臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
國立高雄第一科技大學	2006.01	Nanoscale deformation measurement by using the hybrid method of gray-level and holographic interferometry	C.H.Chien;Y.D.Wu;Y.T.Chiou;C.C.Hsieh;Y.C.Chen;T.P.Chen;M.L.Tsai;C.T.Wang; 謝其昌
國立中山大學	2006	Nanoscale Deformation Measurement using the Gray-level Method by Holographic Interferometry	C.H. Chien; Y.D. Wu; Y.T. Chiou; C.C. Hsieh; Y.C. Chen; T.P. Chen; M.L. Tsai; C.T. Wang
國立中山大學	2006	Stability of the warpage in a PBGA package subjected to hygro-thermal loading	C.H. Chien; T.P. Chen; Y.C. Chen; Y.T. Chiou; C.C. Hsieh; Y.D. Wu
國立臺灣海洋大學	2006	Relationship bonding tactics, relationship quality and customer behavioral loyalty-behavioral sequence in Taiwan's information services industry	W.H. Wang;C.J. Liang;Y.D. Wu
國立高雄第一科技大學	2004.04	Thermomechanical Behavior of Underfill/Solder Mask/Substrate Interface UnderThermal Cycling	C.-H.Chien;Y.-C.Chen, C.-C;Hsieh, Y.-T.;Chiou;Y.-D.Wu;Chen, T.-R; 謝其昌
國立中山大學	2004-08	Nanoscale Measurement with Microscale Surface Resolution by Holographic Interferometry	C.H. Chien; Y.D. Wu; C.C. Hsieh; Y.C. Chen; T.P. Chen; C.T. Wang
國立中山大學	2004-06-07	Investigations of the Mixed-mode Fracture of IC Package Interfaces	C.H. Chien;Y.C. Chen; C.C. Hsieh; M.Y. Huang; Y.D. Wu; T.P. Chen
國立中山大學	2004-06-07	The Effect of Moisture o?n Adhesion Features of the Underfill/solder mask/substrate Joint	C.H. Chien; C.C. Hsieh; Y.C. Chen; Y.D. Wu
國立中山大學	2004-05-16	Hygro-Thermal Buckling Of A Thin PBGA Package	C.H. Chien; T.P. Chen; Y.T. Chiou; C.C. Hsieh; Y.D. Wu; C.T. Wang
國立中山大學	2004	Thermo-mechanical Behaviors of the Underfill/Solder Mask/Substrate Interface under Thermal Cycling	C.H. Chien; Y.C. Chen; C.C. Hsieh; Y.D. Wu; Y.T. Chiou

Showing items 1-10 of 19 (2 Page(s) Totally)
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