Y.C. Chen; T.P. Chen; M.L. Tsai; C.T. Wang
國立中山大學 2006 Stability of the warpage in a PBGA package subjected to hygro-thermal loading C.H. Chien; T.P. Chen; Y.C. Chen; Y.T. Chiou; C.C. Hsieh; Y.D. Wu
國立臺灣海洋大學 2006 Relationship bonding tactics, relationship quality and customer behavioral loyalty-behavioral sequence in Taiwan's information services industry W.H. Wang;C.J. Liang;Y.D. Wu
國立高雄第一科技大學 2004.04 Thermomechanical Behavior of Underfill/Solder Mask/Substrate Interface UnderThermal Cycling C.-H.Chien;Y.-C.Chen, C.-C;Hsieh, Y.-T.;Chiou;Y.-D.Wu;Chen, T.-R; 謝其昌
國立中山大學 2004-08 Nanoscale Measurement with Microscale Surface Resolution by Holographic Interferometry C.H. Chien; Y.D. Wu; C.C. Hsieh; Y.C. Chen; T.P. Chen; C.T. Wang
國立中山大學 2004-06-07 Investigations of the Mixed-mode Fracture of IC Package Interfaces C.H. Chien;Y.C. Chen; C.C. Hsieh; M.Y. Huang; Y.D. Wu; T.P. Chen
國立中山大學 2004-06-07 The Effect of Moisture o?n Adhesion Features of the Underfill/solder mask/substrate Joint C.H. Chien; C.C. Hsieh; Y.C. Chen; Y.D. Wu
國立中山大學 2004-05-16 Hygro-Thermal Buckling Of A Thin PBGA Package C.H. Chien; T.P. Chen; Y.T. Chiou; C.C. Hsieh; Y.D. Wu; C.T. Wang
國立中山大學 2004 Thermo-mechanical Behaviors of the Underfill/Solder Mask/Substrate Interface under Thermal Cycling C.H. Chien; Y.C. Chen; C.C. Hsieh; Y.D. Wu; Y.T. Chiou
國立中山大學 2003-06-02 Investigation of the Adhesion Strength of Underfill/Solder Mask/Substrate Joints Under Thermal Cycling C.H. Chien; Y.C. Chen; C.C. Hsieh; Y.D. Wu; Y.T. Chiou
國立中山大學 2003-06 Nano-scale Measurement using the Direct Gray-level Method by Holographic Interferometry C.H. Chien; Y.D. Wu; Y.C. Chen; C.C. Hsieh; Y.T. Chiou
國立中山大學 2003 Influences of the Moisture Absorption on PBGA Package's Warpage During IR Reflow Process C.H. Chien; Y.C. Chen; Y.T. Chiou; T.P. Chen; C.C. Hsieh; J.J. Yan; W.Z. Chen; Y.D. Wu
元培科技大學 2002 The Effect of the Substrate on Response of Thioaromatic Self-assembled Monolayers to Free Radical-dominant Plasma M. C. Wang; J. D. Liao; C. C. Weng; Y. D. Wu; R. Klauser; S. Frey; K. Heister; M. Zharnikov and M. Grunze;
國立中山大學 2002 The Measurement of Interfacial Strength of IC Package by Moire Interferometry C.H. Chien; W.Y. Lin; Y.T. Chiou; C.C. Hsieh; Y.D. Wu
國立中山大學 1993 The Bending Performance of Single Mode Fibers with The Similar Mode Field Diameter and Cutoff Wavelength M.H. Chen;Y.D. Wu;K.C. Huang;S. Chi
國立中山大學 1993 Numerial Study of Waveguide Amplifers M.H. Chen;Y.D. Wu
國立中山大學 1992 Numerical Study of TE Waves Propagating in Multi-Branch Coupers M.H. Chen;Y.D. Wu
國立中山大學 1992 A General Method for Analyzing The Multi-Layer Planar Waveguide M.H. Chen;Y.D. Wu

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