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"yang cj"
Showing items 21-30 of 56 (6 Page(s) Totally)
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| 中國醫藥大學 |
2015-05 |
Optimal Dose of Benzathine Penicillin G for the Treatment of Early Syphilis in HIV-Infected Patients in the Era of Combination Antiretroviral Therapy
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(Yang, CJ);(Chen, YH);(Tsai, MS);洪健清(Chien-Ching Hung)* |
| 國立交通大學 |
2014-12-08T15:46:51Z |
Formation of silicided shallow p(+) n junctions by BF2+ implantation into thin amorphous-Si or Ni/amorphous-Si films on Si substrates and subsequent Ni silicidation
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Juang, MH; Hu, MC; Yang, CJ |
| 國立交通大學 |
2014-12-08T15:44:45Z |
Turnaround phenomenon of threshold voltage shifts in amorphous silicon thin film transistors under negative bias stress
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Huang, CY; Tsai, JW; Teng, TH; Yang, CJ; Cheng, HC |
| 國立交通大學 |
2014-12-08T15:44:00Z |
Effect of temperature and illumination on the instability of a-Si : H thin-film transistors under AC gate bias stress
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Huang, CY; Teng, TH; Yang, CJ; Tseng, CH; Cheng, HC |
| 國立交通大學 |
2014-12-08T15:43:09Z |
Generalized interconnect delay time and crosstalk models: I. Applications of interconnect optimization design
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Lee, TGY; Tseng, TY; Wong, SC; Yang, CJ; Liang, MS; Cheng, HC |
| 國立交通大學 |
2014-12-08T15:43:09Z |
Generalized interconnect delay time and crosstalk models: II. Crosstalk-induced delay time deterioration and worst crosstalk models
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Lee, TGY; Tseng, TY; Wong, SC; Yang, CJ; Liang, MS; Cheng, HC |
| 國立交通大學 |
2014-12-08T15:40:08Z |
Electromigration study in SnAg3.8Cu0.7 solder joints on Ti/Cr-Cu/Cu under-bump metallization
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Hsu, YC; Shao, TL; Yang, CJ; Chen, C |
| 國立交通大學 |
2014-12-08T15:38:45Z |
Microstructure evolution during electromigration in eutectic SnPb solder bumps
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Lu, CM; Shao, TL; Yang, CJ; Chen, C |
| 國立交通大學 |
2014-12-08T15:18:58Z |
The performance of the number of vehicles in a dynamic connecting transport AMHS
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Lin, JT; Wang, FK; Yang, CJ |
| 國立交通大學 |
2014-12-08T15:16:36Z |
Trench gap-tilling copper by ion beam sputter deposition
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Han, S; Lee, TL; Yang, CJ; Shih, HC |
Showing items 21-30 of 56 (6 Page(s) Totally)
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