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Showing items 11-19 of 19  (1 Page(s) Totally)
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Institution Date Title Author
國立中山大學 2003-06-02 Investigation of the Adhesion Strength of Underfill/Solder Mask/Substrate Joints Under Thermal Cycling C.H. Chien; Y.C. Chen; C.C. Hsieh; Y.D. Wu; Y.T. Chiou
國立中山大學 2003-06 Nano-scale Measurement using the Direct Gray-level Method by Holographic Interferometry C.H. Chien; Y.D. Wu; Y.C. Chen; C.C. Hsieh; Y.T. Chiou
國立中山大學 2003 Influences of the Moisture Absorption on PBGA Package's Warpage During IR Reflow Process C.H. Chien; Y.C. Chen; Y.T. Chiou; T.P. Chen; C.C. Hsieh; J.J. Yan; W.Z. Chen; Y.D. Wu
元培科技大學 2002 The Effect of the Substrate on Response of Thioaromatic Self-assembled Monolayers to Free Radical-dominant Plasma M. C. Wang; J. D. Liao; C. C. Weng; Y. D. Wu; R. Klauser; S. Frey; K. Heister; M. Zharnikov and M. Grunze;
國立中山大學 2002 The Measurement of Interfacial Strength of IC Package by Moire Interferometry C.H. Chien; W.Y. Lin; Y.T. Chiou; C.C. Hsieh; Y.D. Wu
國立中山大學 1993 The Bending Performance of Single Mode Fibers with The Similar Mode Field Diameter and Cutoff Wavelength M.H. Chen;Y.D. Wu;K.C. Huang;S. Chi
國立中山大學 1993 Numerial Study of Waveguide Amplifers M.H. Chen;Y.D. Wu
國立中山大學 1992 Numerical Study of TE Waves Propagating in Multi-Branch Coupers M.H. Chen;Y.D. Wu
國立中山大學 1992 A General Method for Analyzing The Multi-Layer Planar Waveguide M.H. Chen;Y.D. Wu

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